Proceedings Volume 7970 is from: Logo
SPIE ADVANCED LITHOGRAPHY
Feb 27 - Mar 3 2011
San Jose, California, United States
Front Matter
Proc. SPIE 7970, Front Matter: Volume 7970, 797001 (27 April 2011); doi: 10.1117/12.897034
Keynote Session
Proc. SPIE 7970, Nanoimprint lithography for semiconductor devices and future patterning innovation, 797003 (17 March 2011); doi: 10.1117/12.882940
Nanoimprint Lithography I: CMOS
Proc. SPIE 7970, The comparison of NGLs from a tool vendor's view, 797005 (2 April 2011); doi: 10.1117/12.881274
Proc. SPIE 7970, Jet and flash imprint defectivity: assessment and reduction for semiconductor applications, 797006 (2 April 2011); doi: 10.1117/12.881530
Proc. SPIE 7970, Defect reduction of high-density full-field patterns in jet and flash imprint lithography, 797007 (2 April 2011); doi: 10.1117/12.879933
Proc. SPIE 7970, Progress in mask replication using jet and flash imprint lithography, 797009 (2 April 2011); doi: 10.1117/12.881647
Maskless Lithography I
Proc. SPIE 7970, Position accuracy evaluation of multi-column e-beam exposure system, 79700B (2 April 2011); doi: 10.1117/12.878736
Proc. SPIE 7970, eMET: 50 keV electron multibeam mask exposure tool, 79700C (2 April 2011); doi: 10.1117/12.879419
Proc. SPIE 7970, Multi-shaped beam: development status and update on lithography results, 79700E (2 April 2011); doi: 10.1117/12.879446
Directed Self-Assembly I: Selected Semiconductor Applications: Joint Session with Conference 7972
Proc. SPIE 7970, Self-assembly patterning for sub-15nm half-pitch: a transition from lab to fab, 79700F (2 April 2011); doi: 10.1117/12.881293
Novel Applications I
Proc. SPIE 7970, Nanoimprint process for 2.5Tb/in2 bit patterned media fabricated by self-assembling method, 79700K (2 April 2011); doi: 10.1117/12.878936
Proc. SPIE 7970, High-density patterned media fabrication using jet and flash imprint lithography, 79700L (2 April 2011); doi: 10.1117/12.879932
Directed Self-Assembly II: Processing and Fundamentals
Proc. SPIE 7970, Development of realistic potentials for the simulation of directed self-assembly of PS-PMMA di-block copolymers, 79700N (2 April 2011); doi: 10.1117/12.879578
Proc. SPIE 7970, Guided self-assembly of block-copolymer for CMOS technology: a comparative study between grapho-epitaxy and surface chemical modification, 79700P (2 April 2011); doi: 10.1117/12.878486
Proc. SPIE 7970, Study and optimization of the parameters governing the block copolymer self-assembly: toward a future integration in lithographic process, 79700Q (4 April 2011); doi: 10.1117/12.881481
Nanoimprint Lithography II: Processes and Materials
Proc. SPIE 7970, Approaches to rapid resist spreading on dispensing based UV-NIL, 79700S (2 April 2011); doi: 10.1117/12.879200
Proc. SPIE 7970, Reactive fluorinated surfactant for step and flash imprint lithography, 79700T (4 April 2011); doi: 10.1117/12.871627
Proc. SPIE 7970, A new releasing material and continuous nano-imprinting in mold replication for patterned media, 79700U (4 April 2011); doi: 10.1117/12.881581
Maskless Lithography II
Proc. SPIE 7970, Fast mask writers: technology options and considerations, 79700X (4 April 2011); doi: 10.1117/12.882945
Proc. SPIE 7970, IMAGINE: an open consortium to boost maskless lithography take off: first assessment results on MAPPER technology, 79700Y (4 April 2011); doi: 10.1117/12.881286
Proc. SPIE 7970, Influence of massively parallel e-beam direct-write pixel size on electron proximity correction, 79700Z (4 April 2011); doi: 10.1117/12.869896
