Front Matter
Proc. SPIE 8323, Front Matter: Volume 8323, 832301 (19 April 2012); doi: 10.1117/12.928431
Keynote Session
Proc. SPIE 8323, Future of multiple-e-beam direct-write systems, 832302 (21 March 2012); doi: 10.1117/12.919747
Proc. SPIE 8323, Block copolymer directed self-assembly enables sublithographic patterning for device fabrication, 832303 (6 March 2012); doi: 10.1117/12.918312
Imprint I: Processing
Proc. SPIE 8323, Design considerations for UV-NIL resists, 832305 (21 March 2012); doi: 10.1117/12.915812
Proc. SPIE 8323, Selective transfer of nanostructured assemblies onto an arbitrary substrate by nanoimprinting, 832306 (21 March 2012); doi: 10.1117/12.916595
Directed Self-Assembly I: Resist Processing: Joint Session with Conference 8325
Proc. SPIE 8323, Pattern scaling with directed self assembly through lithography and etch process integration, 83230B (21 March 2012); doi: 10.1117/12.916311
Proc. SPIE 8323, All track directed self-assembly of block copolymers: process flow and origin of defects, 83230D (21 March 2012); doi: 10.1117/12.916410
Proc. SPIE 8323, Synthesis and characterization of self-assembling block copolymers containing fluorine groups, 83230E (21 March 2012); doi: 10.1117/12.916418
Maskless/Direct-Write Lithography I
Proc. SPIE 8323, Sub-20nm hybrid lithography using optical, pitch-division, and e-beam, 83230F (21 March 2012); doi: 10.1117/12.916486
Proc. SPIE 8323, 50 keV electron multibeam mask writer for the 11nm HP node: first results of the proof of concept tool (eMET POC), 83230G (21 March 2012); doi: 10.1117/12.916613
Proc. SPIE 8323, Reflective electron-beam lithography: progress toward high-throughput production capability, 83230H (21 March 2012); doi: 10.1117/12.916090
Modeling of Alternative Lithographic Processes
Proc. SPIE 8323, Influence of thermal load on 450 mm Si-wafer IPD during lithographic patterning, 83230J (21 March 2012); doi: 10.1117/12.916616
Proc. SPIE 8323, Self-consistent field theory of directed self-assembly in laterally confined lamellae-forming diblock copolymers, 83230K (21 March 2012); doi: 10.1117/12.916577
Metrology and Inspection for Alternative Lithographic Technologies: Joint Session with Conference 8324
Proc. SPIE 8323, Directed self-assembly defectivity assessment. Part II, 83230N (16 April 2012); doi: 10.1117/12.917993
Proc. SPIE 8323, Pattern density multiplication by direct self assembly of block copolymers: toward 300mm CMOS requirements, 83230O (21 March 2012); doi: 10.1117/12.916400
Proc. SPIE 8323, Measurement of placement error between self-assembled polymer patterns and guiding chemical prepatterns, 83230P (21 March 2012); doi: 10.1117/12.916421
Hybrid Directed Self-Assembly and Imprint Processes (DSA II and Imprint II)
Proc. SPIE 8323, Evaluation of ordering of directed self-assembly of block copolymers with pre-patterned guides for bit patterned media, 83230S (21 March 2012); doi: 10.1117/12.916304
Proc. SPIE 8323, Line-frequency doubling of directed self-assembly patterns for single-digit bit pattern media lithography, 83230U (21 March 2012); doi: 10.1117/12.916589
Proc. SPIE 8323, Imprint process performance for patterned media at densities greater than 1Tb/in2, 83230V (21 March 2012); doi: 10.1117/12.918042
Directed Self-Assembly III: Patterning
Proc. SPIE 8323, Contact-hole patterning for random logic circuits using block copolymer directed self-assembly, 83230W (21 March 2012); doi: 10.1117/12.912804
Proc. SPIE 8323, Progress towards the integration of optical proximity correction and directed self-assembly of block copolymers with graphoepitaxy, 83230X (21 March 2012); doi: 10.1117/12.916525
Proc. SPIE 8323, Contact hole shrink process using directed self-assembly, 83230Y (21 March 2012); doi: 10.1117/12.915652
Proc. SPIE 8323, Investigation of high x block copolymers for directed self-asssembly: synthesis and characterization of PS-b-PHOST, 832310 (16 April 2012); doi: 10.1117/12.918081
Maskless/Direct-Write Lithography II
Proc. SPIE 8323, REBL: design progress toward 16 nm half-pitch maskless projection electron beam lithography, 832311 (21 March 2012); doi: 10.1117/12.919744
Proc. SPIE 8323, Active-matrix nc-Si electron emitter array for massively parallel direct-write electron-beam system, 832312 (21 March 2012); doi: 10.1117/12.916250
Proc. SPIE 8323, Complementary patterning demonstration with e-beam direct writer and spacer DP process of 11nm node, 832313 (21 March 2012); doi: 10.1117/12.915821
Proc. SPIE 8323, CP element based design for 14nm node EBDW high volume manufacturing, 832314 (21 March 2012); doi: 10.1117/12.916315
Imprint III: Templates, Masks, and Molds
Proc. SPIE 8323, Controlling template erosion with advanced cleaning methods, 832317 (21 March 2012); doi: 10.1117/12.916294
