Front Matter: Volume 9049
Proc. SPIE 9049, Front Matter: Volume 9049, 904901 (28 March 2014); doi: 10.1117/12.2065573
DSA Process and Integration
Proc. SPIE 9049, Defect reduction and defect stability in IMEC's 14nm half-pitch chemo-epitaxy DSA flow, 904905 (28 March 2014); doi: 10.1117/12.2047265
Proc. SPIE 9049, Simulations of spatial DSA morphology, DSA-aware assist features and block copolymer-homopolymer blends, 904908 (28 March 2014); doi: 10.1117/12.2046082
Proc. SPIE 9049, Towards electrical testable SOI devices using Directed Self-Assembly for fin formation, 904909 (28 March 2014); doi: 10.1117/12.2046462
Novel Nanolithography
Proc. SPIE 9049, Closed-loop high-speed 3D thermal probe nanolithography, 90490B (28 March 2014); doi: 10.1117/12.2046201
Proc. SPIE 9049, Electric field scanning probe lithography on molecular glass resists using self-actuating, self-sensing cantilever, 90490C (28 March 2014); doi: 10.1117/12.2046973
Proc. SPIE 9049, A frequency multiplication technique based on EUV near-field imaging, 90490D (28 March 2014); doi: 10.1117/12.2045880
Roll to Roll UV Nanoimprint Lithography
Proc. SPIE 9049, High resolution patterning for flexible electronics via roll-to-roll nanoimprint lithography, 90490F (28 March 2014); doi: 10.1117/12.2046479
Proc. SPIE 9049, High volume nanoscale roll-based imprinting using jet and flash imprint lithography, 90490G (28 March 2014); doi: 10.1117/12.2048172
Proc. SPIE 9049, Enabling large area and high throughput roll-to-roll NIL by novel inkjetable and photo-curable NIL resists, 90490H (28 March 2014); doi: 10.1117/12.2046279
Proc. SPIE 9049, Challenges for pattern formation with sub-100nm residual-layer thickness by roll-to-roll nanoimprint lithography, 90490I (28 March 2014); doi: 10.1117/12.2046248
Beam Lithography
Proc. SPIE 9049, Size and shape control of sub-20nm patterns fabricated using focused electron beam induced processing, 90490M (28 March 2014); doi: 10.1117/12.2046356
Proc. SPIE 9049, Increased throughput, determined by a suite of benchmark patterns, in a Gaussian electron-beam lithography tool with a 100 MHz writing rate, 90490O (28 March 2014); doi: 10.1117/12.2046609
DSA Materials and Processes I: Joint Session with Conferences 9049 and 9051
Proc. SPIE 9049, Extending the scope of poly(styrene)-block-poly(methyl methacrylate) for directed self-assembly, 90490R (28 March 2014); doi: 10.1117/12.2046296
Proc. SPIE 9049, Simulation study of the effect of differences in block energy and density on the self-assembly of block copolymers, 90490S (28 March 2014); doi: 10.1117/12.2046603
Proc. SPIE 9049, Improvements of self-assembly properties via homopolymer addition or block-copolymer blends, 90490T (28 March 2014); doi: 10.1117/12.2046329
DSA Materials and Processes II: Joint Session with 9049 and 9051
Proc. SPIE 9049, Guided self-assembly of Si-containing block copolymer with a topcoat surface treatment, 90490X (28 March 2014); doi: 10.1117/12.2046270
Proc. SPIE 9049, Self-assembly of high-resolutions PS-b-PMMA block-copolymers: processes capabilities and integration on 300mm track, 90490Y (28 March 2014); doi: 10.1117/12.2046313
Step and Repeat UV Nanoimprint Lithography
Proc. SPIE 9049, Hard disk drive thin film head manufactured using nanoimprint lithography, 90490Z (28 March 2014); doi: 10.1117/12.2048829
Proc. SPIE 9049, High-throughput jet and flash imprint lithography for advanced semiconductor memory, 904910 (28 March 2014); doi: 10.1117/12.2048189
Proc. SPIE 9049, The prospects of design for roll to roll lithography: layout refinement utilizing process simulation, 904911 (28 March 2014); doi: 10.1117/12.2046771
Multiple Electron Beam Direct Write Lithography
Proc. SPIE 9049, Demonstration of EDA flow for massively parallel e-beam lithography, 904915 (28 March 2014); doi: 10.1117/12.2046091
Proc. SPIE 9049, The REBL DPG: recent innovations and remaining challenges, 904917 (28 March 2014); doi: 10.1117/12.2048528
Proc. SPIE 9049, Massively parallel electron beam direct writing (MPEBDW) system based on micro-electro-mechanical system (MEMS)/nanocrystalineSi emitter array, 904918 (28 March 2014); doi: 10.1117/12.2046584
DSA Line Patterning
Proc. SPIE 9049, Tuning the strength of chemical patterns for directed self-assembly of block copolymers, 90491B (28 March 2014); doi: 10.1117/12.2047585
Proc. SPIE 9049, Predicting process windows for pattern density multiplication using block copolymer directed self-assembly in conjunction with chemoepitaxial guiding layers, 90491C (28 March 2014); doi: 10.1117/12.2046626
