Laser Ablation and Analytical Techniques
Proc. SPIE 5713, Micromachining of inorganic transparent materials using pulsed laser plasma soft x-rays at 10 nm, 0000 (12 April 2005); doi: 10.1117/12.590375
Proc. SPIE 5713, Investigation of laser ablation of CVD diamond film, 0000 (12 April 2005); doi: 10.1117/12.592004
Poster Session
Proc. SPIE 5713, Quantum cascade lasers tuned by amorphous As2S3 claddings, 0000 (12 April 2005); doi: 10.1117/12.599080
Modification of Optical Properties in Materials
Proc. SPIE 5713, F<sub>2</sub>-laser writing of silica optical waveguides in silicone rubber, 0000 (12 April 2005); doi: 10.1117/12.589392
Proc. SPIE 5713, Thermal heating effects in writing optical waveguides with 0.1 - 5 MHz repetition rate, 0000 (12 April 2005); doi: 10.1117/12.591058
Proc. SPIE 5713, Investigation of the process for manufacturing optoelectronic devices using nonorganic photoresists, 0000 (12 April 2005); doi: 10.1117/12.591758
Laser Processes for Silicon and Semiconductor Component Manufacture
Proc. SPIE 5713, Laser technology for wafer dicing and microvia drilling for next generation wafers, 0000 (12 April 2005); doi: 10.1117/12.602033
Proc. SPIE 5713, Laser doping of germanium, 0000 (12 April 2005); doi: 10.1117/12.585470
Proc. SPIE 5713, Development of line-shaped optical system for YAG2omega laser annealing used in the manufacture of low-temperature poly-Si TFT, 0000 (12 April 2005); doi: 10.1117/12.590383
Proc. SPIE 5713, Surface morphology and recrystallization behavior of amorphous Si after ArF laser irradiation, 0000 (12 April 2005); doi: 10.1117/12.591921
Laser Transfer and Deposition Processes
Proc. SPIE 5713, Microdroplet deposition by laser-induced forward transfer, 0000 (12 April 2005); doi: 10.1117/12.589875
Proc. SPIE 5713, Laser based hybrid inkjet printing of nanoink for flexible electronics, 0000 (12 April 2005); doi: 10.1117/12.591914
Proc. SPIE 5713, Scope for electric field assisted removal of ablated debris from laser machined features in silicon, 0000 (12 April 2005); doi: 10.1117/12.594529
Keynote Presentation
Proc. SPIE 5713, Femtosecond versus picosecond laser ablation, 0000 (12 April 2005); doi: 10.1117/12.597975
Femtosecond Laser Micromachining: Interaction Mechanisms
Proc. SPIE 5713, Pulse duration and energy density influence on laser processing of metals with short and ultrashort pulses, 0000 (12 April 2005); doi: 10.1117/12.587540
Proc. SPIE 5713, Analysis of femtosecond (775nm) and nanosecond (355nm) micromachined Ni surfaces using electron backscatter diffraction (EBSD), 0000 (12 April 2005); doi: 10.1117/12.598484
Femtosecond Laser Micromachining: Surface Processing
Proc. SPIE 5713, New laser marking technology using ultrafast lasers, 0000 (12 April 2005); doi: 10.1117/12.591648
Femtosecond Laser Micromachining: Nanostructures
Proc. SPIE 5713, Mechanisms and applications of femtosecond laser induced nanostructures, 0000 (12 April 2005); doi: 10.1117/12.598090
Proc. SPIE 5713, Surface nanostructuring of Ni, Ti, and 316L stainless steel using ultrafast laser interactions, 0000 (12 April 2005); doi: 10.1117/12.598487
Proc. SPIE 5713, Femtosecond and nanosecond laser micromachining of oxidized multi-wall carbon nanotube doped morthane, 0000 (12 April 2005); doi: 10.1117/12.592740
Femtosecond Laser Micromachining: Fabricating Microfluidics
Proc. SPIE 5713, 3D microfluidic lasers embedded in glass by femtosecond laser direct writing, 0000 (12 April 2005); doi: 10.1117/12.588935
Laser Application and Modeling for MEMS
Proc. SPIE 5713, Modeling of solid-state and excimer laser processes for 3D micromachining, 0000 (12 April 2005); doi: 10.1117/12.600632
Proc. SPIE 5713, Laser micromachining techniques for industrial MEMS applications, 0000 (12 April 2005); doi: 10.1117/12.599414
Industrial Laser Applications and Manufacturing
Proc. SPIE 5713, Laser material processing in microelectronics manufacturing: status and near-term opportunities, 0000 (12 April 2005); doi: 10.1117/12.600913
Proc. SPIE 5713, Invisible display in aluminum, 0000 (12 April 2005); doi: 10.1117/12.602043
Proc. SPIE 5713, Laser direct-write of embedded electronic components and circuits, 0000 (12 April 2005); doi: 10.1117/12.596454
Proc. SPIE 5713, Coincident multiwavelength irradiation of polymers with UV and VUV laser, 0000 (12 April 2005); doi: 10.1117/12.592410
