PROCEEDINGS VOLUME 5731
INTEGRATED OPTOELECTRONIC DEVICES 2005 | 22-27 JANUARY 2005
Photonics Packaging and Integration V
INTEGRATED OPTOELECTRONIC DEVICES 2005
22-27 January 2005
San Jose, California, United States
Device Technology, Integration, and Modeling
Proc. SPIE 5731, Numerical prediction of radiation heat transfer in optoelectronics hermetic packaging process, 0000 (11 March 2005); doi: 10.1117/12.582708
Proc. SPIE 5731, Polymer waveguides and thermo-optic switches for an optical true time delay phased array antenna, 0000 (11 March 2005); doi: 10.1117/12.587956
Proc. SPIE 5731, High dynamic range receiver optical design and integration challenges, 0000 (11 March 2005); doi: 10.1117/12.590898
Proc. SPIE 5731, Integration of microlens with planar lightwave circuit, 0000 (11 March 2005); doi: 10.1117/12.591373
Proc. SPIE 5731, Polymer materials science and processing technologies for planar lightwave circuit manufacture, 0000 (11 March 2005); doi: 10.1117/12.591542
Optical Backplanes and Board-Level Interconnects
Proc. SPIE 5731, Progress toward board-level optical interconnect technology, 0000 (11 March 2005); doi: 10.1117/12.594675
Proc. SPIE 5731, Backplane photonic interconnect modules with optical jumpers, 0000 (11 March 2005); doi: 10.1117/12.587911
Proc. SPIE 5731, Passive optical components for chip-on-board type optical interconnection, 0000 (11 March 2005); doi: 10.1117/12.593072
Proc. SPIE 5731, Array waveguide evanescent coupler for optical interconnect, 0000 (11 March 2005); doi: 10.1117/12.589453
Proc. SPIE 5731, Low-loss thermally stable waveguide with 45° micromirrors fabricated by soft molding for fully embedded board-level optical interconnects, 0000 (11 March 2005); doi: 10.1117/12.589519
Low-Cost Packaging Technology
Proc. SPIE 5731, Integration and miniaturization of thermopile-based pyrometric module construction sets, 0000 (11 March 2005); doi: 10.1117/12.590424
Proc. SPIE 5731, Plastic packaging of VCSEL-based fiber optic transceivers for PCS fiber systems, 0000 (11 March 2005); doi: 10.1117/12.590312
Proc. SPIE 5731, Low-cost CWDM transmitter package, 0000 (11 March 2005); doi: 10.1117/12.589391
Proc. SPIE 5731, Fabrication process for low-cost GaInAsP/InP etched-facet photodetectors, 0000 (11 March 2005); doi: 10.1117/12.590137
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