Front Matter
Proc. SPIE 7944, Front Matter: Volume 7944, 794401 (19 February 2011); doi: 10.1117/12.891111
Ultra-Performance Nanophotonic Interconnects (UNIC Program)
Proc. SPIE 7944, Low-power thermal tuning of SOI-CMOS photonic structures, 794402 (18 January 2011); doi: 10.1117/12.876428
Proc. SPIE 7944, Low-power photonic components for optical interconnects, 794403 (18 January 2011); doi: 10.1117/12.876425
Proc. SPIE 7944, Grating-coupler-based optical proximity coupling for scalable computing systems, 794405 (18 January 2011); doi: 10.1117/12.876443
Waveguide Technologies for Optical Interconnects
Proc. SPIE 7944, Evaluation of graded index glass waveguides for board-level WDM optical chip-to-chip communications, 794406 (18 January 2011); doi: 10.1117/12.876458
Proc. SPIE 7944, Next generation optical interconnection technology: high-performance photonics polymers for optical waveguide fabrication and evaluation, 794407 (9 February 2011); doi: 10.1117/12.878661
Proc. SPIE 7944, PCB with fully integrated optical interconnects, 794408 (18 January 2011); doi: 10.1117/12.873744
Proc. SPIE 7944, Optical loss characterization of polymer waveguides on halogen and halogen-free FR-4 substrates, 794409 (18 January 2011); doi: 10.1117/12.866081
Optical Interconnects: Integration and Packaging
Proc. SPIE 7944, 20 Gbps optical link with high-efficiency 1060 nm VCSEL, 79440A (18 January 2011); doi: 10.1117/12.873726
Proc. SPIE 7944, Hybrid-integrated silicon photonic bridge chips for ultralow-energy inter-chip communications, 79440B (18 January 2011); doi: 10.1117/12.876526
Proc. SPIE 7944, Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level, 79440C (18 January 2011); doi: 10.1117/12.874508
Proc. SPIE 7944, A concept for the assembly and alignment of arrayed microelectronic and micro-optical systems for optical multi-gigabit communication, 79440D (18 January 2011); doi: 10.1117/12.873842
Polymer Optical Interconnects
Proc. SPIE 7944, Packaging technology enabling flexible optical interconnections, 79440E (18 January 2011); doi: 10.1117/12.874959
Proc. SPIE 7944, Transfer and characterization of silicon nanomembrane-based photonic devices on flexible polyimide substrate, 79440F (10 February 2011); doi: 10.1117/12.876037
Proc. SPIE 7944, Autonomous and dynamic reconfigurable waveguide for optical interconnection with large shift-tolerance, 79440G (18 May 2011); doi: 10.1117/12.874389
Proc. SPIE 7944, Inter-channel crosstalk analysis for W-shaped and graded-index core polymer optical waveguides with ray tracing method, 79440H (18 January 2011); doi: 10.1117/12.873988
Active Modules for Optical Links
Proc. SPIE 7944, 300 Gb/s bidirectional fiber-coupled optical transceiver module based on 24 TX + 24 RX "holey" CMOS IC, 79440I (18 January 2011); doi: 10.1117/12.877076
Proc. SPIE 7944, Group velocity independent coupling into slow light photonic crystal waveguide on silicon nanophotonic integrated circuits, 79440K (9 February 2011); doi: 10.1117/12.887610
Proc. SPIE 7944, High-density active optical cable: from a new concept to a prototype, 79440L (18 January 2011); doi: 10.1117/12.873793
Materials for Optical Interconnects
Proc. SPIE 7944, Novel organic-inorganic hybrid materials for optical interconnects, 79440M (18 January 2011); doi: 10.1117/12.873672
Proc. SPIE 7944, Densely aligned graded-index multiple-core polymer optical waveguide: fabrication and inter-channel crosstalk property, 79440O (18 January 2011); doi: 10.1117/12.873997
Proc. SPIE 7944, Experimental studies of the Franz-Keldysh effect in CVD grown GeSi epi on SOI, 79440P (18 January 2011); doi: 10.1117/12.876492
Microoptics
Proc. SPIE 7944, A novel boundary-confined method for microlens arrays fabrication, 79440Q (18 January 2011); doi: 10.1117/12.877473
Proc. SPIE 7944, Self-organization of optical Z-connections in three-dimensional optical circuits simulated by the finite difference time domain method, 79440R (18 January 2011); doi: 10.1117/12.871439
Proc. SPIE 7944, Modeling and design of a tunable refractive lens based on liquid crystals, 79440S (18 January 2011); doi: 10.1117/12.876221
Proc. SPIE 7944, Micro-optics packaging and integration for high-power diode laser beam combining, 79440T (18 January 2011); doi: 10.1117/12.874178
Optoelectronic Devices for Optical Interconnects: Joint Session with Conference 7942
Proc. SPIE 7944, Photonic switching for reliable nanoscale three-dimensional integrated network-on-chips, 79440U (19 January 2011); doi: 10.1117/12.873322
Proc. SPIE 7944, Low-power and high-speed SerDes with new dynamic latch and flip-flop for optical interconnect in 180 nm CMOS technology, 79440V (18 January 2011); doi: 10.1117/12.876237
Si Photonics for Optical Interconnects: Joint Session with Conference 7942
Proc. SPIE 7944, Pure silicon - high performance: advanced optical receivers in standard silicon BiCMOS technologies, 79440W (18 January 2011); doi: 10.1117/12.876250
Proc. SPIE 7944, High-speed CMOS optical communication using silicon light emitters, 79440X (18 January 2011); doi: 10.1117/12.875112
Poster Session
Proc. SPIE 7944, The effect on Strehl ratio from thickness variations in liquid crystal diffractive lenses, 79440Z (18 January 2011); doi: 10.1117/12.875893
Proc. SPIE 7944, Polymeric waveguide array with 45 degree slopes fabricated by bottom side tilted exposure, 794411 (9 February 2011); doi: 10.1117/12.876036
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