Front Matter: Volume 8680
Proc. SPIE 8680, Front Matter: Volume 8680, 868001 (11 April 2013); doi: 10.1117/12.2021502
Keynote Session
Proc. SPIE 8680, Electron multi-beam technology for mask and wafer writing at 0.1nm address grid, 868004 (26 March 2013); doi: 10.1117/12.2014661
DSA Materials and Applications
Proc. SPIE 8680, Scaling-down lithographic dimensions with block-copolymer materials: 10nm-sized features with PS-b-PMMA, 868006 (26 March 2013); doi: 10.1117/12.2011405
Proc. SPIE 8680, Healing LER using directed self assembly: treatment of EUVL resists with aqueous solutions of block copolymers, 868009 (26 March 2013); doi: 10.1117/12.2012488
UV Imprint Lithography
Proc. SPIE 8680, Defect reduction for semiconductor memory applications using jet and flash imprint lithography, 86800C (26 March 2013); doi: 10.1117/12.2013694
Proc. SPIE 8680, Novel fluorinated compounds for releasing material in nanoimprint lithography, 86800D (26 March 2013); doi: 10.1117/12.2011966
DSA Materials and Processing: Joint Session with Conference 8680 and 8682
Proc. SPIE 8680, New materials and processes for directed self-assembly, 86800F (26 March 2013); doi: 10.1117/12.2011604
E-Beam Direct-Write for High-Volume Manufacturing I
Proc. SPIE 8680, Reflective electron beam lithography: lithography results using CMOS controlled digital pattern generator chip, 86800H (26 March 2013); doi: 10.1117/12.2010722
Proc. SPIE 8680, Development of maskless electron-beam lithography using nc-Si electron-emitter array, 86800I (26 March 2013); doi: 10.1117/12.2011553
Proc. SPIE 8680, Matching of beams on the MAPPER MATRIX tool: a simulation study, 86800J (26 March 2013); doi: 10.1117/12.2011500
DSA Metrology and Inspection: Joint Session with Conferences 8680 and 8681
Proc. SPIE 8680, Defect source analysis of directed self-assembly process (DSA of DSA), 86800L (26 March 2013); doi: 10.1117/12.2011674
E-Beam Direct-Write for High-Volume Manufacturing II
Proc. SPIE 8680, MAPPER: progress toward a high-volume manufacturing system, 86800O (26 March 2013); doi: 10.1117/12.2011486
Proc. SPIE 8680, Quantifying throughput improvements for electron-beam lithography using a suite of benchmark patterns, 86800P (26 March 2013); doi: 10.1117/12.2011664
Proc. SPIE 8680, Data delivery system for MAPPER using image compression, 86800Q (26 March 2013); doi: 10.1117/12.2011298
Nanoimprint Applications
Proc. SPIE 8680, High performance wire grid polarizers using jet and flashTM imprint lithography, 86800W (26 March 2013); doi: 10.1117/12.2013692
Design for Manufacturability for DSA: Joint Session with Conferences 8680 and 8684
Proc. SPIE 8680, Deterministically isolated gratings through the directed self-assembly of block copolymers, 86800Y (26 March 2013); doi: 10.1117/12.2011629
Proc. SPIE 8680, Computational solution of inverse directed self-assembly problem, 86800Z (26 March 2013); doi: 10.1117/12.2011575
Proc. SPIE 8680, Design strategy of small topographical guiding templates for sub-15nm integrated circuits contact hole patterns using block copolymer directed self assembly, 868010 (26 March 2013); doi: 10.1117/12.2011263
DSA Vias
Proc. SPIE 8680, Patterning process for semiconductor using directed self assembly, 868011 (26 March 2013); doi: 10.1117/12.2011631
Proc. SPIE 8680, The potential of block copolymer’s directed self-assembly for contact hole shrink and contact multiplication, 868012 (26 March 2013); doi: 10.1117/12.2011477
Proc. SPIE 8680, Exploration of the directed self-assembly based nano-fabrication design space using computational simulations, 868013 (26 March 2013); doi: 10.1117/12.2011238
Proc. SPIE 8680, The hole shrink problem: Theoretical studies of directed self-assembly in cylindrical confinement, 868014 (26 March 2013); doi: 10.1117/12.2011198
Proc. SPIE 8680, Novel error mode analysis method for graphoepitaxial directed self-assembly lithography based on the dissipative particle dynamics method, 868015 (26 March 2013); doi: 10.1117/12.2011439
Proc. SPIE 8680, Defectivity study of directed self-assembly of cylindrical diblock copolymers in laterally confined thin channels, 868016 (26 March 2013); doi: 10.1117/12.2011178
Nanoprobe Array Direct-Write Technologies
Proc. SPIE 8680, Scanning probe lithography approach for beyond CMOS devices, 868017 (26 March 2013); doi: 10.1117/12.2012199
Proc. SPIE 8680, 0.1-nanometer resolution positioning stage for sub-10 nm scanning probe lithography, 868018 (26 March 2013); doi: 10.1117/12.2012324
Proc. SPIE 8680, Mix & match electron beam & scanning probe lithography for high throughput sub-10 nm lithography, 868019 (26 March 2013); doi: 10.1117/12.2011535
E-Beam Direct-Write for High-Volume Manufacturing III
