Front Matter
Proc. SPIE 7637, Front Matter: Volume 7637, 763701 (19 April 2010); doi: 10.1117/12.863900
Keynote Session
Proc. SPIE 7637, Maskless lithography and nanopatterning with electron and ion multibeam projection, 763703 (1 April 2010); doi: 10.1117/12.852226
Nanoimprint Lithography I: UV-NIL
Proc. SPIE 7637, Step and flash imprint lithography for semiconductor high volume manufacturing?, 763706 (1 April 2010); doi: 10.1117/12.846617
Proc. SPIE 7637, Planarizing material for reverse-tone step and flash imprint lithography, 763708 (3 April 2010); doi: 10.1117/12.846430
Maskless Lithography I
Proc. SPIE 7637, E-beam maskless lithography: prospects and challenges, 76370A (1 April 2010); doi: 10.1117/12.852229
Proc. SPIE 7637, 50 keV electron-beam projection maskless lithography (PML2): results obtained with 2,500 programmable 12.5-nm sized beams, 76370B (1 April 2010); doi: 10.1117/12.846544
Proc. SPIE 7637, Evaluation of throughput improvement by MCC and CP in multicolumn e-beam exposure system, 76370C (11 March 2010); doi: 10.1117/12.846464
Proc. SPIE 7637, Evaluation of maskless electron beam direct writing with double character projection apertures, 76370D (1 April 2010); doi: 10.1117/12.846461
Proc. SPIE 7637, Multiple pass exposure in e-beam lithography: application to the sub-22nm nodes, 76370E (1 April 2010); doi: 10.1117/12.846907
Proc. SPIE 7637, MAPPER: high-throughput maskless lithography, 76370F (1 April 2010); doi: 10.1117/12.849480
Directed Self-Assembly I: Selected Semiconductor Applications: Joint Session with Conference 7639
Proc. SPIE 7637, Self-assembling materials for lithographic patterning: overview, status, and moving forward, 76370G (1 April 2010); doi: 10.1117/12.852230
Proc. SPIE 7637, Templated self-assembly of Si-containing block copolymers for nanoscale device fabrication, 76370H (30 March 2010); doi: 10.1117/12.848502
Proc. SPIE 7637, CMOS process compatible directed block copolymer self-assembly for 20nm contact holes and beyond, 76370I (2 April 2010); doi: 10.1117/12.848430
Directed Self-Assembly II: Processing and Functional Diversification
Proc. SPIE 7637, Directed assembly of block copolymers on lithographically defined surfaces, 76370L (1 April 2010); doi: 10.1117/12.852263
Proc. SPIE 7637, Adhesion of DNA nanostructures and DNA origami to lithographically patterned self-assembled monolayers on Si[100], 76370M (2 April 2010); doi: 10.1117/12.848392
Proc. SPIE 7637, Electron-beam directed materials assembly, 76370N (2 April 2010); doi: 10.1117/12.846000
Proc. SPIE 7637, Self-assembling nanosphere lithography process for gated carbon nanotube field emission arrays, 76370O (2 April 2010); doi: 10.1117/12.846626
Proc. SPIE 7637, Field-based simulations of directed self-assembly in a mixed brush system, 76370P (2 April 2010); doi: 10.1117/12.848416
Nanoimprint Lithography II: Imprint Mask Infrastructure
Proc. SPIE 7637, Inspection of imprint lithography patterns for semiconductor and patterned media, 76370R (1 April 2010); doi: 10.1117/12.848391
Proc. SPIE 7637, Fully automated hot embossing processes utilizing high resolution working stamps, 76370S (3 April 2010); doi: 10.1117/12.846841
Proc. SPIE 7637, Automating molecular transfer lithography at 25nm on 200mm wafers including site-remote coating of resist on dissolvable templates, 76370U (3 April 2010); doi: 10.1117/12.848402
Maskless Lithography II
Proc. SPIE 7637, Nanoprobe maskless lithography, 76370V (3 April 2010); doi: 10.1117/12.852265
Proc. SPIE 7637, Conventional and reversed image printing in electron beam direct write lithography with proximity effect corrections based on dose and shape modification, 76370W (3 April 2010); doi: 10.1117/12.846514
Proc. SPIE 7637, Full-chip high resolution electron-beam lithography proximity effect correction modeling, 76370X (3 April 2010); doi: 10.1117/12.846681
Novel Methods and Applications I
Proc. SPIE 7637, Biomolecular architectures and systems for nanoscience engineering, 763710 (3 April 2010); doi: 10.1117/12.852266
Proc. SPIE 7637, Performance evaluation of MOSFETs with discrete dopant distribution by one-by-one doping method, 763711 (3 April 2010); doi: 10.1117/12.848322
