Invited Session (2)
Resist Process (3)
Etch (4)
DPI/DFM (5)
Metrology I (4)
Inspection (4)
Patterning (4)
MDP/MRC (4)
Simulation (4)
Repair (3)
Cleaning (3)
Metrology II (5)
Advanced RET I (5)
Advanced RET II (4)
RET/OPC I (4)
RET/OPC II (5)
Imprint (2)
Real-time monitoring based on comprehensive analysis of the haze environment under the pellicle film
The effect of OPC optical and resist model parameters on the model accuracy, run time, and stability