PROCEEDINGS VOLUME 7221
SPIE OPTO: INTEGRATED OPTOELECTRONIC DEVICES | 24-29 JANUARY 2009
Photonics Packaging, Integration, and Interconnects IX
Proceedings Volume 7221 is from: Logo
SPIE OPTO: INTEGRATED OPTOELECTRONIC DEVICES
24-29 January 2009
San Jose, California, United States
Front Matter
Proc. SPIE 7221, Front Matter: Volume 7221, 722101 (20 March 2009); doi: 10.1117/12.824593
Photonic Integration
Proc. SPIE 7221, Advanced photonic integration and the revolution in optical networks, 722102 (12 February 2009); doi: 10.1117/12.813539
Proc. SPIE 7221, Packaging consideration of two-dimensional polymer-based photonic crystals for laser beam steering, 722104 (18 February 2009); doi: 10.1117/12.811708
Proc. SPIE 7221, An array waveguide sensor for artificial optical skins, 722105 (12 February 2009); doi: 10.1117/12.809154
Planar Photonics
Proc. SPIE 7221, Packaging and system demonstration of an X-band phased array antenna utilizing highly dispersive photonic crystal fiber based true-time-delay, 722107 (18 February 2009); doi: 10.1117/12.811027
Proc. SPIE 7221, Recent advances in planar optical integration, 722108 (12 February 2009); doi: 10.1117/12.810434
Proc. SPIE 7221, Nano-scale optical circuits and self-organized lightwave network (SOLNET) fabricated using sol-gel materials with photo-induced refractive index increase, 722109 (12 February 2009); doi: 10.1117/12.807603
Optical Interconnects: Integration
Proc. SPIE 7221, Three-dimensional optical lines fabricated onto substrate for on-board interconnection, 72210A (12 February 2009); doi: 10.1117/12.806188
Proc. SPIE 7221, Photonic integration and optical interconnects for future communications, computing, and signal processing systems, 72210B (18 February 2009); doi: 10.1117/12.813537
Proc. SPIE 7221, MT-compatible interface between peripheral fiber ribbons and printed circuit board-integrated optical waveguides, 72210C (12 February 2009); doi: 10.1117/12.805405
Proc. SPIE 7221, Out-of-plane coupling using thin glass based arrayed waveguide components, 72210D (12 February 2009); doi: 10.1117/12.809546
Optical Interconnects: Technologies
Proc. SPIE 7221, A silicon photonic WDM network for high-performance macrochip communications, 72210E (12 February 2009); doi: 10.1117/12.813420
Proc. SPIE 7221, Communication technologies for exascale systems, 72210F (18 February 2009); doi: 10.1117/12.815329
Proc. SPIE 7221, "Vanishing-core" tapered coupler for interconnect applications, 72210G (12 February 2009); doi: 10.1117/12.808632
Proc. SPIE 7221, Comparison of long- and short-wavelength optical transmitters for optical PCB applications, 72210H (12 February 2009); doi: 10.1117/12.808407
Optical Interconnects: Polymers
Proc. SPIE 7221, Flexible optical interconnects based on silicon-containing polymers, 72210I (12 February 2009); doi: 10.1117/12.808396
Proc. SPIE 7221, Multimode siloxane polymer components for optical interconnects, 72210J (12 February 2009); doi: 10.1117/12.807713
Proc. SPIE 7221, Impact of technological processing conditions on optical properties of inorganic-organic hybrid polymers, 72210K (12 February 2009); doi: 10.1117/12.810987
Proc. SPIE 7221, Channel waveguide fabrication via microtransfer molding and microfluidic technique, 72210L (18 February 2009); doi: 10.1117/12.810554
Nanophotonic Devices
Proc. SPIE 7221, Limits to silicon modulator bandwidth and power consumption, 72210M (12 February 2009); doi: 10.1117/12.810145
Proc. SPIE 7221, Active control of propagating waves on plasmonic surfaces, 72210P (12 February 2009); doi: 10.1117/12.809614
Integration of Active Components
Proc. SPIE 7221, Large-scale integrated optics using TriPleX waveguide technology: from UV to IR, 72210R (12 February 2009); doi: 10.1117/12.808409
Proc. SPIE 7221, A VCSEL-based miniature laser-self-mixing interferometer with integrated optical and electronic components, 72210S (12 February 2009); doi: 10.1117/12.808810
Proc. SPIE 7221, Wide steering angle optical phased array based on silicon nano-membrane, 72210T (12 February 2009); doi: 10.1117/12.809311
Laser Diode Technologies
Proc. SPIE 7221, Advances in high-power laser diode packaging, 72210U (12 February 2009); doi: 10.1117/12.810549
Proc. SPIE 7221, 4.5 W hybrid integrated master-oscillator power-amplifier at 976 nm on micro-optical bench, 72210W (12 February 2009); doi: 10.1117/12.807064
Proc. SPIE 7221, Improved device bonding performance: precise placement with appropriate thermal and atmospheric control, 72210X (18 February 2009); doi: 10.1117/12.810550
Proc. SPIE 7221, Diode laser beam shaping and propagation characteristics, 72210Y (12 February 2009); doi: 10.1117/12.808352
Optical Interconnects II
Proc. SPIE 7221, Self-organization of coupling optical waveguides by the "pulling water" effect of write beam reflections in photo-induced refractive-index increase media, 722111 (12 February 2009); doi: 10.1117/12.804527
Proc. SPIE 7221, A comparative analysis of short- and long-wavelength multi-chip optical transmitter modules for optical PCBs applications, 722112 (12 February 2009); doi: 10.1117/12.808636
Poster Session
Proc. SPIE 7221, A novel method for studying superprism phenomena in 2-D photonic crystal, 722113 (12 February 2009); doi: 10.1117/12.808371
Proc. SPIE 7221, 4x4 space-time codes for free-space optical interconnects, 722116 (12 February 2009); doi: 10.1117/12.809506
Proc. SPIE 7221, Aspheric nonimaging concentrators for multimode fiber coupling, 722117 (18 February 2009); doi: 10.1117/12.816506
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