PROCEEDINGS VOLUME 7202
SPIE LASE: LASERS AND APPLICATIONS IN SCIENCE AND ENGINEERING | 24-29 JANUARY 2009
Laser-based Micro- and Nanopackaging and Assembly III
Proceedings Volume 7202 is from: Logo
SPIE LASE: LASERS AND APPLICATIONS IN SCIENCE AND ENGINEERING
24-29 January 2009
San Jose, California, United States
Front Matter
Proc. SPIE 7202, Front Matter: Volume 7202, 720201 (12 March 2009); doi: 10.1117/12.824391
Optical Components and Devices
Proc. SPIE 7202, Integration of micro-optics and microfluidics in a glass chip by fs-laser for optofluidic applications, 720202 (25 February 2009); doi: 10.1117/12.809137
Proc. SPIE 7202, Parametric investigation of solder bumping for assembly of optical components, 720203 (25 February 2009); doi: 10.1117/12.807986
Proc. SPIE 7202, New packaging concepts for highly stable laser diode modules, 720204 (25 February 2009); doi: 10.1117/12.809978
Proc. SPIE 7202, Laser splicing of end caps: process requirements in high power laser applications, 720205 (25 February 2009); doi: 10.1117/12.808161
Direct-write Processing and Surface Modification
Proc. SPIE 7202, Submicron writing by laser irradiation on metal nano-particle dispersed films toward flexible electronics, 720206 (25 February 2009); doi: 10.1117/12.808213
Proc. SPIE 7202, Laser-assisted structuring and modification of LiCoO2 thin films, 720207 (25 February 2009); doi: 10.1117/12.809164
Proc. SPIE 7202, Controlled-growth of single-walled carbon nanotubes using optical near-field effects, 720209 (25 February 2009); doi: 10.1117/12.808629
Proc. SPIE 7202, Local modification of ceramic surfaces by a laser induced cladding process, 72020A (25 February 2009); doi: 10.1117/12.810701
Modeling and Characterization
Proc. SPIE 7202, Multiscale modeling of phase changes during femtosecond laser metal interaction, 72020B (25 February 2009); doi: 10.1117/12.810022
Proc. SPIE 7202, Comprehensive laser beam characterization for applications in material processing, 72020C (25 February 2009); doi: 10.1117/12.810515
Proc. SPIE 7202, Laser-induced breakdown spectroscopy with high detection sensitivity, 72020D (13 February 2009); doi: 10.1117/12.808110
Proc. SPIE 7202, Mapping of individual single-walled carbon nanotubes using nano-Raman spectroscopy, 72020E (25 February 2009); doi: 10.1117/12.808120
Processes for MEMS
Proc. SPIE 7202, Low-stress dicing assisted by pulsed laser for multilayer MEMS, 72020F (25 February 2009); doi: 10.1117/12.808370
Proc. SPIE 7202, High quality laser cleaving process for mono- and polycrystalline silicon, 72020G (25 February 2009); doi: 10.1117/12.810053
Proc. SPIE 7202, Fiber laser microjoining for novel dissimilar material combinations, 72020H (25 February 2009); doi: 10.1117/12.814863
Proc. SPIE 7202, Laser-based microbonding using hot melt adhesives, 72020I (25 February 2009); doi: 10.1117/12.808671
Proc. SPIE 7202, Laser soldering of enameled wires, 72020J (25 February 2009); doi: 10.1117/12.808683
Micro- and Nanomachining
Proc. SPIE 7202, Large-area plasmonic structures fabricated by laser nanopatterning and their applications, 72020K (25 February 2009); doi: 10.1117/12.810460
Proc. SPIE 7202, Subwavelength photoresist patterning using liquid-immersion interference exposure with a deep-UV hologram mask, 72020L (25 February 2009); doi: 10.1117/12.808809
Proc. SPIE 7202, Micro-scale large-area UV laser processing, 72020M (25 February 2009); doi: 10.1117/12.807828
Proc. SPIE 7202, Micro ID marking for semiconductor chips: recent progress and future prospects, 72020N (25 February 2009); doi: 10.1117/12.808503
Proc. SPIE 7202, Micromachining with picosecond double pulses on silicon and aluminium, 72020O (25 February 2009); doi: 10.1117/12.810152
Joint Session with Conference 7201: Photovoltaics
Proc. SPIE 7202, Novel laser technologies for crystalline silicon solar cell production, 72020P (25 February 2009); doi: 10.1117/12.810128
Proc. SPIE 7202, Thin layer ablation with lasers of different beam profiles: energy efficiency and over filling factor, 72020Q (25 February 2009); doi: 10.1117/12.810158
Proc. SPIE 7202, Optical characterization of the heat-affected zone in laser patterning of thin film a-Si:H, 72020R (25 February 2009); doi: 10.1117/12.809514
Proc. SPIE 7202, Laser processing for high-efficiency silicon solar cells, 72020S (25 February 2009); doi: 10.1117/12.809990
Proc. SPIE 7202, Optimizing laser beam profiles using micro-lens arrays for efficient material processing: applications to solar cells, 72020U (25 February 2009); doi: 10.1117/12.809270
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