Laser Nanofabrication I
Proc. SPIE 5339, Replication of microstructures in polymers using laser-fabricated glass-ceramic stamps, 0000 (15 July 2004); doi: 10.1117/12.537860
Proc. SPIE 5339, Generation of uniformly spaced and nanosized structures by interfering femtosecond laser beams, 0000 (15 July 2004); doi: 10.1117/12.531639
Laser Nanofabrication II
Proc. SPIE 5339, Laser processing with colloid monolayers, 0000 (15 July 2004); doi: 10.1117/12.538908
Proc. SPIE 5339, Micromachining of carbon nanocomposites with Nd:YAG and Nd:YVO4 frequency-converted solid-state lasers, 0000 (15 July 2004); doi: 10.1117/12.528338
Fundamentals I: Ultrafast Lasers
Proc. SPIE 5339, Short and ultrashort laser pulses: an upcoming tool for processing optical and semiconductor materials, 0000 (15 July 2004); doi: 10.1117/12.541437
Proc. SPIE 5339, Fundamental aspects in machining of metals with short and ultrashort laser pulses, 0000 (15 July 2004); doi: 10.1117/12.541434
Proc. SPIE 5339, Study of semiconductor micromachining using diode-pumped solid state lasers, 0000 (15 July 2004); doi: 10.1117/12.529698
Proc. SPIE 5339, Analysis of thermal damage in bulk silicon with femtosecond laser micromachining, 0000 (15 July 2004); doi: 10.1117/12.529218
Proc. SPIE 5339, Nanoparticle size reduction during laser ablation in aqueous solutions of cyclodextrins, 0000 (15 July 2004); doi: 10.1117/12.525499
Fundamentals II: Laser Modification
Proc. SPIE 5339, Laser-induced bandgap engineering for multicolor detection with a GaAs/AlGaAs quantum well infrared photodetector, 0000 (15 July 2004); doi: 10.1117/12.538369
Proc. SPIE 5339, Laser-induced modification of the optical properties of transparent materials, 0000 (15 July 2004); doi: 10.1117/12.537599
Photonics Microfabrication I: Surface Milling
Proc. SPIE 5339, Surface microfabrication of fused silica glass by UV laser irradiation, 0000 (15 July 2004); doi: 10.1117/12.529864
Proc. SPIE 5339, Laser micromachining of high-density optical structures on large substrates, 0000 (15 July 2004); doi: 10.1117/12.537827
Proc. SPIE 5339, F2-laser microfabrication of efficient diffractive optical phase elements, 0000 (15 July 2004); doi: 10.1117/12.537981
Proc. SPIE 5339, Laser-based micro alignment for fabrication of highly precise 2D fiber collimator arrays, 0000 (15 July 2004); doi: 10.1117/12.529072
Photonics Microfabrication II: Lasers Modification
Proc. SPIE 5339, Simultaneous direct UV writing of channel waveguide and Bragg grating structures, 0000 (15 July 2004); doi: 10.1117/12.537944
Proc. SPIE 5339, High-speed fabrication of optical waveguides inside glasses using a high repetition-rate fiber CPA system, 0000 (15 July 2004); doi: 10.1117/12.537370
Proc. SPIE 5339, Femtosecond direct-writing of waveguide in non-oxide glasses, 0000 (15 July 2004); doi: 10.1117/12.538483
Proc. SPIE 5339, 3D patterning method in femtosecond laser microprocessing using diffractive optical elements, 0000 (15 July 2004); doi: 10.1117/12.524086
Bio-Device Microfabrication
Proc. SPIE 5339, Manufacturing by laser direct-write of three-dimensional devices containing optical and microfluidic networks, 0000 (15 July 2004); doi: 10.1117/12.533540
Proc. SPIE 5339, Fabrication of microreactors in photostructurable glass by 3D femtosecond laser direct write, 0000 (15 July 2004); doi: 10.1117/12.531630
Proc. SPIE 5339, Cell/surface interactions on laser-micro-textured titanium-coated silicon surfaces, 0000 (15 July 2004); doi: 10.1117/12.531643
Emerging Industry Applications
Proc. SPIE 5339, Ultrafast laser applications in semiconductor industry, 0000 (15 July 2004); doi: 10.1117/12.529794
Proc. SPIE 5339, Scribing of thin sapphire substrates with a 266-nm Q-switched solid state laser, 0000 (15 July 2004); doi: 10.1117/12.529613
Proc. SPIE 5339, Analysis of debris generated during UV laser micro-machining of silicon, 0000 (15 July 2004); doi: 10.1117/12.529248
Microelectronic Processing
Proc. SPIE 5339, Laser micromachining in microelectronic industry by water-jet-guided laser, 0000 (15 July 2004); doi: 10.1117/12.529047
Proc. SPIE 5339, Modeling the laser-induced diffusible resistance process, 0000 (15 July 2004); doi: 10.1117/12.525512
Proc. SPIE 5339, Single-pulse microvia drilling of resin-coated copper substrates using an enhanced peak power planar waveguide CO2 laser, 0000 (15 July 2004); doi: 10.1117/12.532310
