PROCEEDINGS VOLUME 5274
MICROELECTRONICS, MEMS, AND NANOTECHNOLOGY | 10-12 DECEMBER 2003
Microelectronics: Design, Technology, and Packaging
Proceedings Volume 5274 is from: Logo
MICROELECTRONICS, MEMS, AND NANOTECHNOLOGY
10-12 December 2003
Perth, Australia
Wireless I
Proc. SPIE 5274, A new communication system design of M-ary PPM UWB suitable to FCC signal spectrum, 0000 (30 March 2004); doi: 10.1117/12.528242
Proc. SPIE 5274, Rapid prototyping of 802.11 wireless modems, 0000 (30 March 2004); doi: 10.1117/12.530985
Proc. SPIE 5274, A 1-GHz differential second-order low-pass sigma-delta modulator in CMOS for wireless receivers, 0000 (30 March 2004); doi: 10.1117/12.521414
Proc. SPIE 5274, Integrated CMOS RF building blocks for 433-MHz sensor systems, 0000 (30 March 2004); doi: 10.1117/12.522760
Advanced IC Technology and Packaging
Proc. SPIE 5274, Gate-leakage-tolerant circuits in deep sub-100-nm CMOS technologies, 0000 (30 March 2004); doi: 10.1117/12.530278
Proc. SPIE 5274, AC-coupled interconnect for high-density high-bandwidth packaging, 0000 (30 March 2004); doi: 10.1117/12.528076
Proc. SPIE 5274, A new domino failure mechanism in deep sub-100-nm technologies and its solution, 0000 (30 March 2004); doi: 10.1117/12.530274
Wireless II
Proc. SPIE 5274, Quasi-3D modeling, design, and analysis of symmetric on-chip inductors in silicon-on-sapphire technology, 0000 (30 March 2004); doi: 10.1117/12.522049
Proc. SPIE 5274, The design of a broadband microstrip patch sensor for high-frequency remote sensing operations, 0000 (30 March 2004); doi: 10.1117/12.524301
Proc. SPIE 5274, 2D scanning Rotman lens structure for smart collision avoidance sensors, 0000 (30 March 2004); doi: 10.1117/12.527948
Proc. SPIE 5274, Dynamic analysis of a UMTS baseband reconfigurable digital filter, 0000 (30 March 2004); doi: 10.1117/12.530403
Proc. SPIE 5274, Improved techniques for monitoring the HF spectrum, 0000 (30 March 2004); doi: 10.1117/12.529878
Proc. SPIE 5274, Finite element simulations of stacked crystal filters, 0000 (30 March 2004); doi: 10.1117/12.522915
Proc. SPIE 5274, A tri-mode 802.11 baseband PHY mixed signal integrated circuit in 0.13-um CMOS, 0000 (30 March 2004); doi: 10.1117/12.531439
Memory
Proc. SPIE 5274, QsRAM: the new memory technology, 0000 (30 March 2004); doi: 10.1117/12.531136
Proc. SPIE 5274, Ultralow-power ferroelectric memory for SoC, 0000 (30 March 2004); doi: 10.1117/12.530438
Sensors and Display Devices I
Proc. SPIE 5274, A 64 x 64 CMOS digital pixel array based on pulse-width analog-to-digital conversion with on-chip linearizing circuit, 0000 (30 March 2004); doi: 10.1117/12.525558
Proc. SPIE 5274, Y2O3-based oxide phosphor thin film electroluminescent devices, 0000 (30 March 2004); doi: 10.1117/12.521582
Sensors and Display Devices II
Proc. SPIE 5274, Characterization of crosstalk in HgCdTe n-on-p photovoltaic infrared arrays, 0000 (30 March 2004); doi: 10.1117/12.522217
Proc. SPIE 5274, High-speed high-sensitivity low-noise scientific CMOS image sensors, 0000 (30 March 2004); doi: 10.1117/12.522981
Proc. SPIE 5274, On-chip skin color detection using a triple-well CMOS process, 0000 (30 March 2004); doi: 10.1117/12.522854
Proc. SPIE 5274, Accurate determination of composition profiles in abrupt MBE-grown HgCdTe heterostructures, 0000 (30 March 2004); doi: 10.1117/12.522840
Proc. SPIE 5274, The active microbolometer: a new concept in infrared detection, 0000 (30 March 2004); doi: 10.1117/12.530832
Proc. SPIE 5274, Practical hot-wire anemometer excitation modes, 0000 (30 March 2004); doi: 10.1117/12.530270
Microphotonic Devices
Proc. SPIE 5274, Microphotonics systems: life beyond microelectronics, 0000 (30 March 2004); doi: 10.1117/12.529781
Proc. SPIE 5274, Differential optoelectronic subtractor using self electro-optic effect devices for use in sigma-delta modulation, 0000 (30 March 2004); doi: 10.1117/12.523261
Analog
Proc. SPIE 5274, A hysteretic comparator’s influence on a current-mode ADC, 0000 (30 March 2004); doi: 10.1117/12.522859
Proc. SPIE 5274, Performance analysis of high-accuracy CMOS sample-and-hold circuits, 0000 (30 March 2004); doi: 10.1117/12.530415
