PROCEEDINGS VOLUME 5454
PHOTONICS EUROPE | 26-30 APRIL 2004
Micro-Optics: Fabrication, Packaging, and Integration
IN THIS VOLUME

0 Sessions, 17 Papers, 0 Presentations
PHOTONICS EUROPE
26-30 April 2004
Strasbourg, France
Assembly Techniques I
Proc. SPIE 5454, High-density hybrid interconnect technologies, 0000 (8 September 2004); doi: 10.1117/12.546738
Proc. SPIE 5454, Flip-chip assembly for photonic circuits, 0000 (8 September 2004); doi: 10.1117/12.545952
Proc. SPIE 5454, Flip-chip assembly and reliability using gold/tin solder bumps, 0000 (8 September 2004); doi: 10.1117/12.546463
Poster Session
Proc. SPIE 5454, PLATIMO: versatile assembling facilities to bring concepts to prototypes and automated production, 0000 (8 September 2004); doi: 10.1117/12.553046
Assembly Techniques II
Proc. SPIE 5454, Micro-optical components and systems in polymers for optical networks and sensors, 0000 (8 September 2004); doi: 10.1117/12.553065
Proc. SPIE 5454, Sol-gel replication of optical components suited for surface mount assembly, 0000 (8 September 2004); doi: 10.1117/12.544968
Proc. SPIE 5454, Basic aspects of deep lithography with particles for the fabrication of micro-optical and micromechanical structures, 0000 (8 September 2004); doi: 10.1117/12.547718
Proc. SPIE 5454, Low-cost single-mode waveguide fabrication allowing passive fiber coupling using LIGA and UV flood exposure, 0000 (8 September 2004); doi: 10.1117/12.544477
Fabrication and Replication I
Proc. SPIE 5454, Integration of multimode waveguides and micromirror couplers in printed circuit boards using laser ablation, 0000 (8 September 2004); doi: 10.1117/12.553066
Proc. SPIE 5454, High-precision surface mount assembly of micro-optical components per laser reflow soldering: positioning accuracy and thermal stability, 0000 (8 September 2004); doi: 10.1117/12.545510
Proc. SPIE 5454, Assembly of electro-optical modules in a desktop factory, 0000 (8 September 2004); doi: 10.1117/12.545279
Proc. SPIE 5454, A cost-effective packaging for the environmental hardening of passive optical devices, 0000 (8 September 2004); doi: 10.1117/12.545909
Proc. SPIE 5454, Sealing optical fibers without metallization: design guidelines, 0000 (8 September 2004); doi: 10.1117/12.554264
Fabrication and Replication II
Proc. SPIE 5454, Development of microlens arrays for high-speed optical communication, 0000 (8 September 2004); doi: 10.1117/12.545371
Proc. SPIE 5454, Large-area origination and replication of microstructures with optical functions, 0000 (8 September 2004); doi: 10.1117/12.545637
Poster Session
Proc. SPIE 5454, Ellipsometric investigations of polished surface of glass/ceramic with ultralow coefficient of the temperature expansion, 0000 (8 September 2004); doi: 10.1117/12.543878
Proc. SPIE 5454, Unglue bonding of glass/ceramic parts with ultralow coefficient of thermal expansion, 0000 (8 September 2004); doi: 10.1117/12.543882
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