PROCEEDINGS VOLUME 5645
PHOTONICS ASIA | 8-11 NOVEMBER 2004
Advanced Microlithography Technologies
IN THIS VOLUME

0 Sessions, 42 Papers, 0 Presentations
Simulation  (2)
Photomasks  (4)
PHOTONICS ASIA
8-11 November 2004
Beijing, China
Resolution Enhancement
Proc. SPIE 5645, The next generation of RET, 0000 (27 January 2005); doi: 10.1117/12.577222
Proc. SPIE 5645, Methodology for a sub-90nm contact layer OPC with DFM flow demonstration, 0000 (27 January 2005); doi: 10.1117/12.572686
Proc. SPIE 5645, Development of automatic OPC treatment and layout decomposition for double dipole lithography for low-k1 imaging, 0000 (27 January 2005); doi: 10.1117/12.575989
Proc. SPIE 5645, Novel contact hole reticle design for enhanced lithography process window in IC manufacturing, 0000 (27 January 2005); doi: 10.1117/12.576519
Proc. SPIE 5645, Method of printing 100-nm random interconnect pattern with alt-PSM, 0000 (27 January 2005); doi: 10.1117/12.572232
Simulation
Proc. SPIE 5645, Lithography simulation in semiconductor manufacturing, 0000 (27 January 2005); doi: 10.1117/12.584441
Proc. SPIE 5645, Etching analysis of inductively coupled plasma technology for fabrication of micro-optical elements, 0000 (27 January 2005); doi: 10.1117/12.576371
Photomasks
Proc. SPIE 5645, Photomask development for 90-nm technology, 0000 (27 January 2005); doi: 10.1117/12.570482
Proc. SPIE 5645, Achieving CDU requirement for 90-nm technology node and beyond with advanced mask making process technology, 0000 (27 January 2005); doi: 10.1117/12.577008
Proc. SPIE 5645, The study on causes and control methods of haze contamination, 0000 (27 January 2005); doi: 10.1117/12.576605
Proc. SPIE 5645, Improving the performance of E-beam 2nd writing in mask alignment accuracy and pattern faultless for CPL technology, 0000 (27 January 2005); doi: 10.1117/12.576542
Process Control II
Proc. SPIE 5645, CD variation control based on accurate characterization of 193-nm material and CD metrology, 0000 (27 January 2005); doi: 10.1117/12.577276
Process Control I
Proc. SPIE 5645, Advanced 2D structures metrology with CD-SEM for OPC challenges, 0000 (27 January 2005); doi: 10.1117/12.575344
Process Control II
Proc. SPIE 5645, Effects of high moisture on the purification of clean compressed air, 0000 (27 January 2005); doi: 10.1117/12.580509
Proc. SPIE 5645, Verification of height and sidewall angle SEM metrology accuracy using Monte Carlo simulation, 0000 (27 January 2005); doi: 10.1117/12.575390
Proc. SPIE 5645, A new method to determine the energy range for the FOCAL technique, 0000 (27 January 2005); doi: 10.1117/12.573815
Optical Lithography Equipment
Proc. SPIE 5645, Evolution of light source technology to support immersion and EUV lithography, 0000 (27 January 2005); doi: 10.1117/12.577587
Proc. SPIE 5645, ArF immersion lithography using TWINSCAN technology, 0000 (27 January 2005); doi: 10.1117/12.578071
Proc. SPIE 5645, Coma measurement by transmission image sensor with a PSM, 0000 (27 January 2005); doi: 10.1117/12.573642
Resolution Enhancement
Proc. SPIE 5645, Polarization effects associated with hyper-numerical aperture (NA>1) lithography, 0000 (27 January 2005); doi: 10.1117/12.582635
Optical Lithography Equipment
Proc. SPIE 5645, Exposure dose control for step-and-scan lithography, 0000 (27 January 2005); doi: 10.1117/12.567919
Proc. SPIE 5645, Using the aerial image measurement technique to speed up mask development for 193-nm immersion and polarization lithography, 0000 (27 January 2005); doi: 10.1117/12.576948
Proc. SPIE 5645, Application of BP-neural networks in the FOCAL technique, 0000 (27 January 2005); doi: 10.1117/12.573822
Novel Patterning Methods
Proc. SPIE 5645, Microfabrication technology by femtosecond laser direct scanning using two-photon photo-polymerization, 0000 (27 January 2005); doi: 10.1117/12.574589
Proc. SPIE 5645, Synchrotron radiation stimulated etching SiO2 thin films with a contact micropattern mask, 0000 (27 January 2005); doi: 10.1117/12.569672
Proc. SPIE 5645, Process study of ZEP520 positive electron-beam resist and its application in single-electron transistor, 0000 (27 January 2005); doi: 10.1117/12.572561
Proc. SPIE 5645, The thermal cross-linking plate with high quality for CTP with laser, 0000 (27 January 2005); doi: 10.1117/12.573756
Future Lithography Options
Proc. SPIE 5645, The advanced nanofabrication technology, 0000 (27 January 2005); doi: 10.1117/12.570206
Proc. SPIE 5645, Soft nanoimprint lithography, 0000 (27 January 2005); doi: 10.1117/12.570745
Proc. SPIE 5645, EUV/soft x-ray multilayer optics, 0000 (27 January 2005); doi: 10.1117/12.579520
Proc. SPIE 5645, Analysis of nanometer-isolated trench diffract aerial image of both conventional and second-generation synchrotron-based proximity x-ray lithography, 0000 (27 January 2005); doi: 10.1117/12.573232
Poster Session
Proc. SPIE 5645, Imaging simulation of maskless lithography using a DMD, 0000 (27 January 2005); doi: 10.1117/12.577352
Process Control I
Proc. SPIE 5645, Lithography yield enhancement through optical rule checking, 0000 (27 January 2005); doi: 10.1117/12.577609
Poster Session
Proc. SPIE 5645, Increasing post OPC layout verification coverage using a full-chip simulation based verification method, 0000 (27 January 2005); doi: 10.1117/12.572711
Proc. SPIE 5645, Minimal area of average height parameter for surface microtopography measurement, 0000 (27 January 2005); doi: 10.1117/12.572850
Proc. SPIE 5645, A new ZEP520/P(MMA-MAA)/ZEP520 trilayer process for T-shaped gate using synchrotron-based proximity x-ray lithography, 0000 (27 January 2005); doi: 10.1117/12.573519
Proc. SPIE 5645, Study on ion etching technology of infrared antireflection subwavelength relief structure, 0000 (27 January 2005); doi: 10.1117/12.575647
Proc. SPIE 5645, 90-nm dual damascene patterning with a new via fill material, 0000 (27 January 2005); doi: 10.1117/12.575975
Process Control I
Proc. SPIE 5645, Resolution enhancement in optical lithography with chromium wire-grid polarization mask, 0000 (27 January 2005); doi: 10.1117/12.576127
Poster Session
Proc. SPIE 5645, The application of optical resolution enhancement technology and e-beam direct writing technology in microfabrication, 0000 (27 January 2005); doi: 10.1117/12.576170
Proc. SPIE 5645, Soft-imprint technique for 3D microstructures using poly(dimethylsiloxane) mold combined with a screen mask, 0000 (27 January 2005); doi: 10.1117/12.576742
Proc. SPIE 5645, Hybrid nanocontact printing (HnCP) process technology, 0000 (27 January 2005); doi: 10.1117/12.577244
Back to Top