PROCEEDINGS VOLUME 7206
SPIE MOEMS-MEMS: MICRO- AND NANOFABRICATION | 24-29 JANUARY 2009
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII
Proceedings Volume 7206 is from: Logo
SPIE MOEMS-MEMS: MICRO- AND NANOFABRICATION
24-29 January 2009
San Jose, California, United States
Front Matter
Proc. SPIE 7206, Front Matter: Volume 7206, 720601 (6 March 2009); doi: 10.1117/12.828445
MEMS Packing: Assembly and Reliability
Proc. SPIE 7206, Hybrid wafer-level vacuum hermetic micropackaging technology for MOEMS-MEMS, 720602 (9 February 2009); doi: 10.1117/12.810028
Proc. SPIE 7206, Packaging of a silicon-based biochip, 720603 (9 February 2009); doi: 10.1117/12.813500
Proc. SPIE 7206, Radiometric packaging of uncooled microbolometer FPA arrays for space applications, 720604 (10 February 2009); doi: 10.1117/12.810025
Proc. SPIE 7206, Fine leak batch testing of multiple MEMS packages, 720605 (9 February 2009); doi: 10.1117/12.810004
Proc. SPIE 7206, Examining internal gas compositions of a variety of microcircuit package types and ages with a focus on sources of internal moisture, 720606 (9 February 2009); doi: 10.1117/12.807970
Proc. SPIE 7206, In situ measurement of gas diffusion properties of sealing polymers for MEMS packages by an optical gas leak test, 720607 (9 February 2009); doi: 10.1117/12.810001
Proc. SPIE 7206, Dispersive evaluation and self-sensing of single-fiber/acid-treated CNT-epoxy nanocomposites using electromicromechanical techniques and acoustic emission, 720608 (9 February 2009); doi: 10.1117/12.807597
MEMS/MOEMS Reliability
Proc. SPIE 7206, Tribological behavior of micron-scale polycrystalline silicon structural films in ambient air, 72060A (9 February 2009); doi: 10.1117/12.808348
Proc. SPIE 7206, Low-cycle fatigue testing of silicon resonators, 72060B (9 February 2009); doi: 10.1117/12.808180
Proc. SPIE 7206, Reliability study of micromechanical actuators for electrostatic RMS voltage measurements using bulk-silicon technology, 72060C (9 February 2009); doi: 10.1117/12.809464
Testing, Characterization, and Failure Analysis of MEMS/MOEMS I
Proc. SPIE 7206, An acoustic phonon detection test setup for evaluating the frequency stability of clamped-clamped beam resonators, 72060D (9 February 2009); doi: 10.1117/12.809995
Testing, Characterization, and Failure Analysis of MEMS/MOEMS II
Proc. SPIE 7206, Novel test structures for characterization of microsystems parameters at wafer level, 72060E (9 February 2009); doi: 10.1117/12.810051
Proc. SPIE 7206, The concept of a new simple low-voltage cathodoluminescence set-up with CNT field emission cathodes, 72060F (9 February 2009); doi: 10.1117/12.808963
Proc. SPIE 7206, Analysis of image quality for laser display scanner test, 72060G (9 February 2009); doi: 10.1117/12.808674
Proc. SPIE 7206, Environmental testing of COTS components for space applications, 72060H (9 February 2009); doi: 10.1117/12.813408
Proc. SPIE 7206, Development of a novel surface acoustic wave MEMS-IDT gyroscope, 72060I (9 February 2009); doi: 10.1117/12.809991
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