PROCEEDINGS VOLUME 8614
SPIE MOEMS-MEMS | 2-7 FEBRUARY 2013
Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices XII
IN THIS VOLUME

0 Sessions, 22 Papers, 0 Presentations
Proceedings Volume 8614 is from: Logo
SPIE MOEMS-MEMS
2-7 February 2013
San Francisco, California, United States
Front Matter: Volume 8614
Proc. SPIE 8614, Front Matter: Volume 8614, 861401 (13 March 2013); doi: 10.1117/12.2022904
MOEMS-MEMS Reliability I
Proc. SPIE 8614, Effects of actuation methods and temperature on adhesion force between polycrystalline silicon surfaces in MEMS, 861402 (9 March 2013); doi: 10.1117/12.2008898
Proc. SPIE 8614, Analysis of metal-metal contacts in RF MEMS switches, 861403 (9 March 2013); doi: 10.1117/12.2004775
Proc. SPIE 8614, Reliability of MEM relays for zero leakage logic, 861404 (9 March 2013); doi: 10.1117/12.2005719
Proc. SPIE 8614, Reliability characteristics of microfabricated Rb mini-lamps for optical pumping in miniature atomic clocks and magnetometers, 861406 (9 March 2013); doi: 10.1117/12.2006032
Proc. SPIE 8614, Reliability studies on MEMS shutters and displays, 861407 (9 March 2013); doi: 10.1117/12.2020033
MOEMS-MEMS Reliability II
Proc. SPIE 8614, MEMS gratings for wavemeters and tunable light sources, 861408 (9 March 2013); doi: 10.1117/12.2000530
Proc. SPIE 8614, Robustness and reliability of MOEMS for miniature spectrometers, 861409 (9 March 2013); doi: 10.1117/12.2000495
Proc. SPIE 8614, MEMS and MOEMS resonant frequencies analysis by Digital Holography Microscopy (DHM), 86140A (9 March 2013); doi: 10.1117/12.2009221
Proc. SPIE 8614, A smaller footprint MEMS sensor for on-chip temperature measurement, 86140B (9 March 2013); doi: 10.1117/12.2005460
Proc. SPIE 8614, Optoelectronic and acoustic properties and their interfacial durability of GnP/PVDF/GnP composite actuators with nano-structural control, 86140C (9 March 2013); doi: 10.1117/12.2000111
Proc. SPIE 8614, Developments in packaging and integration for silicon photonics, 86140D (9 March 2013); doi: 10.1117/12.2012735
MOEMS/MEMS Packaging
Proc. SPIE 8614, Temperature compensated silicon resonators for space applications, 86140E (9 March 2013); doi: 10.1117/12.2001434
Proc. SPIE 8614, Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods, 86140F (9 March 2013); doi: 10.1117/12.2003525
Proc. SPIE 8614, Influence of ceramic package internal components on the performance of vacuum sealed uncooled bolometric detectors, 86140G (9 March 2013); doi: 10.1117/12.2005945
Proc. SPIE 8614, High-temperature compatible 3D-integration processes for a vacuum-sealed CNT-based NEMS, 86140H (9 March 2013); doi: 10.1117/12.2006216
Proc. SPIE 8614, Solar cell packaged by a microlens array and its long-term optical efficiency enhancement, 86140I (9 March 2013); doi: 10.1117/12.2004016
MOEMS/MEMS for Space Applications
Proc. SPIE 8614, Impact of radiations on the electromechanical properties of materials and on the piezoresistive and capacitive transduction mechanisms used in microsystems, 86140J (9 March 2013); doi: 10.1117/12.2008531
Proc. SPIE 8614, MEMS accelerometers utilizing resonant microcantilevers with interrogated single-mode waveguides and Bragg gratings, 86140K (15 March 2013); doi: 10.1117/12.2004418
Proc. SPIE 8614, Life testing of reflowed and reworked advanced CCGA surface mount packages in harsh thermal environments, 86140L (9 March 2013); doi: 10.1117/12.2001410
Proc. SPIE 8614, Making MEMS more suited for Space: assessing the proton-radiation tolerance of structural materials for microsystems in orbit, 86140M (9 March 2013); doi: 10.1117/12.2004705
Proc. SPIE 8614, Spaceborne linear arrays of 512x3 microbolometers, 86140N (9 March 2013); doi: 10.1117/12.2004641
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