Proc. SPIE 7637, Surface electron emission lithography system based on a planar type Si nanowire array ballistic electron source, 763712 (3 April 2010); doi: 10.1117/12.846343
Proc. SPIE 7637, Flying plasmonic lens at near field for high speed nanolithography, 763713 (3 April 2010); doi: 10.1117/12.848370
Maskless Lithography III: Optical Maskless Lithography
Proc. SPIE 7637, Multi-shaped beam proof of lithography, 763715 (3 April 2010); doi: 10.1117/12.846529
Proc. SPIE 7637, Hardware implementation of Block GC3 lossless compression algorithm for direct-write lithography systems, 763716 (3 April 2010); doi: 10.1117/12.846447
Proc. SPIE 7637, Characteristics performance of production-worthy multiple e-beam maskless lithography, 763717 (3 April 2010); doi: 10.1117/12.848319
Proc. SPIE 7637, Advances in DMD-based UV application reliability below 320nm, 763718 (1 April 2010); doi: 10.1117/12.848461
Nanoimprint Lithography III: Selected Imprint Applications
Proc. SPIE 7637, High volume jet and flash imprint lithography for discrete track patterned media, 76371A (3 April 2010); doi: 10.1117/12.849226
Novel Methods and Applications II
Proc. SPIE 7637, Tip-based nanofabrication: an approach to true nanotechnology, 76371D (3 April 2010); doi: 10.1117/12.852269
Proc. SPIE 7637, Direct write 3-dimensional nanopatterning using probes, 76371E (3 April 2010); doi: 10.1117/12.847290
Proc. SPIE 7637, High throughput plasmonic lithography for sub 50nm patterning with a contact probe, 76371F (3 April 2010); doi: 10.1117/12.848329
Proc. SPIE 7637, Maskless plasmonic lithography for patterning of one- and two-dimensional periodic features, 76371G (3 April 2010); doi: 10.1117/12.847981
Cross-Cutting Technologies
Proc. SPIE 7637, SLICE image analysis for diblock copolymer characterization and process optimization, 76371J (3 April 2010); doi: 10.1117/12.848378
Proc. SPIE 7637, Monitor and self-diagnostic technology for mask e-beam writing system, 76371K (3 April 2010); doi: 10.1117/12.846266
Proc. SPIE 7637, Lossless compression algorithm for REBL direct-write e-beam lithography system, 76371L (3 April 2010); doi: 10.1117/12.845506
Poster Session
Proc. SPIE 7637, Full area pattern decomposition of self-aligned double patterning for 30nm node NAND FLASH process, 76371N (3 April 2010); doi: 10.1117/12.845831
Proc. SPIE 7637, A novel lithography process for 3D (three-dimensional) interconnect using an optical direct-writing exposure system, 76371O (3 April 2010); doi: 10.1117/12.846013
Proc. SPIE 7637, Architecture for next-generation massively parallel maskless lithography system (MPML2), 76371Q (3 April 2010); doi: 10.1117/12.846444
Proc. SPIE 7637, Nanoimprint template fabrication using wafer pattern for sub-30nm, 76371R (3 April 2010); doi: 10.1117/12.846481
Proc. SPIE 7637, CP based EBDW throughput enhancement for 22nm high volume manufacturing, 76371S (3 April 2010); doi: 10.1117/12.846492
Proc. SPIE 7637, Monte Carlo modeling of BSE reflection in e-beam writers, 76371T (3 April 2010); doi: 10.1117/12.846517
Proc. SPIE 7637, Investigation of lithographic feature characteristics using UV cure as a pitch doubling stabilization technology for the 32nm node and beyond, 76371U (3 April 2010); doi: 10.1117/12.846624
Proc. SPIE 7637, Model-based proximity effect correction for electron-beam direct-write lithography, 76371V (3 April 2010); doi: 10.1117/12.846706
Proc. SPIE 7637, High volume manufacturing of nanoimprint lithography produced devices: addressing the stamp supply challenge, 76371X (3 April 2010); doi: 10.1117/12.848332
Proc. SPIE 7637, Operation and performance of the CNSE Vistec VB300 electron beam lithography system, 76371Y (3 April 2010); doi: 10.1117/12.848396
Proc. SPIE 7637, Throughput enhancement technique for MAPPER maskless lithography, 76371Z (3 April 2010); doi: 10.1117/12.849447
Proc. SPIE 7637, Design and fabrication of Si-based photonic crystal stamps with electron beam lithography (EBL), 763720 (3 April 2010); doi: 10.1117/12.848266
Proc. SPIE 7637, A first order analysis of scatterometry sensitivity for NIL process, 763721 (3 April 2010); doi: 10.1117/12.855872
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