Proc. SPIE 7970, Data path development for multiple electron beam maskless lithography, 797010 (4 April 2011); doi: 10.1117/12.881010
Proc. SPIE 7970, E-beam to complement optical lithography for 1D layouts, 797011 (4 April 2011); doi: 10.1117/12.879479
Proc. SPIE 7970, Model-based mask data preparation (MB-MDP) and its impact on resist heating, 797012 (4 April 2011); doi: 10.1117/12.883122
Nanoimprint Lithography III: Novel NIL Applications
Proc. SPIE 7970, Wafer-level fabrication of distributed feedback laser diodes by utilizing UV nanoimprint lithography, 797014 (4 April 2011); doi: 10.1117/12.879367
Proc. SPIE 7970, Fabrication of hole pattern for position-controlled MOVPE-grown GaN nanorods with highly precise nanoimprint technology, 797015 (4 April 2011); doi: 10.1117/12.879368
Proc. SPIE 7970, Adaptation of roll-to-roll imprint lithography: from flexible electronics to structural templates, 797016 (4 April 2011); doi: 10.1117/12.882085
Proc. SPIE 7970, Development and characterization of carbon nanotube processes for NRAM technology, 797017 (4 April 2011); doi: 10.1117/12.879142
Maskless Lithography III
Proc. SPIE 7970, New advances with REBL for maskless high-throughput EBDW lithography, 797018 (4 April 2011); doi: 10.1117/12.882636
Proc. SPIE 7970, Data preparation solution for e-beam multiple pass exposure: reaching sub-22nm nodes with a tool dedicated to 45 nm, 797019 (4 April 2011); doi: 10.1117/12.879059
Proc. SPIE 7970, Demonstration of real-time pattern correction for high-throughput maskless lithography, 79701A (4 April 2011); doi: 10.1117/12.881482
Proc. SPIE 7970, EBPC for multi-beams low kV electron projection lithography, 79701B (4 April 2011); doi: 10.1117/12.879424
Proc. SPIE 7970, Fast characterization of line-end shortening and application of novel correction algorithms in e-beam direct write, 79701C (4 April 2011); doi: 10.1117/12.879582
Novel Applications II
Proc. SPIE 7970, Nanopatterning of diblock copolymer directed self-assembly lithography with wet development, 79701F (4 April 2011); doi: 10.1117/12.878931
Proc. SPIE 7970, Double and triple exposure with image reversal in a single photoresist layer, 79701H (4 April 2011); doi: 10.1117/12.879505
Cross-Cutting Technologies
Proc. SPIE 7970, Tunable two-mirror laser interference lithography system for large-area nano-patterning, 79701K (4 April 2011); doi: 10.1117/12.879576
Proc. SPIE 7970, Solid-immersion Lloyd's mirror as a testbed for plasmon-enhanced high-NA lithography, 79701L (4 April 2011); doi: 10.1117/12.879121
Proc. SPIE 7970, Soft UV-NIL at the 12.5 nm scale, 79701M (4 April 2011); doi: 10.1117/12.870524
Poster Session
Proc. SPIE 7970, Scatterometry sensitivity for NIL process, 79701N (4 April 2011); doi: 10.1117/12.880910
Proc. SPIE 7970, Fast and large-field electron-beam exposure by CSEL, 79701R (4 April 2011); doi: 10.1117/12.879279
Proc. SPIE 7970, Optimization of e-beam landing energy for EBDW, 79701S (4 April 2011); doi: 10.1117/12.879443
Proc. SPIE 7970, Demonstration of lithography patterns using reflective e-beam direct write, 79701T (4 April 2011); doi: 10.1117/12.879454
Proc. SPIE 7970, A lossless circuit layout image compression algorithm for electron beam direct write lithography systems, 79701U (4 April 2011); doi: 10.1117/12.881192
Proc. SPIE 7970, Electron beam induced freezing of positive tone, EUV resists for directed self assembly applications, 79701V (4 April 2011); doi: 10.1117/12.881491
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