PROCEEDINGS VOLUME 7590
SPIE MOEMS-MEMS | 23-28 JANUARY 2010
Micromachining and Microfabrication Process Technology XV
IN THIS VOLUME

0 Sessions, 20 Papers, 0 Presentations
Front Matter  (1)
Proceedings Volume 7590 is from: Logo
SPIE MOEMS-MEMS
23-28 January 2010
San Francisco, California, United States
Front Matter
Proc. SPIE 7590, Front Matter: Volume 7590, 759001 (24 March 2010); doi: 10.1117/12.861995
Lasers and Laser-Based Processing
Proc. SPIE 7590, Ultrafast pulsed laser micro-deposition printing on transparent media, 759002 (11 February 2010); doi: 10.1117/12.842806
Proc. SPIE 7590, Coaxial real-time metrology and gas assisted laser micromachining: process development, stochastic behavior, and feedback control, 759003 (17 February 2010); doi: 10.1117/12.842409
Proc. SPIE 7590, Sub-micron machining of semiconductors: femtosecond surface ripples on GaAs by 2 um laser light, 759004 (25 February 2010); doi: 10.1117/12.843701
Proc. SPIE 7590, Polarization converted laser beams for micromachining applications, 759006 (17 February 2010); doi: 10.1117/12.842141
Proc. SPIE 7590, Enhancing laser scanner accuracy by grid correction, 759007 (17 February 2010); doi: 10.1117/12.841741
Device Processing
Proc. SPIE 7590, Multilayer metal micromachining for THz waveguide fabrication, 759009 (17 February 2010); doi: 10.1117/12.840247
Proc. SPIE 7590, Fabrication of plastic microlens arrays for array microscopy by diamond milling techniques, 75900A (17 February 2010); doi: 10.1117/12.840794
Proc. SPIE 7590, Diamond turning of aspheric steel molds for optics replication, 75900B (17 February 2010); doi: 10.1117/12.839422
Proc. SPIE 7590, Alternative technology for fabrication of nano- or microstructured mould inserts used for optical components, 75900D (17 February 2010); doi: 10.1117/12.841894
Proc. SPIE 7590, Development of micro-incandescent light sources on silicon substrate, 75900E (17 February 2010); doi: 10.1117/12.842432
Processing, Metrology, Coatings
Proc. SPIE 7590, Optimizing galvanic pulse plating parameters to improve indium bump to bump bonding, 75900F (17 February 2010); doi: 10.1117/12.842569
Proc. SPIE 7590, Advances in photonic MOEMS-MEMS device thinning and polishing, 75900G (17 February 2010); doi: 10.1117/12.842051
Proc. SPIE 7590, Kinetic investigations on TiO2 nanoparticles as photo initiators for UV-polymerization in acrylic matrix, 75900I (17 February 2010); doi: 10.1117/12.841647
Proc. SPIE 7590, Investigation on particle generation by micro-electro discharge machining, 75900J (17 February 2010); doi: 10.1117/12.845709
Proc. SPIE 7590, Estimation of tool wear compensation during micro-electro-discharge machining of silicon using process simulation, 75900K (17 February 2010); doi: 10.1117/12.845953
Poster Session
Proc. SPIE 7590, Alternative method for steam generation for thermal oxidation of silicon, 75900L (17 February 2010); doi: 10.1117/12.839622
Proc. SPIE 7590, Manufacturability of gas sensor with ZnO nanoparticles suspension deposited by ink jet printing, 75900M (17 February 2010); doi: 10.1117/12.840417
Proc. SPIE 7590, Electrode micropatterning by microcontact printing method to large area substrates using nickel mold, 75900N (17 February 2010); doi: 10.1117/12.840588
Proc. SPIE 7590, Laser microstructuring of sapphire wafer and fiber, 75900O (17 February 2010); doi: 10.1117/12.841098
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