PROCEEDINGS VOLUME 6111
MOEMS-MEMS 2006 MICRO AND NANOFABRICATION | 21-27 JANUARY 2006
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
MOEMS-MEMS 2006 MICRO AND NANOFABRICATION
21-27 January 2006
San Jose, California, United States
MEMS Surfaces, Coatings, and Effects
Proc. SPIE 6111, Stiction force estimation from attachment length and electrostatic measurements on cantilever beams, 611101 (6 January 2006); doi: 10.1117/12.640506
Proc. SPIE 6111, Using periodic electrical excitation to achieve stick-release in micro-cantilevers, 611102 (6 January 2006); doi: 10.1117/12.647841
Proc. SPIE 6111, Electrical breakdown across micron scale gaps in MEMS structures, 611103 (6 January 2006); doi: 10.1117/12.646508
Proc. SPIE 6111, Infrared laser deposition of Teflon coatings on microstructures, 611104 (6 January 2006); doi: 10.1117/12.647680
Proc. SPIE 6111, Galvanic corrosion: a microsystems device integrity and reliability concern, 611105 (6 January 2006); doi: 10.1117/12.644932
MEMS/MOEMS Material Properties
Proc. SPIE 6111, Fatigue of polycrystalline silicon films with thin surface oxides, 611106 (6 January 2006); doi: 10.1117/12.646468
Proc. SPIE 6111, Improvement of the elastic modulus of micromachined structures using carbon nanotubes, 611107 (6 January 2006); doi: 10.1117/12.657674
Proc. SPIE 6111, Experimental and computational study on laser heating of surface micromachined cantilevers, 611108 (6 January 2006); doi: 10.1117/12.647487
Proc. SPIE 6111, Bending of aluminum alloy beams depending on irradiance and repetition rate of UV laser radiation, 611109 (6 January 2006); doi: 10.1117/12.647358
Device Reliability
Proc. SPIE 6111, Reliability of MEMS for space applications, 61110A (6 January 2006); doi: 10.1117/12.651008
Proc. SPIE 6111, Reliability testing and qualification of the TeraVicta RF MEMS switch, 61110B (6 January 2006); doi: 10.1117/12.648776
Proc. SPIE 6111, Reliability of microcantilevers in liquid environments, 61110C (6 January 2006); doi: 10.1117/12.646514
Proc. SPIE 6111, A MEMS sensor for the measurement of density-viscosity for oilfield applications, 61110D (6 January 2006); doi: 10.1117/12.645080
Mechanisms, Structures, and Models
Proc. SPIE 6111, Failure mechanisms of DC and capacitive RF MEMS switches, 61110E (6 January 2006); doi: 10.1117/12.644162
Proc. SPIE 6111, Experimental and theoretical investigation of contact resistance and reliability of lateral contact type ohmic MEMS relays, 61110F (6 January 2006); doi: 10.1117/12.659785
Proc. SPIE 6111, A transient charging model to predict actuation-voltage shift in RF MEMS capacitive switches, 61110G (6 January 2006); doi: 10.1117/12.657691
Proc. SPIE 6111, Development of a mechanical model for a micromachined resonant force sensor used in passive microgripping applications, 61110H (6 January 2006); doi: 10.1117/12.644429
Testing and Characterization
Proc. SPIE 6111, High g testing of MEMS devices, 61110I (6 January 2006); doi: 10.1117/12.650722
Proc. SPIE 6111, Experimental apparatus and software design for dynamic long-term reliability testing of a spring-mass MEMS device, 61110J (6 January 2006); doi: 10.1117/12.648488
Proc. SPIE 6111, Guidelines for reliability testing of microelectromechanical systems in military applications, 61110K (6 January 2006); doi: 10.1117/12.649012
Proc. SPIE 6111, The ultra fine dynamics of MEMS as revealed by the Polytec micro system analyzer, 61110L (6 January 2006); doi: 10.1117/12.646556
Proc. SPIE 6111, Novel combined low-coherence interferometry spectrally resolved reflectometry compatible with high-resolution Raman spectroscopy for nondestructive characterization of MEMS structures, 61110M (6 January 2006); doi: 10.1117/12.645560
Packaging and Processing
Proc. SPIE 6111, High and stable Q-factor in resonant MEMS with getter film, 61110N (6 January 2006); doi: 10.1117/12.647710
Proc. SPIE 6111, Wafer bonding for 3D integration of MEMS/CMOS, 61110O (6 January 2006); doi: 10.1117/12.646467
Proc. SPIE 6111, High-speed anisotropic etching of quartz using SF<sub>6</sub>/C<sub>4</sub>F<sub>8</sub>/Ar/O<sub>2</sub> based chemistry in inductively coupled plasma reactive ion etching system, 61110P (6 January 2006); doi: 10.1117/12.657730
Proc. SPIE 6111, Hot gas stream application in micro-bonding technique, 61110Q (6 January 2006); doi: 10.1117/12.644688
Proc. SPIE 6111, Hermeticity tests on organically sealed micro-packages using FTIR spectroscopy, 61110R (6 January 2006); doi: 10.1117/12.646001
Proc. SPIE 6111, Temperature compensation analysis of liquid lens for variable-focus control, 61110S (6 January 2006); doi: 10.1117/12.644456
Poster Session
Proc. SPIE 6111, A critical comparison and development of nano-mechanical characterization of MEMS/NEMS thin film materials, 61110T (6 January 2006); doi: 10.1117/12.647295
Proc. SPIE 6111, Design and fabrication of the degradation level monitoring sensor for power transformer insulating oil, 61110U (6 January 2006); doi: 10.1117/12.647442
Proc. SPIE 6111, A new technique for 3D profilometry of MEMS, 61110V (6 January 2006); doi: 10.1117/12.648890
Proc. SPIE 6111, Modeling and analysis of MEMS-based resonant sensor actuated by bent beam thermal actuator, 61110W (6 January 2006); doi: 10.1117/12.645309
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