Proc. SPIE 8323, Fabrication of templates with rectangular bits on circular tracks by combining block copolymer directed self-assembly and nanoimprint lithography, 832319 (21 March 2012); doi: 10.1117/12.916592
Proc. SPIE 8323, Deformations of soft imprint templates in the nanoimprint lithography, 83231B (21 March 2012); doi: 10.1117/12.916287
Frontier Lithographic Techniques and Applications
Proc. SPIE 8323, Zone plate focused soft x-ray lithography for fabrication of nanofluidic devices, 83231D (21 March 2012); doi: 10.1117/12.915803
Proc. SPIE 8323, Multi-step Scanning Probe Lithography (SPL) on calixarene with overlay alignment, 83231G (21 March 2012); doi: 10.1117/12.916263
Imprint IV: R2R Imprint Lithography and Applications
Proc. SPIE 8323, Roll-to-roll manufacturing of electronic devices, 83231H (21 March 2012); doi: 10.1117/12.918639
Proc. SPIE 8323, Sub-100 nm pattern formation by roll-to-roll nanoimprint, 83231J (21 March 2012); doi: 10.1117/12.916584
Proc. SPIE 8323, Planarization coating for polyimide substrates used in roll-to-roll fabrication of active matrix backplanes for flexible displays, 83231K (21 March 2012); doi: 10.1117/12.916748
Proc. SPIE 8323, Roll-to-roll nanopatterning using jet and flash imprint lithography, 83231L (21 March 2012); doi: 10.1117/12.918040
Directed Self-Assembly IV: Materials for Fine Process Control
Proc. SPIE 8323, Designing new materials and processes for directed self-assembly applications, 83231M (21 March 2012); doi: 10.1117/12.916429
Proc. SPIE 8323, Directed self-assembly of laterally confined lamellae-forming diblock copolymers: polydispersity and substrate interaction effects, 83231N (21 March 2012); doi: 10.1117/12.916578
Proc. SPIE 8323, EUVL compatible LER solutions using functional block copolymers, 83231O (21 March 2012); doi: 10.1117/12.916744
Poster Session
Proc. SPIE 8323, Maskless EUV lithography: an already difficult technology made even more complicated?, 83231Q (21 March 2012); doi: 10.1117/12.899967
Proc. SPIE 8323, A phase segregating polymer blend for 2xnm feature applications, 83231R (21 March 2012); doi: 10.1117/12.916031
Proc. SPIE 8323, Detailed mesoscale dynamic simulation of block copolymer directed self-assembly processes: application of protracted colored noise dynamics, 83231T (16 April 2012); doi: 10.1117/12.918077
Proc. SPIE 8323, 25nm pitch master and replica mold fabrication for nanoimprinting lithography for 1Tbit/inch2 bit patterned media, 83231V (21 March 2012); doi: 10.1117/12.918664
Proc. SPIE 8323, Combined dose and geometry correction (DMG) for low energy multi electron beam lithography (5kV): application to the 16nm node, 83231W (21 March 2012); doi: 10.1117/12.916064
Proc. SPIE 8323, Analysis of multibeam's scalable column for complementary e-beam lithography (CEBL), 83231X (21 March 2012); doi: 10.1117/12.916117
Proc. SPIE 8323, Multiple columns for high-throughput complementary e-beam lithography (CEBL), 83231Y (21 March 2012); doi: 10.1117/12.916118
Proc. SPIE 8323, Addressing LER through atomistic self-assembly, 83231Z (21 March 2012); doi: 10.1117/12.916231
Proc. SPIE 8323, Plasmonic lithography modeling and measurement of near-field distribution of plasmonic nano-aperture, 832320 (21 March 2012); doi: 10.1117/12.916237
Proc. SPIE 8323, Design of a high positioning contact probe for plasmonic lithography, 832322 (21 March 2012); doi: 10.1117/12.916274
Proc. SPIE 8323, Optimization of chemically amplified resist for high-volume manufacturing by electron-beam direct writing toward 14nm node and beyond, 832324 (21 March 2012); doi: 10.1117/12.916305
Proc. SPIE 8323, Study of device mass production capability of the character projection based electron beam direct writing process technology toward 14 nm node and beyond, 832326 (21 March 2012); doi: 10.1117/12.916338
Proc. SPIE 8323, Block co-polymer guided self-assembly by surface chemical modification: optimization of multiple patterning process and pattern transfer, 832327 (21 March 2012); doi: 10.1117/12.916339
Proc. SPIE 8323, Proximity effect correction using multilevel area density maps for character projection based electron beam direct writing toward 14 nm node and beyond, 832328 (21 March 2012); doi: 10.1117/12.916353
Proc. SPIE 8323, Feasibility study of character projection-based electron-beam direct writing for logic LSI wiring including automatically routed area with 14nm node technology case, 832329 (21 March 2012); doi: 10.1117/12.916358
Proc. SPIE 8323, High-resolution laser direct writing with a plasmonic contact probe, 83232A (21 March 2012); doi: 10.1117/12.916359
Proc. SPIE 8323, Feasibility study of optical/e-beam complementary lithography, 83232C (21 March 2012); doi: 10.1117/12.916386