PROCEEDINGS VOLUME 7592
SPIE MOEMS-MEMS | 23-28 JANUARY 2010
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Proceedings Volume 7592 is from: Logo
SPIE MOEMS-MEMS
23-28 January 2010
San Francisco, California, United States
Front Matter
Proc. SPIE 7592, Front Matter: Volume 7592, 759201 (24 March 2010); doi: 10.1117/12.861997
MEMS Packaging: Hermeticity Characterization
Proc. SPIE 7592, Nanoengineered surfaces for microfluidic-based thermal management devices, 759202 (5 February 2010); doi: 10.1117/12.842950
Proc. SPIE 7592, A new method for hermeticity testing of wafer-level packaging, 759203 (5 February 2010); doi: 10.1117/12.839860
Proc. SPIE 7592, Pressure sensing in vacuum hermetic micropackaging for MOEMS-MEMS, 759204 (5 February 2010); doi: 10.1117/12.840931
Proc. SPIE 7592, Wafer-level vacuum/hermetic packaging technologies for MEMS, 759205 (5 February 2010); doi: 10.1117/12.843831
Proc. SPIE 7592, Characterization of polymeric getter materials for MEMS/MOEMS and other microelectronic package service, 759206 (5 February 2010); doi: 10.1117/12.843859
Proc. SPIE 7592, Hermetic vacuum sealing of MEMS devices containing organic components, 759207 (5 February 2010); doi: 10.1117/12.845902
Reliability and RF MEMS
Proc. SPIE 7592, Predicting reliability of silicon MEMS, 759208 (5 February 2010); doi: 10.1117/12.845008
Proc. SPIE 7592, Stability experiments on MEMS aluminum nitride RF resonators, 759209 (5 February 2010); doi: 10.1117/12.846551
Proc. SPIE 7592, Characterization of Au/Au, Au/Ru, and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology, 75920A (5 February 2010); doi: 10.1117/12.840979
Proc. SPIE 7592, Novel test fixture for collecting microswitch reliability data, 75920B (5 February 2010); doi: 10.1117/12.842009
Proc. SPIE 7592, Reliability study of a MEMS array under varying temperature and humidity conditions, 75920C (5 February 2010); doi: 10.1117/12.842384
Packaging and MEMS Reliability
Proc. SPIE 7592, The effects of plasma pretreatment and storage time on silicon fusion bonding, 75920D (5 February 2010); doi: 10.1117/12.839972
Proc. SPIE 7592, Lifetime estimation and reliability study of electrothermal MEMS actuators, 75920E (17 February 2010); doi: 10.1117/12.842410
Proc. SPIE 7592, Reliability assessment of ceramic column grid array (CCGA717) interconnect packages under extreme temperatures for space applications (-185°C to +125°C), 75920F (5 February 2010); doi: 10.1117/12.844998
Proc. SPIE 7592, Packaged bulk micromachined triglyceride biosensor, 75920G (5 February 2010); doi: 10.1117/12.846477
Proc. SPIE 7592, MEMS/microfluidics packaging without heating, 75920H (5 February 2010); doi: 10.1117/12.845291
Proc. SPIE 7592, Use of conductive adhesive for MEMS interconnection in military fuze applications, 75920I (5 February 2010); doi: 10.1117/12.840890
MEMS Testing and Inspection
Proc. SPIE 7592, Modeling time-dependent dielectric breakdown with and without barriers, 75920J (5 February 2010); doi: 10.1117/12.839979
Proc. SPIE 7592, Remotely accessible laboratory for MEMS testing, 75920K (5 February 2010); doi: 10.1117/12.842465
Proc. SPIE 7592, Optical inspection of MOEMS devices using a configurable and suitable for production image processing system, 75920L (5 February 2010); doi: 10.1117/12.845075
Proc. SPIE 7592, Low-cost system for testing MEMS for research and educational applications, 75920M (5 February 2010); doi: 10.1117/12.842560
MEMS Applications
Proc. SPIE 7592, Engineered nanowires, carbon nanotubes and graphene for sensors, actuators and electronics, 75920N (5 February 2010); doi: 10.1117/12.840439
Proc. SPIE 7592, Optimal design of SAW-based gyroscope to improve sensitivity, 75920O (5 February 2010); doi: 10.1117/12.841531
Proc. SPIE 7592, Temperature measurement on MOEMS micromirror plates under illumination, 75920P (5 February 2010); doi: 10.1117/12.842066
Proc. SPIE 7592, Development and testing of a multi-level chevron actuator based positioning system, 75920Q (17 February 2010); doi: 10.1117/12.842270
Proc. SPIE 7592, Development of a microlens array (MLA) for maskless photolithography application, 75920R (5 February 2010); doi: 10.1117/12.841552
Proc. SPIE 7592, A 2-DOF MEMS positioning system, 75920S (17 February 2010); doi: 10.1117/12.842435
Proc. SPIE 7592, The influence of the arrangement and spacing of CNT column array on the characteristic of field emission, 75920T (5 February 2010); doi: 10.1117/12.842887
Proc. SPIE 7592, Self-aligned maskless process for etching cavities in SOI wafers to enhance the quality factor of MEMS resonators, 75920U (5 February 2010); doi: 10.1117/12.843078
Mechanical Properties
Proc. SPIE 7592, Thermal microactuator performance as a function of mechanical stress, 75920V (5 February 2010); doi: 10.1117/12.846370
Proc. SPIE 7592, Mitigating the irreversible deformation with pressure in silicon/porous silicon composite membranes, 75920W (5 February 2010); doi: 10.1117/12.846480
Proc. SPIE 7592, Investigation into metamaterial structures operating at terahertz wavelength, 75920X (17 February 2010); doi: 10.1117/12.842858
Poster Session
Proc. SPIE 7592, Performance and reliability assessment of a dielectric charging guard in MEMS optical switch systems, 75920Z (5 February 2010); doi: 10.1117/12.851714
Back to Top