Proceedings Volume 8684 is from: Logo
SPIE ADVANCED LITHOGRAPHY
24-28 February 2013
San Jose, California, United States
Front Matter: Volume 8684
Proc. SPIE 8684, Front Matter: Volume 8684, 868401 (23 April 2013); doi: 10.1117/12.2028890
Keynote Session
Proc. SPIE 8684, Design for manufacturability: a fabless perspective, 868403 (29 March 2013); doi: 10.1117/12.2015173
DFDP: Design for Multipatterning
Proc. SPIE 8684, Diffraction pattern based optimization of lithographic targets for improved printability, 868405 (29 March 2013); doi: 10.1117/12.2011532
Proc. SPIE 8684, Self-aligned double patterning friendly configuration for standard cell library considering placement impact, 868406 (29 March 2013); doi: 10.1117/12.2011660
Proc. SPIE 8684, Evaluation of cost-driven triple patterning lithography decomposition, 868407 (29 March 2013); doi: 10.1117/12.2011670
Design Rules and Routing
Proc. SPIE 8684, Self-aligned double patterning compliant routing with in-design physical verification flow, 868408 (29 March 2013); doi: 10.1117/12.2013245
Proc. SPIE 8684, Pattern matching for identifying and resolving non-decomposition-friendly designs for double patterning technology (DPT), 868409 (29 March 2013); doi: 10.1117/12.2011690
Proc. SPIE 8684, Detailed routing with advanced flexibility and in compliance with self-aligned double patterning constraints, 86840A (29 March 2013); doi: 10.1117/12.2010644
Proc. SPIE 8684, Pioneering an on-the-fly simulation technique for the detection of layout-dependent effects during IC design phase, 86840B (29 March 2013); doi: 10.1117/12.2009242
Design for Manufacturability for DSA: Joint Session with Conferences 8680 and 8684
Proc. SPIE 8684, Rethinking ASIC design with next generation lithography and process integration, 86840C (29 March 2013); doi: 10.1117/12.2014374
Optical and DFM I: Joint Session with Conferences 8683 and 8684
Proc. SPIE 8684, Enhanced spacer-is-dielectric (sid) decomposition flow with model-based verification, 86840D (29 March 2013); doi: 10.1117/12.2011029
Proc. SPIE 8684, Mask strategy and layout decomposition for self-aligned quadruple patterning, 86840E (29 March 2013); doi: 10.1117/12.2011261
Proc. SPIE 8684, Process characteristics and layout decomposition of self-aligned sextuple patterning, 86840F (29 March 2013); doi: 10.1117/12.2011370
Optical and DFM II: Joint Session with Conferences 8683 and 8684
Proc. SPIE 8684, Triple patterning lithography (TPL) layout decomposition using end-cutting, 86840G (29 March 2013); doi: 10.1117/12.2011355
Proc. SPIE 8684, Process window analysis of algorithmic assist feature placement options at the 2X nm node DRAM, 86840H (29 March 2013); doi: 10.1117/12.2011450
Design Implications and Variability
Proc. SPIE 8684, Compact modeling of fin-width roughness induced FinFET device variability using the perturbation method, 86840I (29 March 2013); doi: 10.1117/12.2011551
Proc. SPIE 8684, Understanding device impact of line edge/width roughness in frequency domain, 86840J (29 March 2013); doi: 10.1117/12.2013495
Proc. SPIE 8684, SRAM circuit performance in the presence of process variability of self-aligned multiple patterning, 86840K (29 March 2013); doi: 10.1117/12.2011686
Proc. SPIE 8684, Post-routing back-end-of-line layout optimization for improved time-dependent dielectric breakdown reliability, 86840L (29 March 2013); doi: 10.1117/12.2011645
Proc. SPIE 8684, Double patterning: solutions in parasitic extraction, 86840M (29 March 2013); doi: 10.1117/12.2010838
Algorithms for DFM
Proc. SPIE 8684, Model based hint for litho hotspot fixing beyond 20nm node, 86840N (29 March 2013); doi: 10.1117/12.2011619
Proc. SPIE 8684, A novel algorithm for automatic arrays detection in a layout, 86840O (29 March 2013); doi: 10.1117/12.2011413
Proc. SPIE 8684, An automated resource management system to improve production tapeout turn-around time, 86840P (29 March 2013); doi: 10.1117/12.2011231
Posters-Wednesday
Proc. SPIE 8684, A novel methodology for building robust design rules by using design based metrology (DBM), 86840Q (29 March 2013); doi: 10.1117/12.2009583
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