PROCEEDINGS VOLUME 7362
SPIE EUROPE MICROTECHNOLOGIES FOR THE NEW MILLENNIUM | 4-6 MAY 2009
Smart Sensors, Actuators, and MEMS IV
IN THIS VOLUME

0 Sessions, 55 Papers, 0 Presentations
Front Matter  (1)
Biosensors  (3)
Packaging  (3)
Reliability  (3)
Materials  (4)
Proceedings Volume 7362 is from: Logo
SPIE EUROPE MICROTECHNOLOGIES FOR THE NEW MILLENNIUM
4-6 May 2009
Dresden, Germany
Front Matter
Proc. SPIE 7362, Front Matter: Volume 7362, 736201 (17 June 2009); doi: 10.1117/12.834806
Energy Scavengers
Proc. SPIE 7362, Coupled piezoelectric-circuit FEA to study influence of a resistive load on power output of piezoelectric energy devices, 736202 (19 May 2009); doi: 10.1117/12.822829
Proc. SPIE 7362, Increasing sensitivity of vibration energy harvester, 736203 (19 May 2009); doi: 10.1117/12.820919
Proc. SPIE 7362, Analytical characterization and experimental validation of performances of piezoelectric vibration energy scavengers, 736204 (19 May 2009); doi: 10.1117/12.821425
Proc. SPIE 7362, Thermoelectric thin film power generators: self-sustaining power supply for smart systems, 736205 (19 May 2009); doi: 10.1117/12.821606
Biosensors
Proc. SPIE 7362, New transducer material concepts for biosensors and surface functionalization, 736206 (19 May 2009); doi: 10.1117/12.821662
Proc. SPIE 7362, Fast detection of air contaminants using immunobiological methods, 736207 (19 May 2009); doi: 10.1117/12.822672
Proc. SPIE 7362, Sputtered polycrystalline AlN as a platform for biofunctionalized devices, 736208 (19 May 2009); doi: 10.1117/12.821653
Resonant MEMS
Proc. SPIE 7362, Analysis of the quality factor of piezoelectric-actuated micro-resonators, 73620A (19 May 2009); doi: 10.1117/12.821651
Proc. SPIE 7362, An envelope model to describe the sensor dynamics of vibratory gyroscopes, 73620B (19 May 2009); doi: 10.1117/12.821705
Packaging
Proc. SPIE 7362, Manufacturing, assembling and packaging of miniaturized implants for neural prostheses and brain-machine interfaces, 73620C (19 May 2009); doi: 10.1117/12.822279
Proc. SPIE 7362, Packaging of MEMS microphones, 73620D (19 May 2009); doi: 10.1117/12.821186
Proc. SPIE 7362, Adhesive wafer bonding using photosensitive polymer layers, 73620E (19 May 2009); doi: 10.1117/12.821725
Polymer Devices
Proc. SPIE 7362, Voltage tuning of the resonance frequency of electroactive polymer membranes over a range of more than 75%, 73620F (19 May 2009); doi: 10.1117/12.820243
Proc. SPIE 7362, Tactile sensors based on conductive polymers, 73620G (19 May 2009); doi: 10.1117/12.821627
Proc. SPIE 7362, A new concept for dielectric elastomer actuators: hydrostatic coupling, 73620H (19 May 2009); doi: 10.1117/12.821712
Proc. SPIE 7362, Ionic polymer-metal composites (IPMCs) containing Cu/Ni electrodes and ionic liquids for durability, 73620I (19 May 2009); doi: 10.1117/12.821169
Piezoelectric MEMS
Proc. SPIE 7362, Aluminium nitride: a promising and full CMOS compatible piezoelectric material for MOEMS applications, 73620J (19 May 2009); doi: 10.1117/12.821715
Proc. SPIE 7362, Characterization and simulation of high-quality AlN-actuated resonant suspended beams, 73620K (19 May 2009); doi: 10.1117/12.821636
Proc. SPIE 7362, What happens turning a 250µm thin piezo-stack sideways? An experimental and analytical approach to one-side-actuated piezoelectric micro drives, regarding electrode layouts and directions of deflection, 73620L (19 May 2009); doi: 10.1117/12.821320
Proc. SPIE 7362, Robust superelastic, metallic amplification unit for piezoelectric microactuators, 73620M (19 May 2009); doi: 10.1117/12.821727
Reliability
Proc. SPIE 7362, New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level, 73620N (19 May 2009); doi: 10.1117/12.820977
Proc. SPIE 7362, Single crystalline silicon-based surface micromachining for high-precision inertial sensors: technology and design for reliability, 73620O (19 May 2009); doi: 10.1117/12.821643
Proc. SPIE 7362, Reliability of Ag thin films sputter deposited on silicon and ceramic based substrates, 73620P (19 May 2009); doi: 10.1117/12.821328
Chemical Sensors
Proc. SPIE 7362, FIB generated antimony nanowires as chemical sensors, 73620Q (19 May 2009); doi: 10.1117/12.822150
Proc. SPIE 7362, Fast transient temperature operating micromachined emitter for mid-infrared for optical gas sensing systems, 73620S (19 May 2009); doi: 10.1117/12.821645
Materials
