PROCEEDINGS VOLUME 5276
MICROELECTRONICS, MEMS, AND NANOTECHNOLOGY | 10-12 DECEMBER 2003
Device and Process Technologies for MEMS, Microelectronics, and Photonics III
IN THIS VOLUME

0 Sessions, 64 Papers, 0 Presentations
Materials I  (4)
Materials II  (5)
Proceedings Volume 5276 is from: Logo
MICROELECTRONICS, MEMS, AND NANOTECHNOLOGY
10-12 December 2003
Perth, Australia
Materials I
Proc. SPIE 5276, Fabrication of micromachined ceramic thin-film-type pressure sensors for overpressure tolerance and its characteristics, 0000 (2 April 2004); doi: 10.1117/12.522876
Proc. SPIE 5276, Ferromagnetism in transition metal-implanted titanium dioxide films, 0000 (2 April 2004); doi: 10.1117/12.530435
Proc. SPIE 5276, The use of titanium and titanium dioxide as masks for deep silicon etching, 0000 (2 April 2004); doi: 10.1117/12.522845
Proc. SPIE 5276, Laser patterning of thin films of TiNiPd deposited on silicon substrate, 0000 (2 April 2004); doi: 10.1117/12.522911
Characterization I
Proc. SPIE 5276, Investigations of ohmic contacts to reactive ion-etched p-type GaN, 0000 (2 April 2004); doi: 10.1117/12.523252
Proc. SPIE 5276, Loop closure theory in deriving linear and simple kinematic model for a 3 DOF parallel micromanipulator, 0000 (2 April 2004); doi: 10.1117/12.522258
Proc. SPIE 5276, A simple and efficient dynamic modeling method for compliant micropositioning mechanisms using flexure hinges, 0000 (2 April 2004); doi: 10.1117/12.523573
Proc. SPIE 5276, Performance of a novel non-planar diaphragm and its application to optical sensing devices, 0000 (2 April 2004); doi: 10.1117/12.521287
Fabrication I
Proc. SPIE 5276, An investigation of SU-8 resist adhesion in deep x-ray lithography of high-aspect-ratio structures, 0000 (2 April 2004); doi: 10.1117/12.521170
Proc. SPIE 5276, Effect of plume dynamics on the uniformity of excimer laser ablation for microfabrication, 0000 (2 April 2004); doi: 10.1117/12.529651
Proc. SPIE 5276, Manufacturing microdroplet generators with Laser-LIGA technique, 0000 (2 April 2004); doi: 10.1117/12.522744
Proc. SPIE 5276, Quartz crystal microbalance coated with poly-L-proline self-assembly layer to detect organic gases, 0000 (2 April 2004); doi: 10.1117/12.522746
Proc. SPIE 5276, Design, modeling, and fabrication of piezoelectric polymer actuators, 0000 (2 April 2004); doi: 10.1117/12.527885
Fabrication II
Proc. SPIE 5276, Novel low temperature CMOS compatible full wafer bonding process for the fabrication of 3D embedded microchannels using SU-8, 0000 (2 April 2004); doi: 10.1117/12.522287
Proc. SPIE 5276, Secret of formulating a selective etching or cleaning solution for boron nitride (BN) thin film, 0000 (2 April 2004); doi: 10.1117/12.522936
Proc. SPIE 5276, A comparison of two multilayer microcoil fabrication techniques, 0000 (2 April 2004); doi: 10.1117/12.522929
Proc. SPIE 5276, Patterning of SU-8 resist structures using CF4, 0000 (2 April 2004); doi: 10.1117/12.523903
Materials II
Proc. SPIE 5276, Cooling a nanomechanical resonator using feedback: toward quantum behavior, 0000 (2 April 2004); doi: 10.1117/12.522091
Proc. SPIE 5276, Characterization of thin metal oxide films grown by atomic layer deposition, 0000 (2 April 2004); doi: 10.1117/12.524052
Proc. SPIE 5276, Quantum electro-mechanical systems (QEMS), 0000 (2 April 2004); doi: 10.1117/12.522241
Proc. SPIE 5276, Encapsulation of nanoparticles for the manufacture of solid state lighting devices, 0000 (2 April 2004); doi: 10.1117/12.522924
Proc. SPIE 5276, Selective wet-etching of filtered arc deposited TiN films on Cr sacrificial layers, 0000 (2 April 2004); doi: 10.1117/12.524048
Characterization II
Proc. SPIE 5276, MEMS micromirrors for optical switching in multichannel spectrophotometers, 0000 (2 April 2004); doi: 10.1117/12.521155
Poster Session
Proc. SPIE 5276, Phase differential angular rate sensor: concept and analysis, 0000 (2 April 2004); doi: 10.1117/12.521563
Proc. SPIE 5276, Three-dimensional numerical simulations of synthetic jet actuator flows in a microchannel, 0000 (2 April 2004); doi: 10.1117/12.521732
Characterization II
Proc. SPIE 5276, Large-output-force out-of-plane MEMS actuator array, 0000 (2 April 2004); doi: 10.1117/12.521842
Proc. SPIE 5276, Single-spin measurement by magnetic resonance force microscopy: effects of measurement device, thermal noise, and spin relaxation, 0000 (2 April 2004); doi: 10.1117/12.522234
