PROCEEDINGS VOLUME 5716
MOEMS-MEMS MICRO AND NANOFABRICATION | 22-27 JANUARY 2005
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
MOEMS-MEMS MICRO AND NANOFABRICATION
22-27 January 2005
San Jose, California, United States
Keynote Presentation
Proc. SPIE 5716, Standard semiconductor packaging for high-reliability low-cost MEMS applications, 0000 (22 January 2005); doi: 10.1117/12.597110
Packaging and Process I
Proc. SPIE 5716, Packaging methods and techniques for MOEMS and MEMS, 0000 (22 January 2005); doi: 10.1117/12.597044
Proc. SPIE 5716, Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops, 0000 (22 January 2005); doi: 10.1117/12.600798
Packaging and Process II
Proc. SPIE 5716, Characterization of (near) hermetic zero-level packages for MEMS, 0000 (22 January 2005); doi: 10.1117/12.596190
Proc. SPIE 5716, Nanoliter MEMS package gas sampling to determine hermeticity, 0000 (22 January 2005); doi: 10.1117/12.601183
Proc. SPIE 5716, Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds, 0000 (22 January 2005); doi: 10.1117/12.590976
Proc. SPIE 5716, Manufacturability: from design to SPC limits through "corner-lot" characterization, 0000 (22 January 2005); doi: 10.1117/12.591725
Proc. SPIE 5716, Sealing technique for wafer-level integrated cavity using In-Ag multilayers, 0000 (22 January 2005); doi: 10.1117/12.590184
Device Characterization and Reliability
Proc. SPIE 5716, Characterization of assembled MEMS, 0000 (22 January 2005); doi: 10.1117/12.596300
Proc. SPIE 5716, Damage of MEMS thermal actuators heated by laser irradiation, 0000 (22 January 2005); doi: 10.1117/12.594408
Proc. SPIE 5716, Fabrication and characterization of polymer microfluidic devices for bio-agent detection, 0000 (22 January 2005); doi: 10.1117/12.592802
Proc. SPIE 5716, Universal fixture for assembling and testing of a silicon-based microcombustor, 0000 (22 January 2005); doi: 10.1117/12.588962
Proc. SPIE 5716, Reliability of a thermally actuated MEMS VOA for optical component applications, 0000 (22 January 2005); doi: 10.1117/12.590835
Proc. SPIE 5716, Lifetime characterization of capacitive RF MEMS switches, 0000 (22 January 2005); doi: 10.1117/12.590132
Proc. SPIE 5716, Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program, 0000 (22 January 2005); doi: 10.1117/12.602257
Materials and Surfaces
Proc. SPIE 5716, Characterization of the mechanical properties of MEMS devices using nanoscale techniques, 0000 (22 January 2005); doi: 10.1117/12.592772
Proc. SPIE 5716, Long-term reliability of single-crystal silicon thin films: the influence of environment on the fatigue damage accumulation rate, 0000 (22 January 2005); doi: 10.1117/12.591219
Proc. SPIE 5716, Molecular vapor deposition (MVD) for improved SAM coatings, 0000 (22 January 2005); doi: 10.1117/12.592627
Proc. SPIE 5716, Dynamic excitation: a noninvasive technique for initiating stiction repair in MEMS, 0000 (22 January 2005); doi: 10.1117/12.590849
Proc. SPIE 5716, Backside preparation and failure analysis for packaged microelectromechanical systems (MEMS), 0000 (22 January 2005); doi: 10.1117/12.600794
Metrology and Characterization Techniques
Proc. SPIE 5716, MEMS metrology techniques, 0000 (22 January 2005); doi: 10.1117/12.596989
Proc. SPIE 5716, Low-coherence interferometric absolute distance gauge for study of MEMS structures, 0000 (22 January 2005); doi: 10.1117/12.590013
Proc. SPIE 5716, Surface profiler for fixed through-glass measurement, 0000 (22 January 2005); doi: 10.1117/12.597080
Proc. SPIE 5716, Novel characterization method for MEMS devices, 0000 (22 January 2005); doi: 10.1117/12.590305
Proc. SPIE 5716, Static and dynamic microdeformable mirror characterization by phase-shifting and time-averaged interferometry, 0000 (22 January 2005); doi: 10.1117/12.592150
Back to Top