PROCEEDINGS VOLUME 6126
INTEGRATED OPTOELECTRONIC DEVICES 2006 | 21-26 JANUARY 2006
Photonics Packaging and Integration VI
INTEGRATED OPTOELECTRONIC DEVICES 2006
21-26 January 2006
San Jose, California, United States
Optical Interconnects I
Proc. SPIE 6126, Ultra-high-speed transmission of polymer-based multimode interference devices for board-level high-throughput optical interconnects, 612601 (28 February 2006); doi: 10.1117/12.660138
Proc. SPIE 6126, Holographic optical elements for optical backplane bus targeted at high speed data transfer, 612602 (28 February 2006); doi: 10.1117/12.660139
Proc. SPIE 6126, Development of a fabrication technology for integrating low cost optical interconnects on a printed circuit board, 612603 (10 February 2006); doi: 10.1117/12.644508
Proc. SPIE 6126, Bit-interleaved optical bus for high-speed secure multiboard system, 612604 (28 February 2006); doi: 10.1117/12.647043
Materials in Advanced Packaging
Proc. SPIE 6126, Advanced packaging materials for optical applications: bridging the gap between nm-size structures and large-area panel processing, 612605 (28 February 2006); doi: 10.1117/12.660140
Proc. SPIE 6126, Fiber optics structural mechanics and nanotechnology-based new generation of fiber coatings, 612606 (28 February 2006); doi: 10.1117/12.661295
Proc. SPIE 6126, Versatile coupling of a plastic optical fibre bundle to an avalanche photodiode array, 612607 (28 February 2006); doi: 10.1117/12.642769
Proc. SPIE 6126, Lithography-grade tungsten-copper substrates for wafer level packaging, 612608 (28 February 2006); doi: 10.1117/12.646914
Optical Interconnects II
Proc. SPIE 6126, Three-dimensional chip-scale optical interconnects and switches with self-organized wiring based on device-embedded waveguide films and molecular nanotechnologies, 612609 (28 February 2006); doi: 10.1117/12.637582
Proc. SPIE 6126, Progress toward optical interconnects for intrachip global communication, 61260A (28 February 2006); doi: 10.1117/12.661293
Proc. SPIE 6126, A novel free-space optical interconnect employing vertical-cavity surface emitting laser diodes and InGaAs metal-semiconductor-metal photodetectors for Gbit/s RF/microwave systems, 61260B (28 February 2006); doi: 10.1117/12.641734
Proc. SPIE 6126, Application of parallel optical axis converting waveguide to optoelectronic-PWB, 61260C (28 February 2006); doi: 10.1117/12.645447
Proc. SPIE 6126, High channel density optical interconnects using photonic crystal fibers, 61260D (28 February 2006); doi: 10.1117/12.647738
Packaging for Communication Components
Proc. SPIE 6126, Efficient optical communications using multibit differential signaling, 61260E (28 February 2006); doi: 10.1117/12.644306
Proc. SPIE 6126, Multimode fibers with integrated optical mode field adapters for 40Gbit/s optical ethernet systems, 61260F (28 February 2006); doi: 10.1117/12.645925
Proc. SPIE 6126, Highly integrated plastic package transceiver modules for large core fiber systems, 61260G (28 February 2006); doi: 10.1117/12.648004
Alignment/Packaging/Fabrication
Proc. SPIE 6126, Advanced integration schemes for high-functionality/high-performance photonic integrated circuits, 61260H (28 February 2006); doi: 10.1117/12.655999
Proc. SPIE 6126, 2D scalable optical controlled phased-array antenna system, 61260I (28 February 2006); doi: 10.1117/12.660142
Proc. SPIE 6126, Recent advances in photonics packaging materials, 61260J (28 February 2006); doi: 10.1117/12.639856
Proc. SPIE 6126, Edge termination effects on finite aperture polarizers for polarimetric imaging applications at mid-wave IR, 61260K (28 February 2006); doi: 10.1117/12.644310
Optical Interconnects/Micro-Optics
Proc. SPIE 6126, Fabrication of a hybrid electrical-optical printed circuit board (EO-PCB) by lamination of an optical printed circuit board (O-PCB) and an electrical printed circuit board (E-PCB), 61260L (28 February 2006); doi: 10.1117/12.650521
Proc. SPIE 6126, Low-cost plastic micro-optics for board-level optical interconnections, 61260M (28 February 2006); doi: 10.1117/12.660141
Proc. SPIE 6126, Integrated waveguide micro-optic elements for 3D routing in board-level optical interconnects, 61260N (28 February 2006); doi: 10.1117/12.644382
Proc. SPIE 6126, Hyperboloid sol gel microlens array fabricated by soft-lithography for optical coupling, 61260O (28 February 2006); doi: 10.1117/12.659765
Proc. SPIE 6126, Fabrication of SIL array of glass by surface-tension mold technique, 61260P (28 February 2006); doi: 10.1117/12.647317
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