Proc. SPIE 5339, Solid state pulsed high-repetition-rate excimer lasers, 0000 (15 July 2004); doi: 10.1117/12.525458
Laser Direct Write
Proc. SPIE 5339, Laser fabrication of GPS conformal antennas, 0000 (15 July 2004); doi: 10.1117/12.532005
Proc. SPIE 5339, Laser-micromachined defect arrays for DC potential drop fatigue studies, 0000 (15 July 2004); doi: 10.1117/12.537794
Proc. SPIE 5339, Evaporation and phase explosion during laser-induced forward transfer of aluminum, 0000 (15 July 2004); doi: 10.1117/12.537566
Proc. SPIE 5339, Thermal mechanisms of laser micromachining of indium tin oxide, 0000 (15 July 2004); doi: 10.1117/12.529830
Proc. SPIE 5339, Creating 3D structures with a direct-write grayscale photomask made from Sn/In bimetallic films, 0000 (15 July 2004); doi: 10.1117/12.529492
Pulsed Laser Deposition
Proc. SPIE 5339, Model for the expansion dynamics of the laser-induced plasma and fabrication of erbium-doped planar waveguides by pulsed laser deposition and laser micromachining for up-conversion applications, 0000 (15 July 2004); doi: 10.1117/12.528960
Proc. SPIE 5339, Dye-sensitized solar cells using laser processing technologies, 0000 (15 July 2004); doi: 10.1117/12.537903
Proc. SPIE 5339, Nanoparticle-assisted laser ablation deposition of nanostructured ZnO crystals, 0000 (15 July 2004); doi: 10.1117/12.529856
Proc. SPIE 5339, The formation of GaAs/Si photodiodes by pulsed-laser deposition, 0000 (15 July 2004); doi: 10.1117/12.528546
Poster Session
Proc. SPIE 5339, Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation, 0000 (15 July 2004); doi: 10.1117/12.531677
Proc. SPIE 5339, Nanosecond laser silicon micromachining, 0000 (15 July 2004); doi: 10.1117/12.529442
Proc. SPIE 5339, Laser dicing of silicon and composite semiconductor materials, 0000 (15 July 2004); doi: 10.1117/12.529038
Photonics Microfabrication I: Surface Milling
Proc. SPIE 5339, Efficient pocketing simulation model for solid state laser micromachining and its application to a sol-gel material, 0000 (15 July 2004); doi: 10.1117/12.531356
Poster Session
Proc. SPIE 5339, Stoichiometric and structural properties of pulsed-laser deposited BaTiO3 thin films on silicon, 0000 (15 July 2004); doi: 10.1117/12.525456
Proc. SPIE 5339, Real-time precision displacement measurement interferometer using the robust discrete time Kalman filter, 0000 (15 July 2004); doi: 10.1117/12.526563
Proc. SPIE 5339, Sensor for monitoring plasma parameters, 0000 (15 July 2004); doi: 10.1117/12.528991
Microelectronic Processing
Proc. SPIE 5339, Laser modification of structure and properties of glass-ceramics, 0000 (15 July 2004); doi: 10.1117/12.543047
Micromachining of Microelectronic Components and Systems
Proc. SPIE 5339, Pulse shaping for microcutting applications of metals with fiber lasers, 0000 (15 July 2004); doi: 10.1117/12.541435
Laser-Based Welding for Micro-Packaging
Proc. SPIE 5339, Laser applications in integrated circuits and photonics packaging, 0000 (15 July 2004); doi: 10.1117/12.531758
Proc. SPIE 5339, Basic investigations for controlling the laser spot welding process when packaging 3-dimensional molded interconnect devices, 0000 (15 July 2004); doi: 10.1117/12.530515
Proc. SPIE 5339, Melting threshold and melt removal dynamics during laser interaction with steel and HgCdTe in femtosecond regime, 0000 (15 July 2004); doi: 10.1117/12.527725
Proc. SPIE 5339, Laser microjoining of dissimilar and biocompatible materials, 0000 (15 July 2004); doi: 10.1117/12.530239
Proc. SPIE 5339, Transmission welding of carbon nanocomposites with direct-diode and Nd:YAG solid state lasers, 0000 (15 July 2004); doi: 10.1117/12.528380
Micromachining of Microelectronic Components and Systems
Proc. SPIE 5339, Versatile light-control schemes based on diffractive optics for laser drilling, cutting, and joining technologies for microelectronic and micromechanical components and devices, 0000 (15 July 2004); doi: 10.1117/12.527853
Proc. SPIE 5339, Influence of gas on cutting silicon with solid state laser, 0000 (15 July 2004); doi: 10.1117/12.532133
Proc. SPIE 5339, Electronic packaging: new results in singulation by Laser Microjet, 0000 (15 July 2004); doi: 10.1117/12.529021
Proc. SPIE 5339, High-power and high-brightness solid state laser systems for precise and fast micromachining, 0000 (15 July 2004); doi: 10.1117/12.529418