PROCEEDINGS VOLUME 5715
MOEMS-MEMS MICRO AND NANOFABRICATION | 22-27 JANUARY 2005
Micromachining and Microfabrication Process Technology X
IN THIS VOLUME

0 Sessions, 21 Papers, 0 Presentations
Lasers  (5)
Devices  (2)
MOEMS-MEMS MICRO AND NANOFABRICATION
22-27 January 2005
San Jose, California, United States
Etching, X-Ray Lithography, and Wafer Bonding
Proc. SPIE 5715, Notch reduction in silicon on insulator (SOI) structures using a time division multiplex etch processes, 0000 (22 January 2005); doi: 10.1117/12.582764
Proc. SPIE 5715, Uniformity-improving dummy structures for deep reactive ion etching (DRIE) processes, 0000 (22 January 2005); doi: 10.1117/12.588552
Proc. SPIE 5715, Temperature rise of the silicon mask-PMMA resist assembly during LIGA exposure, 0000 (22 January 2005); doi: 10.1117/12.590909
Proc. SPIE 5715, Polymeric microfluidic devices for the monitoring and separation of water-borne pathogens utilizing insulative dielectrophoresis, 0000 (22 January 2005); doi: 10.1117/12.597711
Proc. SPIE 5715, Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding, 0000 (22 January 2005); doi: 10.1117/12.590567
Proc. SPIE 5715, Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators, 0000 (22 January 2005); doi: 10.1117/12.591509
Lasers
Proc. SPIE 5715, Fabrication of three-dimensional photonic devices using femtosecond laser pulses, 0000 (22 January 2005); doi: 10.1117/12.588501
Proc. SPIE 5715, Column growth mechanisms during KrF laser micromachining of Al2O3-TiC, 0000 (22 January 2005); doi: 10.1117/12.591944
Proc. SPIE 5715, Surface morphology and subsurface damaged layer of various glasses machined by 193-nm ArF excimer laser, 0000 (22 January 2005); doi: 10.1117/12.592034
Proc. SPIE 5715, Fabrication of 3D microstructure and analysis of voxel generation by ultrafast-laser-induced two-photon absorption, 0000 (22 January 2005); doi: 10.1117/12.590381
Proc. SPIE 5715, Effects of laser-induced plasma in machining of transparent materials, 0000 (22 January 2005); doi: 10.1117/12.589607
Devices
Proc. SPIE 5715, Thick single-crystal silicon MEMS with high-aspect-ratio vertical air-gaps, 0000 (22 January 2005); doi: 10.1117/12.590750
Proc. SPIE 5715, MEMS fabrication process management environment, 0000 (22 January 2005); doi: 10.1117/12.590276
Poster Session
Proc. SPIE 5715, Properties of atomic-layer-deposited Al2O3/ZnO dielectric films grown at low temperature for RF MEMS, 0000 (22 January 2005); doi: 10.1117/12.589322
Proc. SPIE 5715, Characterization of thin films and stack in MOEMS structure with ellipsometry and reflectometry techniques, 0000 (22 January 2005); doi: 10.1117/12.590309
Proc. SPIE 5715, Small devices manufacturing by copper vapor laser, 0000 (22 January 2005); doi: 10.1117/12.590092
Proc. SPIE 5715, Silicon-glass anodic bonding at low temperature, 0000 (22 January 2005); doi: 10.1117/12.590753
Proc. SPIE 5715, Design and fabrication of giant micromirrors using electroplating-based technology, 0000 (22 January 2005); doi: 10.1117/12.591787
Plenary Session: MOEMS-MEMS
Proc. SPIE 5715, Novel applications of MOEMS display and imaging, 0000 (22 January 2005); doi: 10.1117/12.608014
Proc. SPIE 5715, Vibrating RF MEMS overview: applications to wireless communications, 0000 (22 January 2005); doi: 10.1117/12.608015
Proc. SPIE 5715, Biologically inspired technologies using artificial muscles, 0000 (22 January 2005); doi: 10.1117/12.609696
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