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Fabrication of large-scale monocrystalline silicon micro-mirror arrays using adhesive wafer transfer bonding
Integrated position sensing for 2D microscanning mirrors using the SOI device layer as the piezoresistive mechanical-elastic transformer
Application of Si LEDs (450nm-750nm) in CMOS integrated circuitry-based MOEMS: simulation and analysis
Advanced microbolometer detectors for a next-generation uncooled FPA for space-based thermal remote sensing
Hybrid microtransmitter for free-space optical spacecraft communication: design, manufacturing, and characterization