PROCEEDINGS VOLUME 5342
MICROMACHINING AND MICROFABRICATION | 24-29 JANUARY 2004
Micromachining and Microfabrication Process Technology IX
IN THIS VOLUME

0 Sessions, 30 Papers, 0 Presentations
Process  (4)
Devices  (5)
Lasers  (2)
MICROMACHINING AND MICROFABRICATION
24-29 January 2004
San Jose, California, United States
Process
Proc. SPIE 5342, Effect of deposition parameters on the stress gradient of CVD and PECVD poly-SiGe for MEMS applications, 0000 (30 December 2003); doi: 10.1117/12.524406
Proc. SPIE 5342, Phase transition vs. thickness in stress-induced curvature on Cr/Au MEMS mirror layers, 0000 (30 December 2003); doi: 10.1117/12.538768
Proc. SPIE 5342, Wafer-level vacuum packaging technology based on selective electroplating, 0000 (30 December 2003); doi: 10.1117/12.525802
Proc. SPIE 5342, Simulations and experiments on the fabrication of silicon tip, 0000 (30 December 2003); doi: 10.1117/12.524647
Devices
Proc. SPIE 5342, RF MEMS technologies fabricated using low-temperature processing, 0000 (30 December 2003); doi: 10.1117/12.538377
Proc. SPIE 5342, Fabrication of an electrochemical tip-probe system embedded in SiNx cantilevers for simultaneous SECM and AFM analysis, 0000 (30 December 2003); doi: 10.1117/12.524452
Proc. SPIE 5342, Novel process for realization of multiple-axis actuators suitable for the realization of an optical switch, 0000 (30 December 2003); doi: 10.1117/12.524722
Proc. SPIE 5342, High-performance thick copper inductors in an RF technology, 0000 (30 December 2003); doi: 10.1117/12.525823
Proc. SPIE 5342, Fabrication of integrated inductors on silicon for fully integrated DC-DC microconverters, 0000 (30 December 2003); doi: 10.1117/12.531969
Deep Silicon Etching
Proc. SPIE 5342, Advanced pressure control in time division multiplexed (TDM) plasma etch processes, 0000 (30 December 2003); doi: 10.1117/12.521910
Proc. SPIE 5342, Deep reactive ion etch conditioning recipe, 0000 (30 December 2003); doi: 10.1117/12.522941
Proc. SPIE 5342, Characterization of the microloading effect in deep reactive ion etching of silicon, 0000 (30 December 2003); doi: 10.1117/12.524461
Proc. SPIE 5342, Realization of vertical P+ wall through-wafer, 0000 (30 December 2003); doi: 10.1117/12.531533
Proc. SPIE 5342, Deep wet etching on fused silica material for fiber optic sensors, 0000 (30 December 2003); doi: 10.1117/12.524693
Lasers
Proc. SPIE 5342, Three-dimensional microfabrication using two-photon absorption by femtosecond laser, 0000 (30 December 2003); doi: 10.1117/12.524310
Proc. SPIE 5342, Direct-write waveguides and structural modification by femtosecond laser pulses, 0000 (30 December 2003); doi: 10.1117/12.524437
LIGA and LIGA-like Processes
Proc. SPIE 5342, Analysis of a process for replication of electroforming molds with integral microscreens, 0000 (30 December 2003); doi: 10.1117/12.530761
Proc. SPIE 5342, Three-dimensional photolithography based on image reversal, 0000 (30 December 2003); doi: 10.1117/12.524654
Proc. SPIE 5342, Fabrication of large-area x-rays masks for UDXRL on beryllium using thin film UV lithography and x-ray backside exposure, 0000 (30 December 2003); doi: 10.1117/12.531598
Materials, Coating, and Lithography
Proc. SPIE 5342, BCB wafer bonding for microfluidics, 0000 (30 December 2003); doi: 10.1117/12.524621
Proc. SPIE 5342, Bi/In thermal resist for both Si anisotropic wet etching and Si/SiO2 plasma etching, 0000 (30 December 2003); doi: 10.1117/12.524690
Proc. SPIE 5342, Improved vapor-phase deposition technique for antistiction monolayers, 0000 (30 December 2003); doi: 10.1117/12.531798
Proc. SPIE 5342, Polymeric protective coatings for MEMS wet-etch processes, 0000 (30 December 2003); doi: 10.1117/12.523965
Proc. SPIE 5342, Comparison of micro chrome patterns in gray-scale lithography, 0000 (30 December 2003); doi: 10.1117/12.525019
Proc. SPIE 5342, Process design environment for microfabrication technologies, 0000 (30 December 2003); doi: 10.1117/12.524368
Poster Session
Proc. SPIE 5342, Electronic properties of multiphase systems with varying configuration of inclusions, 0000 (30 December 2003); doi: 10.1117/12.523542
Proc. SPIE 5342, Wall shear stress and pressure sensor development for active control of flow, 0000 (30 December 2003); doi: 10.1117/12.524533
Proc. SPIE 5342, Original technology applied for manufacturing a cantilever-type piezoresistive micro-accelerometer, 0000 (30 December 2003); doi: 10.1117/12.530523
Proc. SPIE 5342, Creation of conductive polymer composites based on silicon with relay effect, 0000 (30 December 2003); doi: 10.1117/12.528166
Plenary Session
Proc. SPIE 5342, Silicon carbide micro- and nanoelectromechanical systems, 0000 (30 December 2003); doi: 10.1117/12.548920
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