Front Matter
Proc. SPIE 7973, Front Matter: Volume 7973, 797301 (5 May 2011); doi: 10.1117/12.894750
FreeForm and SMO
Proc. SPIE 7973, Freeform and SMO, 797305 (23 March 2011); doi: 10.1117/12.883317
Proc. SPIE 7973, Qualification, monitoring, and integration into a production environment of the world's first fully programmable illuminator, 797306 (14 March 2011); doi: 10.1117/12.879483
Proc. SPIE 7973, Design specific joint optimization of masks and sources on a very large scale, 797308 (5 April 2011); doi: 10.1117/12.879787
Source and Mask Optimization I
Proc. SPIE 7973, Illuminator predictor for effective SMO solutions, 797309 (23 March 2011); doi: 10.1117/12.879116
Proc. SPIE 7973, Full-chip source and mask optimization, 79730A (23 March 2011); doi: 10.1117/12.881633
Proc. SPIE 7973, Joint optimization of layout and litho for SRAM and logic towards the 20nm node using 193i, 79730B (23 March 2011); doi: 10.1117/12.881688
Proc. SPIE 7973, Supreme lithographic performance by simple mask layout based on lithography and layout co-optimization, 79730D (23 March 2011); doi: 10.1117/12.878663
Double Patterning I
Proc. SPIE 7973, Simultaneous OPC and decomposition for double exposure lithography, 79730E (23 March 2011); doi: 10.1117/12.879540
Proc. SPIE 7973, Towards manufacturing of advanced logic devices by double-patterning, 79730F (23 March 2011); doi: 10.1117/12.879618
Proc. SPIE 7973, Innovative self-aligned triple patterning for 1x half pitch using single "spacer deposition-spacer etch" step, 79730G (23 March 2011); doi: 10.1117/12.881574
Proc. SPIE 7973, DPT restricted design rules for advanced logic applications, 79730H (5 April 2011); doi: 10.1117/12.879793
Proc. SPIE 7973, Scanner alignment performance for double patterning, 79730I (23 March 2011); doi: 10.1117/12.878953
Proc. SPIE 7973, Effective decomposition algorithm for self-aligned double patterning lithography, 79730J (23 March 2011); doi: 10.1117/12.879324
Double Patterning II
Proc. SPIE 7973, Mandrel-based patterning: density multiplication techniques for 15nm nodes, 79730K (23 March 2011); doi: 10.1117/12.881679
Proc. SPIE 7973, Characterization of a 'thermal freeze' litho-litho-etch (LLE) process for predictive simulation, 79730L (23 March 2011); doi: 10.1117/12.879508
Proc. SPIE 7973, Improving double patterning flow by analyzing the diffractive orders in the pupil plane, 79730M (23 March 2011); doi: 10.1117/12.879399
Proc. SPIE 7973, Spacer-defined double patterning for 20nm and beyond logic BEOL technology, 79730N (23 March 2011); doi: 10.1117/12.881701
Mask 3D Modeling
Proc. SPIE 7973, Accuracy and performance of 3D mask models in optical projection lithography, 79730O (23 March 2011); doi: 10.1117/12.879053
Proc. SPIE 7973, Accounting for mask topography effects in source-mask optimization for advanced nodes, 79730P (23 March 2011); doi: 10.1117/12.879704
Tools and Process Control I
Proc. SPIE 7973, Improved fab CDU with FlexRay and LithoTuner, 79730Q (23 March 2011); doi: 10.1117/12.879619
Proc. SPIE 7973, Optical proximity stability control of ArF immersion clusters, 79730R (23 March 2011); doi: 10.1117/12.881606
Proc. SPIE 7973, Scanner matching using pupil intensity control between scanners in 30nm DRAM device, 79730S (23 March 2011); doi: 10.1117/12.879570
Proc. SPIE 7973, Enabling 22-nm logic node with advanced RET solutions, 79730T (23 March 2011); doi: 10.1117/12.870753
Tools and Process Control II
Proc. SPIE 7973, Solutions for 22-nm node patterning using ArFi technology, 79730U (5 April 2011); doi: 10.1117/12.881598
Proc. SPIE 7973, Characterization and control of dynamic lens heating effects under high volume manufacturing conditions, 79730V (23 March 2011); doi: 10.1117/12.881609
Proc. SPIE 7973, An aberration control of projection optics for multi-patterning lithography, 79730W (23 March 2011); doi: 10.1117/12.879616
Computational Lithography
Proc. SPIE 7973, Fine calibration of physical resist models: the importance of Jones pupil, laser bandwidth, mask error and CD metrology for accurate modeling at advanced lithographic nodes, 79730X (23 March 2011); doi: 10.1117/12.879592
