PROCEEDINGS VOLUME 8701
PHOTOMASK AND NGL MASK TECHNOLOGY XX | 16-18 APRIL 2013
Photomask and Next-Generation Lithography Mask Technology XX
PHOTOMASK AND NGL MASK TECHNOLOGY XX
16-18 April 2013
Yokohama, Japan
Front Matter: Volume 8701
Proc. SPIE 8701, Front Matter: Volume 8701, 870101 (9 July 2013); doi: 10.1117/12.2032560
Writing Technologies
Proc. SPIE 8701, Modeling of resist surface charging effect on EBM-8000 and its comparison with EBM-6000, 870102 (28 June 2013); doi: 10.1117/12.2030095
Proc. SPIE 8701, Next generation electron beam lithography system F7000 for wide range applications, 870103 (28 June 2013); doi: 10.1117/12.2029193
Material and Process
Proc. SPIE 8701, Effect of cleaning chemistry on MegaSonic damage, 870104 (28 June 2013); doi: 10.1117/12.2027974
Proc. SPIE 8701, Megasonic cleaning: effect of dissolved gas properties on cleaning, 870105 (28 June 2013); doi: 10.1117/12.2029883
Proc. SPIE 8701, Physical force optimization for advanced photomask cleaning, 870106 (28 June 2013); doi: 10.1117/12.2028484
Proc. SPIE 8701, Progressive defects caused by crosstalk between mask fabrication processes, 870107 (28 June 2013); doi: 10.1117/12.2032735
Repair II
Proc. SPIE 8701, In-situ repair qualification by applying Computational Metrology and Inspection (CMI) technologies, 870108 (28 June 2013); doi: 10.1117/12.2030688
Proc. SPIE 8701, A method of utilizing AIMS to quantify substrate/attenuator over-etch or under-etch during mask repair, 870109 (28 June 2013); doi: 10.1117/12.2027883
Inspection and Metrology I
Proc. SPIE 8701, Photomask quality evaluation using lithography simulation and multi-detector MVM-SEM, 87010A (28 June 2013); doi: 10.1117/12.2027201
Proc. SPIE 8701, Mask degradation monitoring with aerial mask inspector, 87010B (28 June 2013); doi: 10.1117/12.2028101
MDP and EDA
Proc. SPIE 8701, Fuzzy pattern matching techniques for photomask layout data, 87010C (28 June 2013); doi: 10.1117/12.2027851
Proc. SPIE 8701, Using a mask rule checker as an electrical rule checker, 87010D (28 June 2013); doi: 10.1117/12.2028657
Proc. SPIE 8701, Verification: an enabler for model based data preparation, 87010E (28 June 2013); doi: 10.1117/12.2032321
Proc. SPIE 8701, Comparison techniques for VSB fractured vs. unfractured data, 87010F (28 June 2013); doi: 10.1117/12.2027339
Proc. SPIE 8701, Circle pattern detector & VSB shot count estimator, 87010G (28 June 2013); doi: 10.1117/12.2028495
Proc. SPIE 8701, Better numerical model for shape-dependent dose margin correction using model-based mask data preparation, 87010H (28 June 2013); doi: 10.1117/12.2028333
FPD Photomasks I
Proc. SPIE 8701, High resolution technology for FPD lithography tools, 87010I (28 June 2013); doi: 10.1117/12.2028215
Proc. SPIE 8701, Development of the CLIOS G821 system for inspection of LSPM for high-definition FPDs, 87010J (28 June 2013); doi: 10.1117/12.2029106
MDP
Proc. SPIE 8701, In collaboration with mask suppliers for change management enhancement, 87010K (28 June 2013); doi: 10.1117/12.2028296
Proc. SPIE 8701, Quality enhancement of parallel MDP flows with mask suppliers, 87010L (28 June 2013); doi: 10.1117/12.2028297
Proc. SPIE 8701, Layout finishing of a 28nm, 3 billions transistors, multi-core processor, 87010M (28 June 2013); doi: 10.1117/12.2028314
