PROCEEDINGS VOLUME 6155
SPIE 31ST INTERNATIONAL SYMPOSIUM ON ADVANCED LITHOGRAPHY | 19-24 FEBRUARY 2006
Data Analysis and Modeling for Process Control III
IN THIS VOLUME

0 Sessions, 21 Papers, 0 Presentations
Modeling  (5)
APC  (5)
CD Control  (1)
Proceedings Volume 6155 is from: Logo
SPIE 31ST INTERNATIONAL SYMPOSIUM ON ADVANCED LITHOGRAPHY
19-24 February 2006
San Jose, California, United States
Modeling
Proc. SPIE 6155, First look at across-chip performance and process noise using non-contact performance-based metrology, 615502 (15 March 2006); doi: 10.1117/12.683362
Proc. SPIE 6155, Process influence study on optical model generation during model-based OPC development, 615503 (10 March 2006); doi: 10.1117/12.655801
Proc. SPIE 6155, Dry-etch proximity function for model-based OPC beyond 65-nm node, 615504 (10 March 2006); doi: 10.1117/12.657043
Proc. SPIE 6155, Hyper-NA model validation for the 45-nm node, 615505 (15 March 2006); doi: 10.1117/12.656059
Proc. SPIE 6155, Multivariate visualization techniques in statistical process monitoring and their applications to semiconductor manufacturing, 615506 (10 March 2006); doi: 10.1117/12.654945
APC
Proc. SPIE 6155, Design and use of multivariate approach error analysis APC system, 615507 (14 March 2006); doi: 10.1117/12.657177
Proc. SPIE 6155, Application of integrated scatterometry measurements for a wafer-level litho feedback loop in a high-volume 300 mm DRAM production environment, 615509 (15 March 2006); doi: 10.1117/12.682683
Proc. SPIE 6155, Real-time spatial control of steady-state wafer temperature during thermal processing in microlithography, 61550A (10 March 2006); doi: 10.1117/12.654741
Proc. SPIE 6155, Advanced process control of poly-silicon gate critical dimensions, 61550B (10 March 2006); doi: 10.1117/12.658860
Proc. SPIE 6155, Spatial modeling of micron-scale gate length variation, 61550C (15 March 2006); doi: 10.1117/12.656521
CD Control
Proc. SPIE 6155, Full-field exposure control implications of the mask error function, 61550E (14 March 2006); doi: 10.1117/12.656763
CD and Overlay Control
Proc. SPIE 6155, Layout optimization for multilayer overlay targets, 61550F (14 March 2006); doi: 10.1117/12.659060
Proc. SPIE 6155, Alignment performance monitoring for ASML systems, 61550G (15 March 2006); doi: 10.1117/12.640414
Poster Session
Proc. SPIE 6155, Advanced exposure and focus control by proximity profile signature matching, 61550H (15 March 2006); doi: 10.1117/12.650425
Proc. SPIE 6155, Matching poly-layer ADI and AEI process windows by using ADI index, 61550I (15 March 2006); doi: 10.1117/12.650896
Proc. SPIE 6155, Statistical shape analysis applied to microlithography, 61550J (15 March 2006); doi: 10.1117/12.653037
Proc. SPIE 6155, Evaluation of an advanced process control solution to detect wafer positioning issues within the hot and cold plate modules of a lithography track, 61550K (15 March 2006); doi: 10.1117/12.655573
Proc. SPIE 6155, Optical anisotropy approach in spectroscopic ellipsometry to determine the CD of contact hole patterns, 61550L (15 March 2006); doi: 10.1117/12.656875
Proc. SPIE 6155, Improvement of OPC accuracy for 65nm node contact using KIF, 61550M (15 March 2006); doi: 10.1117/12.657900
Proc. SPIE 6155, Predictive modeling for the management of consumable optics in a lithographic system, 61550N (15 March 2006); doi: 10.1117/12.659117
Proc. SPIE 6155, Combined use of x-ray reflectometry and spectroscopic ellipsometry for characterization of thin film optical properties, 61550P (15 March 2006); doi: 10.1117/12.660088
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