Innovative Lithography Process Control: Joint Session with Conference 7971
Proc. SPIE 7973, Stability and calibration of overlay and focus control for a double patterning immersion scanner, 79730Z (23 March 2011); doi: 10.1117/12.879291
Proc. SPIE 7973, Advanced CDU improvement for 22nm and below, 797310 (23 March 2011); doi: 10.1117/12.879348
Proc. SPIE 7973, Combined overlay, focus and CD metrology for leading edge lithography, 797311 (23 March 2011); doi: 10.1117/12.881428
Proc. SPIE 7973, Correcting image placement errors using registration control (RegC) technology, 797312 (23 March 2011); doi: 10.1117/12.879885
Mask and Layout Optimization
Proc. SPIE 7973, Optical lithography applied to 20-nm CMOS Logic and SRAM, 797314 (23 March 2011); doi: 10.1117/12.879522
Proc. SPIE 7973, 3D lithography modeling for ground rule development, 797315 (23 March 2011); doi: 10.1117/12.879213
Proc. SPIE 7973, Mask enhancer technology with source mask optimization (SMO) for 2Xnm-node logic layout gate fabrication, 797316 (23 March 2011); doi: 10.1117/12.878727
Proc. SPIE 7973, Evaluation of a new model of mask topography effects, 797317 (23 March 2011); doi: 10.1117/12.879230
Proc. SPIE 7973, High-performance intensity slope correction method for global process variability band improvement and printability enhancement in RET applications, 797318 (23 March 2011); doi: 10.1117/12.877594
Optical/DFM: Joint Session with Conference 7974
Proc. SPIE 7973, Contact patterning strategies for 32nm and 28nm technology, 797319 (23 March 2011); doi: 10.1117/12.879773
Source and Mask Optimization II
Proc. SPIE 7973, Polarization holograms for source-mask optimization, 79731A (5 April 2011); doi: 10.1117/12.879534
Proc. SPIE 7973, Extending SMO into the lens pupil domain, 79731B (23 March 2011); doi: 10.1117/12.879058
Proc. SPIE 7973, Enhancing fullchip ILT mask synthesis capability for IC manufacturability, 79731C (23 March 2011); doi: 10.1117/12.882814
Proc. SPIE 7973, A study of source mask optimization for logic device through experiment and simulations, 79731E (5 April 2011); doi: 10.1117/12.879429
Tools
Proc. SPIE 7973, Practical performance and enabling technologies in immersion scanners for the double patterning generation, 79731F (23 March 2011); doi: 10.1117/12.879388
Proc. SPIE 7973, Advanced wavefront engineering for improved imaging and overlay applications on a 1.35 NA immersion scanner, 79731G (23 March 2011); doi: 10.1117/12.880759
Proc. SPIE 7973, Pupilgram adjusting scheme using intelligent illuminator for ArF immersion exposure tool, 79731H (23 March 2011); doi: 10.1117/12.879395
Proc. SPIE 7973, Scanner matching for standard and freeform illumination shapes using FlexRay, 79731I (23 March 2011); doi: 10.1117/12.881607
Proc. SPIE 7973, Ecology and high-durability injection locked laser with flexible power for double-patterning ArF immersion lithography, 79731K (23 March 2011); doi: 10.1117/12.879205
Poster Session: Computational Lithography
Proc. SPIE 7973, Hotspot fixing using ILT, 79731L (23 March 2011); doi: 10.1117/12.879781
Proc. SPIE 7973, Fast algorithm for quadratic aberration model based on cross triple correlation, 79731M (23 March 2011); doi: 10.1117/12.879217
Proc. SPIE 7973, Choosing objective functions for inverse lithography patterning, 79731N (23 March 2011); doi: 10.1117/12.879440
Proc. SPIE 7973, Physical conversion of Stokes parameters which are multiplied by a general Mueller matrix into Jones vectors applicable to the lithographic calculation, 79731O (23 March 2011); doi: 10.1117/12.879338
Poster Session: Double Patterning
Proc. SPIE 7973, Self-aligned triple patterning for continuous IC scaling to half-pitch 15nm, 79731P (23 March 2011); doi: 10.1117/12.881645
Proc. SPIE 7973, Sidewall spacer quadruple patterning for 15nm half-pitch, 79731Q (23 March 2011); doi: 10.1117/12.881547
Proc. SPIE 7973, Spacer defined double patterning for (sub-)20nm half pitch single damascene structures, 79731R (23 March 2011); doi: 10.1117/12.881600