Proc. SPIE 5276, Anodic bond characteristics of Si-wafer and MLCA using Pyrex #7740 glass intermediate layer, 0000 (2 April 2004); doi: 10.1117/12.522858
Fabrication III
Proc. SPIE 5276, How to prevent a runaway chemical reaction in the isotropic etching of silicon with HF/HNO3/CH3COOH or HNA solution, 0000 (2 April 2004); doi: 10.1117/12.522944
Proc. SPIE 5276, Reflowed sol-gel microlens for coupling a laser diode and a single-mode fiber with high efficiency: a cost-effective and high-volume fabrication solution, 0000 (2 April 2004); doi: 10.1117/12.521863
Proc. SPIE 5276, Investigation of sample behaviors inside on-chip electrophoresis microcapillary using confocal laser scanning microscopy, 0000 (2 April 2004); doi: 10.1117/12.522260
Fabrication IV
Proc. SPIE 5276, Atomic layer deposition (ALD) of TiO2 and Al2O3 thin films on silicon, 0000 (2 April 2004); doi: 10.1117/12.531795
Proc. SPIE 5276, LIGA for Boomerang, 0000 (2 April 2004); doi: 10.1117/12.532759
Proc. SPIE 5276, Optically variable devices fabricated by electron beam lithography, 0000 (2 April 2004); doi: 10.1117/12.522288
Proc. SPIE 5276, Bi-Ti-O thin films for piezoelectric pressure sensors, 0000 (2 April 2004); doi: 10.1117/12.522281
Poster Session
Proc. SPIE 5276, Two-way actuation of bilayer cantilever of nickel titanium and silicon nitride thin films by shape memory effect and stress relaxation, 0000 (2 April 2004); doi: 10.1117/12.521412
Proc. SPIE 5276, Identification and elimination of trench crystal defects in sub-0.13-um era, 0000 (2 April 2004); doi: 10.1117/12.521724
Proc. SPIE 5276, Lens design issues for the optical structure of a holographic free space optical switch, 0000 (2 April 2004); doi: 10.1117/12.522013
Proc. SPIE 5276, Fabrication of thin-film transistors on plastic substrates by spin etching and device transfer process, 0000 (2 April 2004); doi: 10.1117/12.522034
Proc. SPIE 5276, Comprehensive analysis of InGaP/GaAs heterojunction bipolar transistors (HBTs) with different thickness of setback layers, 0000 (2 April 2004); doi: 10.1117/12.522286
Proc. SPIE 5276, Mass-production fabrication of miniaturized plastic chip devices for biochemical applications, 0000 (2 April 2004); doi: 10.1117/12.522747
Proc. SPIE 5276, Formation and its characteristics of PLZT layered film structure for transducers, 0000 (2 April 2004); doi: 10.1117/12.522794
Proc. SPIE 5276, Apparent positive resistance and temperature effect on I-V characteristics of RTD, 0000 (2 April 2004); doi: 10.1117/12.522799
Proc. SPIE 5276, Preparation of PZT films derived by hybrid processing for MEMS application, 0000 (2 April 2004); doi: 10.1117/12.522807
Proc. SPIE 5276, Electrochromic sensor using porphyrins thin films to detect chlorine, 0000 (2 April 2004); doi: 10.1117/12.522857
Proc. SPIE 5276, High-aspect-ratio fabrications of micro journal air bearings for micro gas turbine engine, 0000 (2 April 2004); doi: 10.1117/12.522918
Proc. SPIE 5276, Chemical structure of low-temperature plasma-deposited silicon nitride thin films, 0000 (2 April 2004); doi: 10.1117/12.523243
Characterization II
Proc. SPIE 5276, Influence of synthetic jet location on boundary layer separation control, 0000 (2 April 2004); doi: 10.1117/12.523270
Poster Session
Proc. SPIE 5276, A novel bistable thermally actuated snap-through actuator for out-of-plane deflection, 0000 (2 April 2004); doi: 10.1117/12.523272
Proc. SPIE 5276, Determination of residual stress in low-temperature PECVD silicon nitride thin films, 0000 (2 April 2004); doi: 10.1117/12.523327
Proc. SPIE 5276, A novel 2D MEMS-based optical crossconnect with greatly reduced complexity, 0000 (2 April 2004); doi: 10.1117/12.523333
Proc. SPIE 5276, New method of vibration isolation of scanning electron microscope, 0000 (2 April 2004); doi: 10.1117/12.523556
Proc. SPIE 5276, Area-changed capacitive accelerometer using 3-mask fabrication process, 0000 (2 April 2004); doi: 10.1117/12.523631
Proc. SPIE 5276, Micromachined crystal plane on (100) and (110) silicon for optical mirror applications, 0000 (2 April 2004); doi: 10.1117/12.524761
Proc. SPIE 5276, Development of surface connectors for microfluidic systems, 0000 (2 April 2004); doi: 10.1117/12.525278
Proc. SPIE 5276, Down conversion of high-energy photons in anatase-based TiO2 solar cells, 0000 (2 April 2004); doi: 10.1117/12.530167
Proc. SPIE 5276, MEMS components for front end of direct conversion receiver architecture, 0000 (2 April 2004); doi: 10.1117/12.530186