Front Matter
Proc. SPIE 7274, Front Matter: Volume 7274, 727401 (8 April 2009); doi: 10.1117/12.828059
Invited Session
Proc. SPIE 7274, Alternative optical technologies: more than curiosities?, 727402 (16 March 2009); doi: 10.1117/12.817219
Resolution Enhancement
Proc. SPIE 7274, Overcoming the challenges of 22-nm node patterning through litho-design co-optimization, 727404 (16 March 2009); doi: 10.1117/12.814433
Proc. SPIE 7274, Improved model predictability by machine data in computational lithography and application to laser bandwidth tuning, 727405 (6 March 2009); doi: 10.1117/12.814644
Proc. SPIE 7274, Contact mask optimization and SRAF design, 727407 (16 March 2009); doi: 10.1117/12.814814
Source and Mask Optimization
Proc. SPIE 7274, A study of source and mask optimization for ArF scanners, 727408 (16 March 2009); doi: 10.1117/12.813400
Proc. SPIE 7274, Enabling process window improvement at 45nm and 32nm with free-form DOE illumination, 72740B (16 March 2009); doi: 10.1117/12.814215
Proc. SPIE 7274, Benefits and trade-offs of global source optimization in optical lithography, 72740C (16 March 2009); doi: 10.1117/12.814305
Spacer-based Processes
Proc. SPIE 7274, Demonstration of 32nm half-pitch electrical testable NAND FLASH patterns using self-aligned double patterning, 72740D (16 March 2009); doi: 10.1117/12.814403
Proc. SPIE 7274, Advanced self-aligned double patterning development for sub-30-nm DRAM manufacturing, 72740E (16 March 2009); doi: 10.1117/12.813986
Proc. SPIE 7274, Process step reduction at negative tone spacer patterning technique using developer soluble bottom ARC, 72740F (16 March 2009); doi: 10.1117/12.814020
Proc. SPIE 7274, Gridded design rule scaling: taking the CPU toward the 16nm node, 72740G (16 March 2009); doi: 10.1117/12.814435
Double Patterning I
Proc. SPIE 7274, Split, overlap/stitching, and process design for double patterning considering local reflectivity variation by using rigorous 3D wafer-topography/lithography simulation, 72740H (16 March 2009); doi: 10.1117/12.813976
Proc. SPIE 7274, Advances and challenges in dual-tone development process optimization, 72740I (16 March 2009); doi: 10.1117/12.814289
Proc. SPIE 7274, New process proximity correction using neural network in spacer patterning technology, 72740J (16 March 2009); doi: 10.1117/12.813614
Proc. SPIE 7274, 32nm and below logic patterning using optimized illumination and double patterning, 72740K (16 March 2009); doi: 10.1117/12.814258
Double Patterning II
Proc. SPIE 7274, Analysis of topography effects on lithographic performance in double patterning applications, 72740M (16 March 2009); doi: 10.1117/12.814193
Proc. SPIE 7274, Ultimate contact hole resolution using immersion lithography with line/space imaging, 72740N (16 March 2009); doi: 10.1117/12.814867
Proc. SPIE 7274, Efficient simulation and optimization of wafer topographies in double patterning, 72740O (16 March 2009); doi: 10.1117/12.814176
Proc. SPIE 7274, Investigating the impact of topography on pitch splitting double patterning using rigorous physical simulation, 72740P (16 March 2009); doi: 10.1117/12.813566
Tools Related Process Control I
Tools Related Process Control II
Optical Proximity Corrections I
Proc. SPIE 7274, A new method for post-etch OPC modeling to compensate for underlayer effects from integrated wafers, 72740Z (16 March 2009); doi: 10.1117/12.813546
Proc. SPIE 7274, Optimal setting strategy for kernel-based OPC simulation engines, 727410 (16 March 2009); doi: 10.1117/12.814049
Proc. SPIE 7274, Improving yield through the application of process window OPC, 727411 (16 March 2009); doi: 10.1117/12.811868
Proc. SPIE 7274, Etch aware optical proximity correction: a first step toward integrated pattern engineering, 727412 (16 March 2009); doi: 10.1117/12.814224
Proc. SPIE 7274, Integrating assist feature print fixing with OPC, 727413 (16 March 2009); doi: 10.1117/12.815171
Proc. SPIE 7274, Double-patterning-friendly OPC, 727414 (16 March 2009); doi: 10.1117/12.815175
Optical Proximity Corrections II
Proc. SPIE 7274, Calibrating OPC model with full CD profile data for 2D and 3D patterns using scatterometry, 727415 (16 March 2009); doi: 10.1117/12.814955
Proc. SPIE 7274, OPC simplification and mask cost reduction using regular design fabrics, 727417 (16 March 2009); doi: 10.1117/12.814406
Proc. SPIE 7274, Resist development modeling for OPC accuracy improvement, 727418 (16 March 2009); doi: 10.1117/12.814902
Optical Proximity Corrections III
Proc. SPIE 7274, OPC for reduced process sensitivity in the double patterning flow, 727419 (16 March 2009); doi: 10.1117/12.814337
Proc. SPIE 7274, Through-focus pattern matching applied to double patterning, 72741A (16 March 2009); doi: 10.1117/12.814190
Resolution Enhancement
Proc. SPIE 7274, A novel methodology for hybrid mask AF generation for 22 and 15nm technology, 72741B (16 March 2009); doi: 10.1117/12.814336
Proc. SPIE 7274, Pushing the limits of RET with different illumination optimization methods, 72741C (16 March 2009); doi: 10.1117/12.814345
Proc. SPIE 7274, A computational technique to optimally design in-situ diffractive elements: applications to projection lithography at the resist resolution limit, 72741E (16 March 2009); doi: 10.1117/12.814251
Process
Proc. SPIE 7274, Defectivity improvement by modified wafer edge treatment in immersion lithography, 72741G (16 March 2009); doi: 10.1117/12.813385
Proc. SPIE 7274, Design of resist stacks with antireflection coatings from the viewpoint of focus budget, 72741H (16 March 2009); doi: 10.1117/12.813367
Tools I
Proc. SPIE 7274, An innovative platform for high-throughput high-accuracy lithography using a single wafer stage, 72741I (16 March 2009); doi: 10.1117/12.813386
Proc. SPIE 7274, Novel approaches to meet the requirements for double patterning, 72741J (16 March 2009); doi: 10.1117/12.813585
Proc. SPIE 7274, Extending single-exposure patterning towards 38-nm half-pitch using 1.35 NA immersion, 72741K (16 March 2009); doi: 10.1117/12.813649
Proc. SPIE 7274, Advanced aberration control in projection optics for double patterning, 72741L (16 March 2009); doi: 10.1117/12.813625
Proc. SPIE 7274, Polarization aberration control for ArF projection lenses, 72741M (16 March 2009); doi: 10.1117/12.813399
Tools II
Proc. SPIE 7274, Modeling laser bandwidth for OPC applications, 72741O (16 March 2009); doi: 10.1117/12.813869