Proc. SPIE 5274, Differentiators for insect vision motion detection, 0000 (30 March 2004); doi: 10.1117/12.530180
Proc. SPIE 5274, Control unit implementation for a reconfigurable ADC, 0000 (30 March 2004); doi: 10.1117/12.530150
Design Issues
Proc. SPIE 5274, Egret: a platform for a reconfigurable system-on-chip, 0000 (30 March 2004); doi: 10.1117/12.523331
Simulation, Measurement, and Testing I
Proc. SPIE 5274, Harmonic distortion produced by cascaded delay elements, 0000 (30 March 2004); doi: 10.1117/12.522843
Proc. SPIE 5274, Process management and design for MEMS and microelectronics technologies, 0000 (30 March 2004); doi: 10.1117/12.522882
Proc. SPIE 5274, Determination of junction depth and related current phenomena using laser-beam-induced current, 0000 (30 March 2004); doi: 10.1117/12.523536
Proc. SPIE 5274, IP validation in remote microelectronics testing, 0000 (30 March 2004); doi: 10.1117/12.523540
Simulation, Measurement, and Testing II
Proc. SPIE 5274, Numerical analysis of the process-induced stresses in silicon microstructures, 0000 (30 March 2004); doi: 10.1117/12.524228
Proc. SPIE 5274, Signal analysis of accelerometry data using gravity-based modeling, 0000 (30 March 2004); doi: 10.1117/12.530184
Proc. SPIE 5274, A modular integrated platform for microsensor applications, 0000 (30 March 2004); doi: 10.1117/12.530189
Digital Design
Proc. SPIE 5274, Sub-5.5 FO4 delay CMOS 64-bit domino/threshold logic adder design, 0000 (30 March 2004); doi: 10.1117/12.524776
Proc. SPIE 5274, Comparative study on low-power high-performance standard-cell flip-flops, 0000 (30 March 2004); doi: 10.1117/12.530225
Poster Session
Proc. SPIE 5274, Diode UV detectors using oxide semiconductor thin films deposited by magnetron sputtering, 0000 (30 March 2004); doi: 10.1117/12.521590
Proc. SPIE 5274, InGaP/InGaAs quantum-well delta-doped-channel field-effect transistor, 0000 (30 March 2004); doi: 10.1117/12.522021
Proc. SPIE 5274, Comparison between conductometric and layered SAW hydrogen gas sensor, 0000 (30 March 2004); doi: 10.1117/12.522224
Proc. SPIE 5274, DC characterization of an InP/InGaAs tunneling emitter bipolar transistor (TEBT), 0000 (30 March 2004); doi: 10.1117/12.522232
Proc. SPIE 5274, The effects of vacuum baking on the I-V characteristics of LWIR HgCdTe photodiodes, 0000 (30 March 2004); doi: 10.1117/12.522262
Proc. SPIE 5274, On-chip interconnect schemes for reconfigurable system-on-chip, 0000 (30 March 2004); doi: 10.1117/12.523334
Proc. SPIE 5274, Interfacing methodologies for IP re-use in reconfigurable system-on-chip, 0000 (30 March 2004); doi: 10.1117/12.523336
Proc. SPIE 5274, Hardware support for a real-time reconfigurable system-on-chip, 0000 (30 March 2004); doi: 10.1117/12.523332
Sensors and Display Devices I
Proc. SPIE 5274, Magnetoresistance characteristics of gamma-irradiated Al0.35Ga0.65N/GaN HFETs, 0000 (30 March 2004); doi: 10.1117/12.527255
Poster Session
Proc. SPIE 5274, A new user-assisted segmentation and tracking technique for an object-based video editing system, 0000 (30 March 2004); doi: 10.1117/12.528246
Proc. SPIE 5274, MPLS switch architecture supporting Diffserv for high-speed switching and QoS, 0000 (30 March 2004); doi: 10.1117/12.528585
Proc. SPIE 5274, The concept of field emission devices construction on the basis of self-assembling nanostructures, 0000 (30 March 2004); doi: 10.1117/12.529927
Proc. SPIE 5274, Dependence of barrier height and effective electron mass on gate oxide thickness and nitrogen concentration at SiOxNy /Si interface, 0000 (30 March 2004); doi: 10.1117/12.529969
Proc. SPIE 5274, Pseudo-exhaustive testing using t-distribution, 0000 (30 March 2004); doi: 10.1117/12.530135
Proc. SPIE 5274, Subband image encoder using discrete wavelet transform, 0000 (30 March 2004); doi: 10.1117/12.530149
Proc. SPIE 5274, InGaP/GaAs HBT grown by solid-source molecular-beam epitaxy with a GaP decomposition source, 0000 (30 March 2004); doi: 10.1117/12.530182
Proc. SPIE 5274, A home-baked temperature-compensated integrated light sensor on silicon, 0000 (30 March 2004); doi: 10.1117/12.530191