Proceedings Volume 8267 is from: Logo
SPIE OPTO
21-26 January 2012
San Francisco, California, United States
Front Matter
Proc. SPIE 8267, Front Matter: Volume 8267, 826701 (1 March 2012); doi: 10.1117/12.930629
Optical PCB I
Proc. SPIE 8267, Injection molded optical backplane for broadcast architecture, 826703 (2 February 2012); doi: 10.1117/12.915645
Proc. SPIE 8267, Evaluation of multimode optical waveguides for optical bus interconnects, 826704 (2 February 2012); doi: 10.1117/12.927763
Proc. SPIE 8267, Design of a highly parallel board-level-interconnection with 320 Gbps capacity, 826706 (2 February 2012); doi: 10.1117/12.905888
Optical PCB II
Proc. SPIE 8267, Polymer optical waveguide-based bi-directional optical bus architecture for high-speed optical backplane, 826709 (23 February 2012); doi: 10.1117/12.913894
Proc. SPIE 8267, Characterization and analysis of graded index optical waveguides for the realization of low-power, high-density, and high-speed optical link, 82670A (2 February 2012); doi: 10.1117/12.906398
Integrated Tx/Rx Modules
Proc. SPIE 8267, Heterogeneous photonic integrated circuits, 82670B (2 February 2012); doi: 10.1117/12.913016
Proc. SPIE 8267, A 25-Gbps high-sensitivity optical receiver with 10-Gbps photodiode using inductive input coupling for optical interconnects, 82670C (2 February 2012); doi: 10.1117/12.907979
Proc. SPIE 8267, 4 channels x 10-Gbps optoelectronic transceiver based on silicon optical bench technology, 82670D (2 February 2012); doi: 10.1117/12.908180
Proc. SPIE 8267, Multigigabit optical transceivers for high-data rate military applications, 82670E (2 February 2012); doi: 10.1117/12.910657
Si Photonics for Interconnects
Proc. SPIE 8267, Silicon nanomembranes for high-performance flexible photonic interconnects and devices, 82670H (2 February 2012); doi: 10.1117/12.906852
Proc. SPIE 8267, Low insertion loss modulator based on a vertically coupled photonic crystal resonator, 82670I (2 February 2012); doi: 10.1117/12.909248
Waveguides for Opto-PCB
Proc. SPIE 8267, Link power budget advantage in GI-core polymer optical waveguide link for optical printed circuit boards, 82670J (2 February 2012); doi: 10.1117/12.907699
Proc. SPIE 8267, Novel optical interconnect devices applying mask-transfer self-written method, 82670K (2 February 2012); doi: 10.1117/12.907326
Proc. SPIE 8267, Single-mode glass waveguide technology for optical interchip communication on board level, 82670M (2 February 2012); doi: 10.1117/12.905984
Proc. SPIE 8267, Optical waveguide end roughness in correlation to optical coupling, 82670N (23 February 2012); doi: 10.1117/12.908847
Passive Components
Proc. SPIE 8267, Next-generation, high-density, low-cost, multimode optical backplane interconnect, 82670O (2 February 2012); doi: 10.1117/12.909688
Proc. SPIE 8267, Rapid prototyping of interfacing microcomponents for printed circuit board-level optical interconnects, 82670P (2 February 2012); doi: 10.1117/12.912905
Proc. SPIE 8267, Soft lithography fabricated polymer waveguides and 45-degree inclined mirrors for card-to-backplane optical interconnects, 82670R (2 February 2012); doi: 10.1117/12.908243
Packaging and Integration
Proc. SPIE 8267, Aspects of short-range interconnect packaging, 82670S (2 February 2012); doi: 10.1117/12.914612
Proc. SPIE 8267, Novel coupling and packaging approaches for optical interconnects, 82670T (2 February 2012); doi: 10.1117/12.913760
Proc. SPIE 8267, Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si, 82670U (2 February 2012); doi: 10.1117/12.906373
Proc. SPIE 8267, Proposal and FDTD simulation of reflective self-organizing lightwave network (R-SOLNET) using phosphor, 82670V (2 February 2012); doi: 10.1117/12.906316
Optical Interconnects in High Performance Computing: Joint Session with Conference 8265
Proc. SPIE 8267, Optics in computers, servers, and data centers, 82670W (2 February 2012); doi: 10.1117/12.913881
Proc. SPIE 8267, Chip-scale integrated optical interconnects: a key enabler for future high-performance computing, 82670X (3 February 2012); doi: 10.1117/12.910249
Nanophotonics for Optical Interconnects: Joint Session with Conference 8265
Proc. SPIE 8267, Low-power integration of on-chip nanophotonic interconnect for high-performance optoelectrical IC, 82670Z (2 February 2012); doi: 10.1117/12.913886
Components
Proc. SPIE 8267, Design and experimental study on the grating outcouplers providing the controlled 2D-intensity profile of the output beam from a broad area laser diode, 826712 (2 February 2012); doi: 10.1117/12.910154
Proc. SPIE 8267, Novel VCSEL driving technique with virtual back termination for high-speed optical interconnection, 826713 (2 February 2012); doi: 10.1117/12.907983
Optical Links
Proc. SPIE 8267, Application of MIMO technology for next-generation optical and millimeter-wave interconnects, 826714 (2 February 2012); doi: 10.1117/12.913892
Proc. SPIE 8267, Device design and signal processing for multiple-input multiple-output multimode fiber links, 826715 (2 February 2012); doi: 10.1117/12.913882
Proc. SPIE 8267, A high-speed 0.35µm CMOS optical communication link, 826716 (2 February 2012); doi: 10.1117/12.907945
Poster Session
Proc. SPIE 8267, Design and fabrication of a 1-by-4 multimode interference splitter, 826719 (2 February 2012); doi: 10.1117/12.907315
Proc. SPIE 8267, Transmitting part of optical interconnect module with three-dimensional optical path, 82671A (2 February 2012); doi: 10.1117/12.909759
Proc. SPIE 8267, Improved performance of traveling wave directional coupler modulator based on electro-optic polymer, 82671B (23 February 2012); doi: 10.1117/12.907744
Proc. SPIE 8267, 80µm-core graded-index MMF for consumer electronic devices, 82671C (2 February 2012); doi: 10.1117/12.906159
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