PROCEEDINGS VOLUME 5262
PHOTONICS TECHNOLOGIES FOR ROBOTICS, AUTOMATION, AND MANUFACTURING | 27-31 OCTOBER 2003
Environmentally Conscious Manufacturing III
IN THIS VOLUME

0 Sessions, 27 Papers, 0 Presentations
Disassembly  (4)
Supply Chain  (5)
Potpourri  (2)
PHOTONICS TECHNOLOGIES FOR ROBOTICS, AUTOMATION, AND MANUFACTURING
27-31 October 2003
Providence, RI, United States
Product Recovery
Proc. SPIE 5262, Reusing single-use devices in hospitals: a case study, 0000 (27 February 2004); doi: 10.1117/12.516139
Proc. SPIE 5262, Evaluation of trade-offs in costs and environmental impacts for returnable packaging implementation, 0000 (27 February 2004); doi: 10.1117/12.516151
Product Recovery and End-of-Life Management
Proc. SPIE 5262, A fuzzy cost-benefit function to select economical products for processing in a closed-loop supply chain, 0000 (27 February 2004); doi: 10.1117/12.516189
Environmental Modeling
Proc. SPIE 5262, Use of data envelopment analysis for product recovery, 0000 (27 February 2004); doi: 10.1117/12.516530
Product Recovery
Proc. SPIE 5262, Optimal control of a remanufacturing system with consideration for product life cycle, 0000 (27 February 2004); doi: 10.1117/12.516760
Product Recovery and End-of-Life Management
Proc. SPIE 5262, Optimizing decision making at the end of life of a product, 0000 (27 February 2004); doi: 10.1117/12.515493
Proc. SPIE 5262, Disassembly analysis before assembly, 0000 (27 February 2004); doi: 10.1117/12.516757
Disassembly
Proc. SPIE 5262, Disassembly line balancing with limited supply and subassembly availability, 0000 (27 February 2004); doi: 10.1117/12.516073
Proc. SPIE 5262, 2-opt heuristic for the disassembly line balancing problem, 0000 (27 February 2004); doi: 10.1117/12.516155
Proc. SPIE 5262, Multikanban model for disassembly line with demand fluctuation, 0000 (27 February 2004); doi: 10.1117/12.516202
Proc. SPIE 5262, Simulation-based disassembly systems design, 0000 (27 February 2004); doi: 10.1117/12.516427
Supply Chain
Proc. SPIE 5262, Policy design in closed-loop supply chains for the integrated management of component recycling and spare parts supply in the electronics industry, 0000 (27 February 2004); doi: 10.1117/12.515287
Proc. SPIE 5262, Integration of service providers into supply chain services and waste disposal transports, 0000 (27 February 2004); doi: 10.1117/12.516076
Proc. SPIE 5262, Evaluation of production facilities in a closed-loop supply chain: a fuzzy TOPSIS approach, 0000 (27 February 2004); doi: 10.1117/12.516172
Proc. SPIE 5262, Identification of potential recovery facilities for designing a reverse supply chain network using physical programming, 0000 (27 February 2004); doi: 10.1117/12.516197
Proc. SPIE 5262, Green supply chain management in China, 0000 (27 February 2004); doi: 10.1117/12.518655
Green Manufacturing
Proc. SPIE 5262, Innovative practices in environmental management, 0000 (27 February 2004); doi: 10.1117/12.515875
Proc. SPIE 5262, Environmentally conscious patent histories, 0000 (27 February 2004); doi: 10.1117/12.516087
Environmental Issues
Proc. SPIE 5262, Improving environmental impact and cost assessment for supplier evaluation, 0000 (27 February 2004); doi: 10.1117/12.516591
Proc. SPIE 5262, Environmental benchmarking of the largest fossil-fueled electricity generating plants in the U.S., 0000 (27 February 2004); doi: 10.1117/12.518791
Environmental Modeling
Proc. SPIE 5262, Web-based expert system for foundry pollution prevention, 0000 (27 February 2004); doi: 10.1117/12.514931
Proc. SPIE 5262, A methodology to incorporate life cycle analysis and the triple bottom line mechanism for sustainable management of industrial enterprises, 0000 (27 February 2004); doi: 10.1117/12.516027
Proc. SPIE 5262, Development and weighting of a life cycle assessment screening model, 0000 (27 February 2004); doi: 10.1117/12.516201
Product Recovery and End-of-Life Management
Proc. SPIE 5262, Second-hand market as an alternative in reverse logistics, 0000 (27 February 2004); doi: 10.1117/12.516226
Environmental Modeling
Proc. SPIE 5262, Solving a layout design problem by analytic hierarchy process (AHP) and data envelopment analysis (DEA) approach, 0000 (27 February 2004); doi: 10.1117/12.518054
Potpourri
Proc. SPIE 5262, Knowledge and decision support management in the circular flow economy, 0000 (27 February 2004); doi: 10.1117/12.516101
Proc. SPIE 5262, Pollution prevention applications in batch manufacturing operations, 0000 (27 February 2004); doi: 10.1117/12.516187
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