Proc. SPIE 9049, Directed self-assembly of diblock copolymers in laterally confining channels: line-edge-roughness and defectivity, 90491D (28 March 2014); doi: 10.1117/12.2045774
Nanodevice Fabrication
Proc. SPIE 9049, Nanoimprint lithography process chains for the fabrication of micro- and nanodevices, 90491E (28 March 2014); doi: 10.1117/12.2048517
Proc. SPIE 9049, New lithography technology for sub-10nm patterning with shrinking organic material, 90491I (28 March 2014); doi: 10.1117/12.2046307
DSA Design for Manufacturability: Joint Session with Conferences 9049, 9052, and 9053
Proc. SPIE 9049, A full-chip DSA correction framework, 90491J (28 March 2014); doi: 10.1117/12.2045982
Proc. SPIE 9049, DFM for defect-free DSA hole shrink process, 90491K (28 March 2014); doi: 10.1117/12.2046108
DSA Via Patterning
Proc. SPIE 9049, Evaluation of integration schemes for contact-hole grapho-epitaxy DSA: a study of substrate and template affinity control, 90491L (28 March 2014); doi: 10.1117/12.2046119
Proc. SPIE 9049, Field-theoretic simulations of directed self-assembly in cylindrical confinement: placement and rectification aspects, 90491M (28 March 2014); doi: 10.1117/12.2046472
Proc. SPIE 9049, Contact holes patterning by directed self-assembly of block copolymers: What would be the Bossung plot?, 90491N (28 March 2014); doi: 10.1117/12.2046342
Proc. SPIE 9049, Influence of litho patterning on DSA placement errors, 90491O (28 March 2014); doi: 10.1117/12.2048065
Poster Session: Nanoimprint Lithography
Proc. SPIE 9049, Novel fluorinated compounds that improve durability of antistick layer for quartz mold, 90491Q (28 March 2014); doi: 10.1117/12.2044448
Proc. SPIE 9049, A single-nanometer nanoimprint-mask fabrication by EB lithography followed by nanoimprinting and self-aligned double-patterning, 90491R (28 March 2014); doi: 10.1117/12.2050012
Proc. SPIE 9049, Fluorine coatings for nanoimprint lithography masks, 90491S (28 March 2014); doi: 10.1117/12.2057117
Poster Session: Novel Nanolithography
Proc. SPIE 9049, Photoinhibited superresolution lithography: overcoming chemical blur, 90491W (28 March 2014); doi: 10.1117/12.2063254
Poster Session: Electron-Beam Lithography
Proc. SPIE 9049, REBL DPG lenslet structure: design for charging prevention, 90491X (28 March 2014); doi: 10.1117/12.2045416
Proc. SPIE 9049, Analysis of mix-and-match litho approach for manufacturing 20nm logic-node products, 90491Y (28 March 2014); doi: 10.1117/12.2046095
Proc. SPIE 9049, A shape-modification strategy of electron-beam direct writing considering circuit performance in LSI interconnects, 90491Z (28 March 2014); doi: 10.1117/12.2046336
Poster Session: Directed Self-Assembly
Proc. SPIE 9049, DSA template optimization for contact layer in 1D standard cell design, 904920 (28 March 2014); doi: 10.1117/12.2045691
Proc. SPIE 9049, Simulation analysis of directed self-assembly for hole multiplication in guide pattern, 904921 (28 March 2014); doi: 10.1117/12.2045865
Proc. SPIE 9049, Self-consistent field theory of directed self-assembly on chemically prepatterned surfaces, 904922 (28 March 2014); doi: 10.1117/12.2045917
Proc. SPIE 9049, Towards the fast DSA: improvement of computational performance of the DSA model, 904923 (28 March 2014); doi: 10.1117/12.2046048
Proc. SPIE 9049, Self-assembly of Si-containing block copolymers with high-segregation strength: toward sub-10nm features in directed self-assembly, 904925 (28 March 2014); doi: 10.1117/12.2046099
Proc. SPIE 9049, Defect-aware process margin for chemo-epitaxial directed self-assembly lithography using simulation method based on self-consistent field theory, 904926 (28 March 2014); doi: 10.1117/12.2046159
Proc. SPIE 9049, Computational studies of shape rectification in directed self-assembly, 904927 (28 March 2014); doi: 10.1117/12.2046187
Proc. SPIE 9049, 300mm pilot line DSA contact hole process stability, 904929 (28 March 2014); doi: 10.1117/12.2046315
Proc. SPIE 9049, Streamlined etch integration with a unique neutral layer for self-assembled block copolymers (BCPs), 90492A (28 March 2014); doi: 10.1117/12.2046351
Proc. SPIE 9049, Control of PS-b-PMMA directed self-assembly registration by laser induced millisecond thermal annealing, 90492B (28 March 2014); doi: 10.1117/12.2046513
Proc. SPIE 9049, Improvement in electron-beam lithography throughput by exploiting relaxed patterning fidelity requirements with directed self-assembly, 90492C (28 March 2014); doi: 10.1117/12.2046615
Proc. SPIE 9049, Inspection of directed self-assembly defects, 90492D (28 March 2014); doi: 10.1117/12.2046634