Front Matter
Proc. SPIE 8991, Front Matter: Volume 8991, 899101 (2 April 2014); doi: 10.1117/12.2063966
Optical Waveguide Technologies
Proc. SPIE 8991, Graded-index core polymer optical waveguide for high-bandwidth-density optical printed circuit boards: fabrication and characterization, 899102 (8 March 2014); doi: 10.1117/12.2037469
Proc. SPIE 8991, Multilayer single-mode polymeric waveguides by imprint patterning for optical interconnects, 899103 (8 March 2014); doi: 10.1117/12.2043153
Proc. SPIE 8991, Laser-written polymer waveguides for embedded printed circuit board computing applications, 899104 (8 March 2014); doi: 10.1117/12.2036028
Proc. SPIE 8991, Performance of step index multimode waveguides with tuned numerical aperture for on-board optical links, 899105 (8 March 2014); doi: 10.1117/12.2039637
Nanophotonics for Optical Interconnects
Proc. SPIE 8991, Towards 10-40 GHz on-chip micro-optical links with all integrated Si Av LED optical sources, Si N based waveguides and Si-Ge detector technology, 899108 (8 March 2014); doi: 10.1117/12.2038079
Proc. SPIE 8991, Fabrication and characterization of the Si-photonics-integrated vertical resonant-cavity light-emitting diode, 899109 (8 March 2014); doi: 10.1117/12.2038642
Proc. SPIE 8991, Spoked-ring microcavities: enabling seamless integration of nanophotonics in unmodified advanced CMOS microelectronics chips, 89910B (8 March 2014); doi: 10.1117/12.2054788
Parallel Optical Links and Active Optical Cables
Fiber Optics and Micro-Optics Integration
Proc. SPIE 8991, Efficient and scalable single mode waveguide coupling on silicon based substrates, 89910G (8 March 2014); doi: 10.1117/12.2040143
Proc. SPIE 8991, Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application, 89910H (8 March 2014); doi: 10.1117/12.2040169
Proc. SPIE 8991, Low-loss connections between no-polish optical fibers in elastically deformable connectors, 89910I (8 March 2014); doi: 10.1117/12.2039051
Proc. SPIE 8991, New single-mode, multi-fiber, expanded-beam, passive optical interconnect, 89910J (8 March 2014); doi: 10.1117/12.2043171
Silicon Photonic Devices
Proc. SPIE 8991, Silicon on insulator optical modulators for integration in photonic optical circuits, 89910K (8 March 2014); doi: 10.1117/12.2042911
Proc. SPIE 8991, Composite-CMOS integrated photonics for high bandwidth WDM optical interconnects, 89910N (8 March 2014); doi: 10.1117/12.2044277
Proc. SPIE 8991, Hybrid silicon-electro-optic-polymer integrated high-performance optical modulator, 89910O (8 March 2014); doi: 10.1117/12.2044228
Optical Interconnect Devices and Switches
Proc. SPIE 8991, Silicon/electro-optic polymer hybrid directional coupler switch, 89910Q (8 March 2014); doi: 10.1117/12.2040068
Proc. SPIE 8991, Polymer waveguide with tunable optofluidic couplers for card-to-backplane optical interconnects, 89910R (8 March 2014); doi: 10.1117/12.2040070
Proc. SPIE 8991, Microsecond regime optical cross connect: 32 port to 32 port scalable device, 89910S (8 March 2014); doi: 10.1117/12.2040303
Proc. SPIE 8991, Chip-to-chip optical interconnects based on flexible integrated photonics, 89910T (8 March 2014); doi: 10.1117/12.2037812
Nanophotonics for Optical Interconnects II
Proc. SPIE 8991, Plasmonic modulator for three-dimensional chip-to-chip optical interconnects, 89910V (8 March 2014); doi: 10.1117/12.2042431
Proc. SPIE 8991, Tunable nanoscale-effecient plasmonic demultiplexers, 89910W (8 March 2014); doi: 10.1117/12.2040843
Proc. SPIE 8991, Ultra-low loss and compact coplanar waveguide crossing, 89910X (8 March 2014); doi: 10.1117/12.2044227
Optical Interconnect Systems
Proc. SPIE 8991, Optical RAM-enabled cache memory and optical routing for chip multiprocessors: technologies and architectures, 89910Z (8 March 2014); doi: 10.1117/12.2042732
Proc. SPIE 8991, Demonstration of fully enabled data center subsystem with embedded optical interconnect, 899110 (8 March 2014); doi: 10.1117/12.2039865
Proc. SPIE 8991, Mixed-level optical-system simulation incorporating component-level modeling of interface elements, 899111 (8 March 2014); doi: 10.1117/12.2040329
Proc. SPIE 8991, Fabrication of modulators and 2x2 switches in SOI based on the carrier depletion mechanism for optical interconnects, 899112 (8 March 2014); doi: 10.1117/12.2044245
Manufacturing Technologies
Proc. SPIE 8991, Development of electro-optical PCBs with embedded waveguides for data center and high performance computing applications, 899113 (8 March 2014); doi: 10.1117/12.2039875
Proc. SPIE 8991, Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems, 899114 (8 March 2014); doi: 10.1117/12.2040479
Proc. SPIE 8991, Optical connecting devices fabricated by self-written waveguide technology for smart optical interconnect, 899115 (8 March 2014); doi: 10.1117/12.2041891
Proc. SPIE 8991, Towards roll-to-roll manufacturing of polymer photonic devices, 899116 (8 March 2014); doi: 10.1117/12.2044229
PICs for Optical Interconnects: Joint Session with Conferences 8989 and 8991
Proc. SPIE 8991, Advances in integrated photonic circuits for packet-switched interconnection, 899117 (8 March 2014); doi: 10.1117/12.2040691
Proc. SPIE 8991, Silicon photonic integrated devices for datacenter optical networks, 899118 (8 March 2014); doi: 10.1117/12.2043689
Poster Session
Proc. SPIE 8991, Pitch control of multi-channel graded-index core polymer waveguide for optical PCB using the Mosquito method, 899119 (8 March 2014); doi: 10.1117/12.2039105
Proc. SPIE 8991, Surface normal coupling to multiple-slot and cover-slotted silicon nanocrystalline waveguides and ring resonators, 89911A (8 March 2014); doi: 10.1117/12.2044231
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