Proc. SPIE 8680, Influence of high-energy electron irradiation on ultra-low-k characteristics and transistor performance, 86801A (26 March 2013); doi: 10.1117/12.2011467
Proc. SPIE 8680, A dose modification strategy of electron beam direct writing considering TDDB reliability in LSI interconnects, 86801B (26 March 2013); doi: 10.1117/12.2011694
Proc. SPIE 8680, Influence of data volume and EPC on process window in massively parallel e-beam direct write, 86801C (26 March 2013); doi: 10.1117/12.2010865
Proc. SPIE 8680, MAPPER alignment sensor evaluation on process wafers, 86801E (26 March 2013); doi: 10.1117/12.2011402
DSA Lines-Spaces
Proc. SPIE 8680, Fabrication of 28nm pitch Si fins with DSA lithography, 86801F (26 March 2013); doi: 10.1117/12.2011607
Proc. SPIE 8680, Directed self-assembly process implementation in a 300mm pilot line environment, 86801G (26 March 2013); doi: 10.1117/12.2011610
Proc. SPIE 8680, Process sensitivities in exemplary chemo-epitaxy directed self-assembly integration, 86801H (26 March 2013); doi: 10.1117/12.2011446
Proc. SPIE 8680, Large-scale dynamics of directed self-assembly defects on chemically pre-patterned surface, 86801I (26 March 2013); doi: 10.1117/12.2011826
Poster Session: Directed Self-Assembly
Proc. SPIE 8680, Dissipative particle dynamics study on directed self-assembly in holes, 86801J (26 March 2013); doi: 10.1117/12.2011069
Proc. SPIE 8680, Dissipative particle dynamics simulations to optimize contact hole shrink process using graphoepitaxial directed self-assembly, 86801K (26 March 2013); doi: 10.1117/12.2009622
Proc. SPIE 8680, Computational simulation of block copolymer directed self-assembly in small topographical guiding templates, 86801L (26 March 2013); doi: 10.1117/12.2011264
Proc. SPIE 8680, Polymer blends for directed self-assembly, 86801M (26 March 2013); doi: 10.1117/12.2011418
Proc. SPIE 8680, Multifunctional hardmask neutral layer for directed self-assembly (DSA) patterning, 86801P (26 March 2013); doi: 10.1117/12.2011567
Proc. SPIE 8680, Perpendicular orientation of block-co-polymer on controlled neutralization layer , 86801Q (26 March 2013); doi: 10.1117/12.2011638
Proc. SPIE 8680, Block-copolymer healing of simple defects in a chemoepitaxial template, 86801R (26 March 2013); doi: 10.1117/12.2011656
Proc. SPIE 8680, Using process monitor wafers to understand directed self-assembly defects, 86801S (26 March 2013); doi: 10.1117/12.2011658
Proc. SPIE 8680, Orientation and position-controlled block copolymer nanolithography for bit-patterned media, 86801U (26 March 2013); doi: 10.1117/12.2012654
Proc. SPIE 8680, PS-b-PAA as a high X polymer for directed self-assembly: a study of solvent and thermal annealing processes for PS-b-PAA, 86801V (5 April 2013); doi: 10.1117/12.2021414
Proc. SPIE 8680, PS-b-PHEMA: synthesis, characterization, and processing of a high X polymer for directed self-assembly lithography, 86801W (5 April 2013); doi: 10.1117/12.2021417
Proc. SPIE 8680, PS-b-PHOST as a high X block copolymers for directed self assembly: optimization of underlayer and solvent anneal processes, 86801X (5 April 2013); doi: 10.1117/12.2021420
Proc. SPIE 8680, Coarse grained molecular dynamics model of block copolymer directed self-assembly, 86801Y (5 April 2013); doi: 10.1117/12.2021439
Proc. SPIE 8680, Tuning domain size of block copolymers for directed self assembly using polymer blending: molecular dynamics simulation studies, 86801Z (5 April 2013); doi: 10.1117/12.2021442
Proc. SPIE 8680, Effects of block copolymer polydispersity and xN on pattern line edge roughness and line width roughness from directed self-assembly of diblock copolymers, 868020 (26 March 2013); doi: 10.1117/12.2021443
Poster Session: Direct-Write/Maskless Lithography
Proc. SPIE 8680, Alignment strategy for mixed e-beam and optical lithography, 868021 (26 March 2013); doi: 10.1117/12.1000095
Proc. SPIE 8680, Block co-polymer multiple patterning directed self-assembly on PS-OH brush layer and AFM based nanolithography, 868022 (26 March 2013); doi: 10.1117/12.2014515
Proc. SPIE 8680, Image contrast of line-cut / contact hole features in Complementary E-Beam Lithography (CEBL), 868023 (26 March 2013); doi: 10.1117/12.2011204
Proc. SPIE 8680, Direct-write maskless lithography using patterned oxidation of Si-substrate Induced by femtosecond laser pulses, 868024 (26 March 2013); doi: 10.1117/12.2006399
Proc. SPIE 8680, A slim column cell of 12nm resolution for wider application of e-beam lithography, 868025 (26 March 2013); doi: 10.1117/12.2011376
Proc. SPIE 8680, Practical study on the electron-beam-only alignment strategy for the electron beam direct writing technology, 868026 (26 March 2013); doi: 10.1117/12.2011628