PROCEEDINGS VOLUME 6882
MOEMS-MEMS 2008 MICRO AND NANOFABRICATION | 19-24 JANUARY 2008
Micromachining and Microfabrication Process Technology XIII
IN THIS VOLUME

0 Sessions, 17 Papers, 0 Presentations
Bio-devices  (1)
Proceedings Volume 6882 is from: Logo
MOEMS-MEMS 2008 MICRO AND NANOFABRICATION
19-24 January 2008
San Jose, California, United States
Front Matter: Volume 6882
Proc. SPIE 6882, Front Matter: Volume 6882, 688201 (28 February 2008); doi: 10.1117/12.791926
Bio-devices
Proc. SPIE 6882, Advances in the fabrication of surface modified microfluidic devices in nonfluorescing UV cured materials, 688203 (26 February 2008); doi: 10.1117/12.758755
MEMS and MOEMS
Proc. SPIE 6882, Micromachining of a fiber-to-waveguide coupler using grayscale lithography and through-wafer etch, 688206 (26 February 2008); doi: 10.1117/12.764036
Proc. SPIE 6882, Laser beam shaping for micromaterial processing using a liquid crystal display, 688207 (26 February 2008); doi: 10.1117/12.763542
Proc. SPIE 6882, A novel fabrication technology for anti-reflex wafer-level vacuum packaged microscanning mirrors, 688208 (26 February 2008); doi: 10.1117/12.760941
Proc. SPIE 6882, Parallel-kinematic-mechanism-based monolithic XY micropositioning stage with rotary comb drive actuators, 688209 (26 February 2008); doi: 10.1117/12.762358
Proc. SPIE 6882, Micro-inductors integrated on silicon for DC-DC converters, 68820A (26 February 2008); doi: 10.1117/12.763085
Proc. SPIE 6882, Electrodeposition of Au for self-assembling 3D microstructures, 68820B (26 February 2008); doi: 10.1117/12.763341
Etching and Lithography
Proc. SPIE 6882, Fabrication of integrated channel waveguides in polydimethylsiloxane (PDMS) using proton beam writing (PBW): applications for fluorescence detection in microfluidic channels, 68820D (26 February 2008); doi: 10.1117/12.762885
Proc. SPIE 6882, MEMS post-processing of MPW dies using BSOI carrier wafers, 68820E (26 February 2008); doi: 10.1117/12.763217
Proc. SPIE 6882, Microstructures with rounded concave and sharp-edged convex corners in a single step wet anisotropic etching, 68820F (26 February 2008); doi: 10.1117/12.765475
Proc. SPIE 6882, TCAD tool for innovative MEMS and MOEMS: an all-in-one solution, 68820G (26 February 2008); doi: 10.1117/12.773043
Proc. SPIE 6882, Sensitivity and stress effects of composite membranes with micro/macro porous silicon for pressure sensor applications, 68820H (26 February 2008); doi: 10.1117/12.762868
Proc. SPIE 6882, Three dimensional waveguide fabrication in PMMA using femtosecond laser micromachining system, 68820I (26 February 2008); doi: 10.1117/12.763824
Poster Session
Proc. SPIE 6882, Aspect ratios, sizes, and etch rates in photostructurable glass-ceramic, 68820J (26 February 2008); doi: 10.1117/12.761895
Proc. SPIE 6882, Dry film process development for electroplating and lift-off of metal layers, 68820L (26 February 2008); doi: 10.1117/12.768611
Proc. SPIE 6882, Electrical properties of thin epoxy-based polymer layers filled with n-carbon black particles, 68820M (26 February 2008); doi: 10.1117/12.761618
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