Proc. SPIE 8701, A novel algorithm for notch detection, 87010N (28 June 2013); doi: 10.1117/12.2028471
Proc. SPIE 8701, Advancements in automatic marking with range pattern matching, 87010O (28 June 2013); doi: 10.1117/12.2027338
Proc. SPIE 8701, A study of applications scribe frame data verifications using design rule check , 87010P (28 June 2013); doi: 10.1117/12.2028330
EUVL Masks I
Proc. SPIE 8701, Exploring probability of shallow ML defect impact to defect assurance, 87010Q (28 June 2013); doi: 10.1117/12.2031845
Proc. SPIE 8701, Challenge for under 40nm size pattern making for EUV mask, 87010R (28 June 2013); doi: 10.1117/12.2030183
Proc. SPIE 8701, Development of optical system on novel Projection Electron Microscopy (PEM) for EUV masks and its basic performance evaluation, 87010S (28 June 2013); doi: 10.1117/12.2030647
Proc. SPIE 8701, EUV scanner throughput considerations for the higher mask magnification, 87010T (28 June 2013); doi: 10.1117/12.2025362
Lithography Related Technologies
Inspection and Metrology II
Proc. SPIE 8701, Improvement of a DUV mask inspection tool to hand over the baton for next-generation tool smoothly, 87010V (28 June 2013); doi: 10.1117/12.2029363
Proc. SPIE 8701, EUV reticle inspection with a 193nm reticle inspector, 87010W (28 June 2013); doi: 10.1117/12.2032553
EUVL Masks II
Proc. SPIE 8701, Investigation of cleaning process induced CD shift at EUV mask, 87010X (28 June 2013); doi: 10.1117/12.2027980
Proc. SPIE 8701, Improvement of EUVL mask structure with black border of etched multilayer, 87010Y (2 August 2013); doi: 10.1117/12.2031582
Proc. SPIE 8701, E-beam resist outgassing for study of correlation between resist sensitivity and e-beam optic contamination, 87010Z (28 June 2013); doi: 10.1117/12.2032772
EUVL Masks III
Proc. SPIE 8701, A study of phase defect measurement on EUV mask by multiple detectors CD-SEM, 870110 (28 June 2013); doi: 10.1117/12.2031846
Proc. SPIE 8701, Defect printability studies at SEMATECH, 870111 (28 June 2013); doi: 10.1117/12.2028069
Proc. SPIE 8701, Using pattern shift to avoid blank defects during EUVL mask fabrication, 870112 (28 June 2013); doi: 10.1117/12.2030765
Proc. SPIE 8701, A very fast and accurate rigorous EMF simulator for EUVL masks based on the pseudo-spectral time-domain method, 870113 (28 June 2013); doi: 10.1117/12.2027329
EUVL Masks IV
Proc. SPIE 8701, Evaluation of non-actinic EUV mask inspection and defect printability on multiple EUV mask absorbers, 870114 (28 June 2013); doi: 10.1117/12.2029882
Proc. SPIE 8701, Extending DUV mask inspection tool for inspecting 2xnm HP and beyond, 870115 (28 June 2013); doi: 10.1117/12.2032774
EUVL Masks V
Proc. SPIE 8701, Pattern inspection performance of novel Projection Electron Microscopy (PEM) on EUV masks, 870116 (28 June 2013); doi: 10.1117/12.2030653
Proc. SPIE 8701, Background level analysis on an actinic inspection image of EUVL mask blank, 870117 (7 August 2013); doi: 10.1117/12.2031583
Proc. SPIE 8701, The capability of high magnification review function for EUV actinic blank inspection tool, 870118 (28 June 2013); doi: 10.1117/12.2030712
Proc. SPIE 8701, Phase imaging of EUV masks using a lensless EUV microscope, 870119 (28 June 2013); doi: 10.1117/12.2027283
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