PROCEEDINGS VOLUME 8973
SPIE MOEMS-MEMS | 1-6 FEBRUARY 2014
Micromachining and Microfabrication Process Technology XIX
IN THIS VOLUME

0 Sessions, 24 Papers, 0 Presentations
Proceedings Volume 8973 is from: Logo
SPIE MOEMS-MEMS
1-6 February 2014
San Francisco, California, United States
Front Matter: Volume 8973
Proc. SPIE 8973, Front Matter: Volume 8973, 897301 (27 March 2014); doi: 10.1117/12.2064078
Device Fabrication
Proc. SPIE 8973, Fabrication of microelectromechanical systems (MEMS) cantilevers for photoacoustic (PA) detection of terahertz (THz) radiation, 897302 (7 March 2014); doi: 10.1117/12.2037376
Proc. SPIE 8973, Isolating the negative stiffness region of a buckled Si/SiO2 membrane, 897304 (7 March 2014); doi: 10.1117/12.2037383
Proc. SPIE 8973, Thin film fabrication and system integration test run for a microactuator for a tuneable lens, 897305 (7 March 2014); doi: 10.1117/12.2039061
Device Design
Proc. SPIE 8973, Calibrating bimetallic grayscale photomasks to photoresist response for precise micro-optics fabrication, 897307 (7 March 2014); doi: 10.1117/12.2041429
Microfabrication Techniques
Proc. SPIE 8973, Deep silicon etching: current capabilities and future directions, 897309 (7 March 2014); doi: 10.1117/12.2046694
Proc. SPIE 8973, Chemical mechanical polishing of boron-doped polycrystalline silicon, 89730A (7 March 2014); doi: 10.1117/12.2036822
Proc. SPIE 8973, A novel process for the fabrication of microstructures half the listed minimum feature size of a direct-write laser lithography system, 89730B (7 March 2014); doi: 10.1117/12.2037366
Proc. SPIE 8973, Periodic nanostructures fabricated by Talbot extreme ultraviolet lithography, 89730D (7 March 2014); doi: 10.1117/12.2041688
Proc. SPIE 8973, Fabrication of 3D surface structures using grayscale lithography, 89730E (7 March 2014); doi: 10.1117/12.2037361
Proc. SPIE 8973, Residual stress control during the growth and release process in gold suspended microstructures, 89730F (7 March 2014); doi: 10.1117/12.2041433
New Materials for Microfabrication
Proc. SPIE 8973, Phase Change Materials (PCM) fabricated in vertical structures for reconfigurable and tunable circuits, 89730G (7 March 2014); doi: 10.1117/12.2037372
Proc. SPIE 8973, Microfabrication of passive electronic components with printed graphene-oxide deposition, 89730H (7 March 2014); doi: 10.1117/12.2038411
Proc. SPIE 8973, Optimal microelectromechanical systems (MEMS) device for achieving high pyroelectric response of AlN, 89730I (7 March 2014); doi: 10.1117/12.2037386
Proc. SPIE 8973, Fabrication technology to increase surface area of ionomer membrane material and its application towards high surface area electric double-layer capacitors, 89730J (7 March 2014); doi: 10.1117/12.2040273
Laser Micromachining
Proc. SPIE 8973, Laser micromachining of oxygen reduced graphene-oxide films, 89730K (7 March 2014); doi: 10.1117/12.2038423
Proc. SPIE 8973, Laser assisted and hermetic room temperature bonding based on direct bonding technology, 89730L (7 March 2014); doi: 10.1117/12.2040237
Proc. SPIE 8973, Design and fabrication of sub-wavelength annular apertures on fiber tip for femtosecond laser machining, 89730M (7 March 2014); doi: 10.1117/12.2039148
Poster Session
Proc. SPIE 8973, Design of active temperature compensated composite free-free beam MEMS resonators in a standard process, 89730N (7 March 2014); doi: 10.1117/12.2036239
Proc. SPIE 8973, Design and fabrication of three-axis accelerometer sensor microsystem for wide temperature range applications using semi-custom process, 89730O (7 March 2014); doi: 10.1117/12.2037344
Proc. SPIE 8973, Facile fabrication of nanogap electrodes for suspended graphene characterization using direct ion beam patterning, 89730P (7 March 2014); doi: 10.1117/12.2037853
Proc. SPIE 8973, Resonator structures on AlN ceramics surface treated by laser radiation, 89730Q (7 March 2014); doi: 10.1117/12.2037937
Proc. SPIE 8973, Annular heating of optical fiber with a CO2 laser with reflective axicon elements, 89730R (7 March 2014); doi: 10.1117/12.2039286
Proc. SPIE 8973, Compliant MEMS mechanism to extend resolution in Fourier transform spectroscopy, 89730S (7 March 2014); doi: 10.1117/12.2044171
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