PROCEEDINGS VOLUME 5392
NDE FOR HEALTH MONITORING AND DIAGNOSTICS | 14-18 MARCH 2004
Testing, Reliability, and Application of Micro- and Nano-Material Systems II
NDE FOR HEALTH MONITORING AND DIAGNOSTICS
14-18 March 2004
San Diego, CA, United States
Material Properties on the Nanoscale I
Proc. SPIE 5392, Micro/nanoscale tribological and mechanical characterization for MEMS/NEMS, 0000 (21 July 2004); doi: 10.1117/12.540419
Proc. SPIE 5392, Nondestructive mechanical imaging of SnO2 nanobelts, 0000 (21 July 2004); doi: 10.1117/12.540411
Material Properties on the Nanoscale II
Proc. SPIE 5392, Nanoscale nondestructive electric field probing in ferroelectrics, organic molecular films and near-field optical nanodevices, 0000 (21 July 2004); doi: 10.1117/12.544503
Proc. SPIE 5392, Evaluation of interactive forces between alkaline earth metal fluoride particles and single crystal substrate using atomic force microscopy, 0000 (21 July 2004); doi: 10.1117/12.540987
Proc. SPIE 5392, Characterization of microcracks by application of digital image correlation to SPM images, 0000 (21 July 2004); doi: 10.1117/12.538433
Proc. SPIE 5392, Positron annihilation spectroscopy to study nanoprecipitations in aluminum alloys, 0000 (21 July 2004); doi: 10.1117/12.541360
Advanced Microscopic Techniques
Proc. SPIE 5392, Micro- and nano-NDE in the laboratory for acoustic diagnosis and quality assurance, 0000 (21 July 2004); doi: 10.1117/12.541652
Proc. SPIE 5392, Introduction to EBSD analysis of micro- to nanoscale microstructures in metals and ceramics, 0000 (21 July 2004); doi: 10.1117/12.542082
Proc. SPIE 5392, Raman spectroscopic investigation of stresses in microstructures of pyroelectric devices, 0000 (21 July 2004); doi: 10.1117/12.538425
Proc. SPIE 5392, Barkhausen noise and eddy current microscopy: a new scanning probe technique for microscale characterization of materials, 0000 (21 July 2004); doi: 10.1117/12.540463
Proc. SPIE 5392, Improved mechanical properties of metallic micro-structures, 0000 (21 July 2004); doi: 10.1117/12.541312
Surfaces and Cracks
Proc. SPIE 5392, Comparison between the atomic force microscopy and x-ray reflectivity on the characterization of the roughness of a surface, 0000 (21 July 2004); doi: 10.1117/12.539761
Proc. SPIE 5392, Carbon buffer layers for smoothing substrates of EUV and x-ray multilayer mirrors, 0000 (21 July 2004); doi: 10.1117/12.541365
Proc. SPIE 5392, Determination of Local Stress Intensity Factor at Crack Tip Using Image Correlation Techniques, 0000 (21 July 2004); doi: 10.1117/12.538757
Proc. SPIE 5392, Characterization of materials with nanoscopic filler particles by AFM techniques, 0000 (21 July 2004); doi: 10.1117/12.540073
Proc. SPIE 5392, Characterization of microscopic surface breaking cracks using the near-field intensification of nondestructive laser-generated surface waves, 0000 (21 July 2004); doi: 10.1117/12.541552
Proc. SPIE 5392, Laser processing of micro-cracks for structural life extension, 0000 (21 July 2004); doi: 10.1117/12.540299
Proc. SPIE 5392, Calibration of an electro-optical variable circular retarder with application in a nulling microellipsometer, 0000 (21 July 2004); doi: 10.1117/12.540845
Composites and Interfaces
Proc. SPIE 5392, NDE of microstructured materials by x-ray diffraction and refraction topography, 0000 (21 July 2004); doi: 10.1117/12.541532
Proc. SPIE 5392, Application of computer tomography in microelectronic packaging, 0000 (21 July 2004); doi: 10.1117/12.540848
Proc. SPIE 5392, Mechanical wave propagation at phase and material interfaces of microstructures, 0000 (21 July 2004); doi: 10.1117/12.543789
Proc. SPIE 5392, Acoustic Emission (AE) of fiberglass insulation material, 0000 (21 July 2004); doi: 10.1117/12.538066
Proc. SPIE 5392, Continuum simulation of adhesive-adherend interface layers for USNDE, 0000 (21 July 2004); doi: 10.1117/12.543241
Proc. SPIE 5392, Nondestructive ultrasonic characterization of multilayer coatings, 0000 (21 July 2004); doi: 10.1117/12.540535
Applications of MEMS and Micro-electronics
Proc. SPIE 5392, Real-time visualization of bridge structural response through wireless MEMS sensors, 0000 (21 July 2004); doi: 10.1117/12.539263
Proc. SPIE 5392, Development of GMR eddy current sensors for high-temperature applications and imaging of corrosion in thick multilayer structures, 0000 (21 July 2004); doi: 10.1117/12.539944
Proc. SPIE 5392, High-resolution nondestructive evaluation at the Center for Materials Diagnosis, 0000 (21 July 2004); doi: 10.1117/12.541351
Additional Paper
Proc. SPIE 5392, Materials characterization of micro-devices, 0000 (21 July 2004); doi: 10.1117/12.570272
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