Front Matter
Proc. SPIE 7607, Front Matter: Volume 7607, 760701 (30 March 2010); doi: 10.1117/12.858989
Ultra-Performance Nanophotonic Interconnects
Proc. SPIE 7607, "Macrochip" computer systems enabled by silicon photonic interconnects, 760702 (16 February 2010); doi: 10.1117/12.842818
Proc. SPIE 7607, Ultralow-power silicon photonic interconnect for high-performance computing systems, 760703 (16 February 2010); doi: 10.1117/12.842884
Proc. SPIE 7607, A compact high-performance germanium photodetector integrated on 0.25um thick silicon-on-insulator waveguide, 760704 (16 February 2010); doi: 10.1117/12.841052
Proc. SPIE 7607, Coupled vertical gratings on silicon for applications in wavelength division multiplexing, 760705 (16 February 2010); doi: 10.1117/12.841061
Optical Interconnect System Integration
Proc. SPIE 7607, 200Gb/s 10-channel miniature optical interconnect transmitter module for high-performance computing (HPC), 760709 (16 February 2010); doi: 10.1117/12.842229
Optical Interconnects: Integration and Packaging I
Proc. SPIE 7607, True bidirectional optical interconnects over multimode fiber, 76070B (16 February 2010); doi: 10.1117/12.844119
Proc. SPIE 7607, Thermally tunable SOI CMOS photonics circuits, 76070C (16 February 2010); doi: 10.1117/12.842903
Proc. SPIE 7607, Ultra-compact silicon nanophotonic modulator based on electro-optic polymer infiltrated slot photonic crystal waveguide, 76070D (24 February 2010); doi: 10.1117/12.843884
Proc. SPIE 7607, Converging technologies and demands toward high-bandwidth optical interconnects, 76070E (16 February 2010); doi: 10.1117/12.843043
Optical Interconnects: Integration and Packaging II
Proc. SPIE 7607, New options for chip-to-chip photonic packaging by using thin glass-based waveguide substrates on board and module level, 76070F (16 February 2010); doi: 10.1117/12.843818
Proc. SPIE 7607, Packaging of opto-electronic devices for flexible applications, 76070G (16 February 2010); doi: 10.1117/12.841553
Proc. SPIE 7607, Modulation-enabled tapered remote coupler: all-optical communication on and off chip, 76070H (23 February 2010); doi: 10.1117/12.845996
Proc. SPIE 7607, Heterogeneous integration of thin film compound semiconductor lasers and SU8 waveguides on SiO2/Si, 76070I (16 February 2010); doi: 10.1117/12.842379
Electro-optic Printed Circuit Boards I
Proc. SPIE 7607, Design and implementation of an electro-optical backplane with pluggable in-plane connectors, 76070J (23 February 2010); doi: 10.1117/12.841985
Proc. SPIE 7607, Polymer waveguide-based multilayer optical connector, 76070K (23 February 2010); doi: 10.1117/12.841904
Proc. SPIE 7607, Compact electro-optical module with polymer waveguides on a flexible substrate for high-density board-level communication, 76070L (23 February 2010); doi: 10.1117/12.840623
Proc. SPIE 7607, Mass production of planar polymer waveguides and their applications, 76070M (24 February 2010); doi: 10.1117/12.841581
Electro-optic Printed Circuit Boards II
Proc. SPIE 7607, Optical transceiver integrated on PCB using electro-optic connectors compatible with pick-and-place assembly technology, 76070O (23 February 2010); doi: 10.1117/12.844871
Proc. SPIE 7607, Optical bus waveguide metallic hard mold fabrication with opposite 45º micro-mirrors, 76070P (24 February 2010); doi: 10.1117/12.844486
Proc. SPIE 7607, Optical link between FPGA microprocessors using a fiber-embedded rigid PCB, 76070Q (23 February 2010); doi: 10.1117/12.843146
Proc. SPIE 7607, Flexible polymer optical layer for board-level optical interconnects by highly durable metal imprinting method, 76070R (24 February 2010); doi: 10.1117/12.841173
Materials for Optical Interconnects
Proc. SPIE 7607, Optical and electrical hybrid flexible printed circuit boards with unique photo-defined polymer waveguide layers, 76070S (23 February 2010); doi: 10.1117/12.843626
Proc. SPIE 7607, Optical interface devices applying UV curable resin for flexible optical interconnection, 76070T (23 February 2010); doi: 10.1117/12.840129
Proc. SPIE 7607, Thermally stable and low-loss optical waveguide using optical-fiber-embedded epoxy matrix for optical printed-circuit board applications, 76070V (24 February 2010); doi: 10.1117/12.842247
Active Components for Optical Interconnects
Proc. SPIE 7607, Cost-effective WDM optical interconnects enabled by quantum dot comb lasers, 76070W (23 February 2010); doi: 10.1117/12.843587
Proc. SPIE 7607, Bias-free Y-branch waveguide modulator based on domain-inversed modulation of electro-optic polymer, 76070X (23 February 2010); doi: 10.1117/12.843832
Proc. SPIE 7607, Improved silicon light emission for reach- and punch-through devices in standard CMOS, 76070Z (23 February 2010); doi: 10.1117/12.841357
Proc. SPIE 7607, Design of a multi-GHz SiGe HBT EO modulator, 760710 (23 February 2010); doi: 10.1117/12.843269
EO Component Integration and Packaging
Proc. SPIE 7607, Laser-formed bumps on glass for precision alignment of planar optical components, 760711 (23 February 2010); doi: 10.1117/12.842386
Proc. SPIE 7607, Life-stress relationship for thin film transistor gate line interconnects on flexible substrates, 760712 (24 February 2010); doi: 10.1117/12.840044
Proc. SPIE 7607, Silicon-integrated photonic circuit for a single-stage large-angle beam steering optical phased array, 760713 (24 February 2010); doi: 10.1117/12.843833
Proc. SPIE 7607, Differential photo-acoustic gas cell based on LTCC for ppm gas sensing, 760714 (24 February 2010); doi: 10.1117/12.841363
Proc. SPIE 7607, Micro-optics packaging and integration for structured laser beam shaping, 760715 (24 February 2010); doi: 10.1117/12.841190
Fiber Optics Links and Devices: Joint Session with Conference 7621
Poster Session
Proc. SPIE 7607, Analytical formula for output phase of symmetrically excited one-to-N multimode interference coupler, 760718 (24 February 2010); doi: 10.1117/12.839906
Proc. SPIE 7607, Optimum operation of single cavity photonic switches, 760719 (24 February 2010); doi: 10.1117/12.840463
Proc. SPIE 7607, Electro-optic cosite interference mitigation, 76071A (24 February 2010); doi: 10.1117/12.842240
Proc. SPIE 7607, Design of analog-type high-speed SerDes using digital components for optical chip-to-chip link, 76071B (24 February 2010); doi: 10.1117/12.843063
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