PROCEEDINGS VOLUME 5358
INTEGRATED OPTOELECTRONIC DEVICES 2004 | 26-29 JANUARY 2004
Photonics Packaging and Integration IV
IN THIS VOLUME

0 Sessions, 18 Papers, 0 Presentations
Devices  (5)
Integration  (5)
INTEGRATED OPTOELECTRONIC DEVICES 2004
26-29 January 2004
San Jose, CA, United States
Devices
Proc. SPIE 5358, Variable optical attenuator realized on silicon V-groove for optical beamforming networks, 0000 (10 June 2004); doi: 10.1117/12.526488
Proc. SPIE 5358, Compact CWDM design and packaging, 0000 (10 June 2004); doi: 10.1117/12.527654
Proc. SPIE 5358, High dynamic range integrated 10 Gb/s receiver, 0000 (10 June 2004); doi: 10.1117/12.529071
Proc. SPIE 5358, Low profile flat pack: a high-power fiber coupled laser diode package for low-cost high-reliability applications, 0000 (10 June 2004); doi: 10.1117/12.529621
Proc. SPIE 5358, Hybrid VCSEL modules with integrated amorphous silicon power monitors, 0000 (10 June 2004); doi: 10.1117/12.529557
Integration
Proc. SPIE 5358, Hybrid integration of optical modules for planar deflector switches, 0000 (10 June 2004); doi: 10.1117/12.524931
Proc. SPIE 5358, Radiation mode coupling between active and passive chips based on a self-formed compact polymer interconnect for single-mode chip-to-chip optoelectronic integration, 0000 (10 June 2004); doi: 10.1117/12.529221
Proc. SPIE 5358, Optical I/O technology for digital VLSI, 0000 (10 June 2004); doi: 10.1117/12.530160
Proc. SPIE 5358, Progress toward the development of manufacturable integrated optical data buses, 0000 (10 June 2004); doi: 10.1117/12.526879
Proc. SPIE 5358, Improvement of multiprocessing performance by using optical centralized shared bus, 0000 (10 June 2004); doi: 10.1117/12.525754
Packaging Technology
Proc. SPIE 5358, The fabrication of pyramid-shaped fiber microlenses for coupling the high-power diode lasers into the single-mode fibers, 0000 (10 June 2004); doi: 10.1117/12.528222
Proc. SPIE 5358, Fiber-to-waveguide evanescent coupler for planar integration of silicon optoelectronic devices, 0000 (10 June 2004); doi: 10.1117/12.526627
Proc. SPIE 5358, Cost-effective packaging of laser modules using LTCC substrates, 0000 (10 June 2004); doi: 10.1117/12.528280
Proc. SPIE 5358, Flexible optical waveguide film with 45-degree micromirror couplers for hybrid E/O integration or parallel optical interconnection, 0000 (10 June 2004); doi: 10.1117/12.532923
Proc. SPIE 5358, Laser writing of polymeric channel waveguides for optical interconnect packaging, 0000 (10 June 2004); doi: 10.1117/12.532667
Proc. SPIE 5358, Optical interconnect on printed wiring board, 0000 (10 June 2004); doi: 10.1117/12.530350
Proc. SPIE 5358, WDM polymer substrate mode photonic interconnects for satellite communications, 0000 (10 June 2004); doi: 10.1117/12.531557
Proc. SPIE 5358, An adaptive optical filter based on thermo-optic (TO) polymeric waveguide lattice filters, 0000 (10 June 2004); doi: 10.1117/12.543941
Back to Top