Proceedings Volume 6899 is from: Logo
INTEGRATED OPTOELECTRONIC DEVICES 2008
19-24 January 2008
San Jose, California, United States
Front Matter: Volume 6899
Proc. SPIE 6899, Front Matter: Volume 6899, 689901 (12 March 2008); doi: 10.1117/12.791606
Optical Interconnect Technologies I: Joint Session with Conference 6897
Proc. SPIE 6899, Low-cost high-density optical parallel link modules and optical backplane for the last 1-meter regime applications, 689902 (6 February 2008); doi: 10.1117/12.764197
Proc. SPIE 6899, Fully embedded board level optical interconnects: from point-to-point interconnection to optical bus architecture, 689903 (8 February 2008); doi: 10.1117/12.767815
Optical Interconnect Technologies II: Joint Session with Conference 6897
Proc. SPIE 6899, Towards flexible routing schemes for polymer optical interconnections on printed circuit boards, 689904 (8 February 2008); doi: 10.1117/12.761642
Proc. SPIE 6899, Short-reach flexible optical interconnection using embedded edge-emitting lasers and edge-viewing detectors, 689905 (8 February 2008); doi: 10.1117/12.763336
Alignment, Coupling, and Assembly
Proc. SPIE 6899, Design and analysis of 3D stacked optoelectronics on optical printed circuit boards, 689907 (8 February 2008); doi: 10.1117/12.764032
Proc. SPIE 6899, Full automatic packaging of a hybrid transceiver module, 689908 (8 February 2008); doi: 10.1117/12.768353
Proc. SPIE 6899, Taper couplers for coupling between laser and silicon waveguide with large allowable tolerance, 689909 (8 February 2008); doi: 10.1117/12.764254
Proc. SPIE 6899, Design of fluidic self-assembly bonds for precise component positioning, 68990A (8 February 2008); doi: 10.1117/12.763286
Proc. SPIE 6899, Surface mount optical interconnects, 68990B (8 February 2008); doi: 10.1117/12.762313
Materials and Fabrication
Proc. SPIE 6899, Flexible film waveguides with excellent bending properties, 68990D (8 February 2008); doi: 10.1117/12.761081
Proc. SPIE 6899, Electro-optic waveguides with conjugated polymer films fabricated by the carrier-gas-type organic CVD for chip-scale optical interconnects, 68990E (8 February 2008); doi: 10.1117/12.761075
Micro-optics in Packaging
Proc. SPIE 6899, Light coupling in micro-optic systems: past, present, and trends, 68990H (7 March 2008); doi: 10.1117/12.763343
Proc. SPIE 6899, Optical design of 4-channel TOSA/ROSA for CWDM applications, 68990I (8 February 2008); doi: 10.1117/12.764238
Proc. SPIE 6899, SU8-based static diffractive optical elements: wafer-level integration with VCSEL arrays, 68990J (8 February 2008); doi: 10.1117/12.760400
Packaging of Communication Devices
Proc. SPIE 6899, Fast response organic light-emitting diode for visible optical communication, 68990K (8 February 2008); doi: 10.1117/12.771703
Proc. SPIE 6899, Automatic tester for high power diode laser bars, 68990M (8 February 2008); doi: 10.1117/12.768351
Proc. SPIE 6899, Assembly of optical MUX/DEMUX on silicon optical bench with high placement accuracies, 68990N (8 February 2008); doi: 10.1117/12.764242
Proc. SPIE 6899, 3.125 Gbps multichannel electrical transmission line design for CWDM, 68990O (8 February 2008); doi: 10.1117/12.764151
Si Integration for Optoelectronics
Proc. SPIE 6899, A high-speed 850-nm optical receiver by integrating Si photodiode and CMOS IC, 68990P (8 February 2008); doi: 10.1117/12.761553
Proc. SPIE 6899, 20dB-enhanced coupling to slot photonic crystal waveguide based on multimode interference, 68990Q (8 February 2008); doi: 10.1117/12.768188
Proc. SPIE 6899, Optical design of a miniature semi-integrated tunable laser on a silicon optical bench, 68990S (8 February 2008); doi: 10.1117/12.763122
Proc. SPIE 6899, Multi-channel clock and data recovery circuit for chip-to-chip optical interconnects, 68990T (8 February 2008); doi: 10.1117/12.763154
Proc. SPIE 6899, Development of a low-cost 2.5-Gbps SFP optical transceiver using 0.18µm CMOS ICs, 68990U (8 February 2008); doi: 10.1117/12.764294
Parallel Optical Links
Proc. SPIE 6899, Waveguide-coupled parallel optical transceiver technology for Tb/s-class chip-to-chip data transmission, 68990V (8 February 2008); doi: 10.1117/12.763670
Proc. SPIE 6899, Electro-optical circuit boards using thin-glass sheets with integrated optical waveguides, 68990X (8 February 2008); doi: 10.1117/12.763180
Proc. SPIE 6899, Merging parallel optics packaging and surface mount technologies, 68990Y (8 February 2008); doi: 10.1117/12.761609
Proc. SPIE 6899, A hybrid optical package with an 8-channel 18GT/s CMOS transceiver for chip-to-chip optical interconnect, 68990Z (8 February 2008); doi: 10.1117/12.764001
Optical Interconnects I
Proc. SPIE 6899, Integration challenges for optical inteconnects, 689910 (8 February 2008); doi: 10.1117/12.767098
Proc. SPIE 6899, A duplex 10 Gb/s serial active optical cable for short-reach applications, 689911 (8 February 2008); doi: 10.1117/12.785008
Proc. SPIE 6899, Integration of optical I/O with organic chip packages, 689912 (8 February 2008); doi: 10.1117/12.764844
Proc. SPIE 6899, Optical waveguide films with two-layer skirt-type core end facets for beam leakage reduction at 45° mirrors, 689913 (8 February 2008); doi: 10.1117/12.754105
Optical Interconnects II
Proc. SPIE 6899, Polymer optical motherboard technology, 689914 (8 February 2008); doi: 10.1117/12.762593
Proc. SPIE 6899, Stable and high-efficiency optical transmitter using a VCSEL-direct-bonded connection block, 689916 (8 February 2008); doi: 10.1117/12.758257
Poster Session
Proc. SPIE 6899, Advances in photonics thermal management and packaging materials, 689918 (8 February 2008); doi: 10.1117/12.761748
Proc. SPIE 6899, Cost effective optical coupling for polymer optical fiber communication, 68991A (8 February 2008); doi: 10.1117/12.764315
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