Proc. SPIE 5713, Particle-free semiconductor cutting using the water jet guided laser, 0000 (12 April 2005); doi: 10.1117/12.585748
Proc. SPIE 5713, Creating precise 3D microstructures using laser direct-write bimetallic thermal resist grayscale photomasks, 0000 (12 April 2005); doi: 10.1117/12.601545
Laser Processing in Wet Environments
Proc. SPIE 5713, Laser processing of dental hard tissues, 0000 (12 April 2005); doi: 10.1117/12.598149
Proc. SPIE 5713, Surface microfabrication of silica glass by LIBWE using DPSS-UV laser, 0000 (12 April 2005); doi: 10.1117/12.589933
Proc. SPIE 5713, Spatial distribution of the species laser-ablated from the target submerged in liquid, 0000 (12 April 2005); doi: 10.1117/12.589507
Proc. SPIE 5713, Heat damage-free laser-microjet cutting achieves highest die fracture strength, 0000 (12 April 2005); doi: 10.1117/12.586710
Poster Session
Proc. SPIE 5713, The influence of laser beam-width and focusing angle about the precision of cutting metallic materials, 0000 (12 April 2005); doi: 10.1117/12.591499
Proc. SPIE 5713, Optical properties of pulsed-laser deposited BaTiO<sub>3</sub> thin films, 0000 (12 April 2005); doi: 10.1117/12.584639
Proc. SPIE 5713, Mechanism of laser ablation in liquid media investigated by using long-lasting lanthanide emission as a probe, 0000 (12 April 2005); doi: 10.1117/12.587477
Proc. SPIE 5713, Fabrication and characterization of hexagonally assembled ZnO and ZnO:N thin films with buffer layer by pulsed-laser deposition, 0000 (12 April 2005); doi: 10.1117/12.589534
Proc. SPIE 5713, Laser ablation of TiO<sub>2-2x</sub>N<sub>x</sub> targets for efficient N-doping into anatase TiO<sub>2</sub> photocatalytic films, 0000 (12 April 2005); doi: 10.1117/12.591362
Proc. SPIE 5713, Hybrid light-laser welding for microelectronics, 0000 (12 April 2005); doi: 10.1117/12.597731
Fundamentals and Reviews
Proc. SPIE 5713, Fundamentals of energy cascade during ultrashort laser-material interactions, 0000 (12 April 2005); doi: 10.1117/12.589461
Proc. SPIE 5713, Thermal, mechanical, and structural phenomena in laser material interaction by large-scale atomistic modeling, 0000 (12 April 2005); doi: 10.1117/12.596612
Proc. SPIE 5713, Industrial applications of ultrahigh precision short-pulse laser processing, 0000 (12 April 2005); doi: 10.1117/12.599113
Cutting and Separation Technology
Proc. SPIE 5713, Laser separation of flat glass in electronic-, optic-, display-, and bio-industry, 0000 (12 April 2005); doi: 10.1117/12.592659
Proc. SPIE 5713, High-precision high-speed separation of semiconductor substrates, 0000 (12 April 2005); doi: 10.1117/12.597773
Proc. SPIE 5713, Measurement techniques for laser parameters relevant to materials processing, 0000 (12 April 2005); doi: 10.1117/12.588710
Surface Structuring and Cleaning
Proc. SPIE 5713, New laser patterning technology with dynamic focus control for 3D MIDs, 0000 (12 April 2005); doi: 10.1117/12.593358
Proc. SPIE 5713, Review of laser-based applications advancing magnetic-recording hard-disk-drive technology, 0000 (12 April 2005); doi: 10.1117/12.594420
Proc. SPIE 5713, Backside sample preparation with laser-enhanced chemical etching for infrared photon imaging, 0000 (12 April 2005); doi: 10.1117/12.596665
Proc. SPIE 5713, Monitoring steam laser cleaning using optical probe techniques, 0000 (12 April 2005); doi: 10.1117/12.593956
Ablation and PLD
Proc. SPIE 5713, LIPAA technique and its possible impact on microelectronics, 0000 (12 April 2005); doi: 10.1117/12.588829
Proc. SPIE 5713, Synthesis of advanced materials by pulsed-laser deposition, 0000 (12 April 2005); doi: 10.1117/12.588550
Proc. SPIE 5713, Near-field enhanced laser-assisted deposition, 0000 (12 April 2005); doi: 10.1117/12.591120
Joining
Proc. SPIE 5713, High-speed single-pulse welding with Nd:YAG lasers, 0000 (12 April 2005); doi: 10.1117/12.597423
Proc. SPIE 5713, Laser-assisted welding of transparent polymers for microchemical engineering and life science, 0000 (12 April 2005); doi: 10.1117/12.589830
Proc. SPIE 5713, F2-laser microwelding of optical fibers and glass substrates, 0000 (12 April 2005); doi: 10.1117/12.591130
Drilling
Proc. SPIE 5713, Laser-based microprocesses using diffraction-free beams generated by diffractive axicons, 0000 (12 April 2005); doi: 10.1117/12.585135