Proc. SPIE 7362, Tuned wettability of material surfaces for tribological applications in miniaturized systems by laser interference metallurgy, 73620U (19 May 2009); doi: 10.1117/12.821661
Proc. SPIE 7362, Electrical and mechanical characterization of low temperature co-fired ceramics for high temperature sensor applications, 73620V (19 May 2009); doi: 10.1117/12.822665
Proc. SPIE 7362, New perspectives for pressure and force sensors thin films combining high gauge factor and low TCR, 73620W (19 May 2009); doi: 10.1117/12.820496
Proc. SPIE 7362, Silicon oxide sacrificial layers deposited by pulsed-DC magnetron sputtering for MEMS applications, 73620X (19 May 2009); doi: 10.1117/12.821485
Optical Systems
Proc. SPIE 7362, 3.0-3.7μm infrared sensor system for cell analysis, 73620Y (19 May 2009); doi: 10.1117/12.822058
Proc. SPIE 7362, Silicon comb-drive X-Y microstage with frame-in-the-frame architecture for MOEMS applications, 736210 (19 May 2009); doi: 10.1117/12.821460
Proc. SPIE 7362, Design and fabrication of self-assembling micromirror arrays, 736211 (19 May 2009); doi: 10.1117/12.821686
Poster Session
Proc. SPIE 7362, Position encoding and closed loop control of MOEMS translatory actuators, 736212 (19 May 2009); doi: 10.1117/12.820335
Proc. SPIE 7362, ICP cryogenic dry etching for shallow and deep etching in silicon, 736213 (19 May 2009); doi: 10.1117/12.820917
Proc. SPIE 7362, A method for improving the drop test performance of a MEMS microphone, 736214 (19 May 2009); doi: 10.1117/12.821187
Proc. SPIE 7362, Test-bed for the remote health monitoring system for bridge structures using FBG sensors, 736215 (19 May 2009); doi: 10.1117/12.821304
Proc. SPIE 7362, Influence of back pressure and plasma power on grain size, phase composition and resistivity of tantalum thin films, 736216 (19 May 2009); doi: 10.1117/12.821332
Proc. SPIE 7362, Selective wet chemical etching of metallic thin films designed by laser interference metallurgy (LIMET), 736217 (19 May 2009); doi: 10.1117/12.821333
Proc. SPIE 7362, Piezoresistive chemical sensors based on hydrogels, 736218 (19 May 2009); doi: 10.1117/12.821335
Proc. SPIE 7362, Deformation measurements of high-speed MEMS with sub-picosecond pulses using combined digital holographic two-wavelength contouring and single phase reconstruction, 736219 (19 May 2009); doi: 10.1117/12.821341
Proc. SPIE 7362, High-resolution eddy current sensor system, 73621A (19 May 2009); doi: 10.1117/12.821443
Proc. SPIE 7362, Fabrication and characterization of yttria-stabilized zirconia membranes for micro solid oxide fuel cells, 73621B (19 May 2009); doi: 10.1117/12.821613
Proc. SPIE 7362, RF MEMS switches based on an alloy of aluminum-silicon-copper, 73621D (19 May 2009); doi: 10.1117/12.821648
Proc. SPIE 7362, Micromechanical sensors based on lateral and longitudinal displacement of a cantilever sensing element: a comparative performance study, 73621E (19 May 2009); doi: 10.1117/12.821655
Proc. SPIE 7362, Adsorption-desorption noise in plasmonic chemical/biological sensors in multiple analyte environment, 73621F (19 May 2009); doi: 10.1117/12.821663
Proc. SPIE 7362, Ultrasonic motor model and power analysis for industrial mobile applications, 73621G (19 May 2009); doi: 10.1117/12.821674
Proc. SPIE 7362, Motion planning for an adaptive wing structure with macro-fiber composite actuators, 73621H (19 May 2009); doi: 10.1117/12.821699
Proc. SPIE 7362, Novel measurement and monitoring system for forming processes based on piezoresistive thin film systems, 73621J (19 May 2009); doi: 10.1117/12.821729
Proc. SPIE 7362, Growth of ZnO nanorods on patterned templates for energy harvesting applications, 73621L (19 May 2009); doi: 10.1117/12.821786
Proc. SPIE 7362, Characterisation of the intrinsic stress in micromachined parylene membranes, 73621M (19 May 2009); doi: 10.1117/12.821797
Proc. SPIE 7362, Comparison between AlN thin films with different crystal orientations for MEMS applications, 73621N (19 May 2009); doi: 10.1117/12.821858
Proc. SPIE 7362, Design, fabrication and characterization of a micro-fluxgate intended for parallel robot application, 73621P (19 May 2009); doi: 10.1117/12.822280
Proc. SPIE 7362, SAW-grade SiO[sub]2[/sub] for advanced microfluidic devices, 73621Q (19 May 2009); doi: 10.1117/12.822290
Proc. SPIE 7362, Power management circuit for resonant energy harvesters, 73621S (19 May 2009); doi: 10.1117/12.822822
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