Front Matter: Volume 9051
Proc. SPIE 9051, Front Matter: Volume 9051, 905101 (14 April 2014); doi: 10.1117/12.2053822
New EUV Resist Materials: Joint Session with Conferences 9048 and 9051
Proc. SPIE 9051, Novel non-chemically amplified (n-CARs) negative resists for EUVL, 905106 (27 March 2014); doi: 10.1117/12.2041183
Proc. SPIE 9051, Evaluation of vacancies in positive-tone non-chemically and chemically amplified EUV / EB resists: relationship between free-volume and LER, 905107 (27 March 2014); doi: 10.1117/12.2046659
Stochastics and EUV Process Improvements: Joint Session with Conferences 9048 and 9051
Proc. SPIE 9051, Manufacturability improvements in EUV resist processing toward NXE:3300 processing, 905108 (27 March 2014); doi: 10.1117/12.2046254
SEM Simulation and Emulation I: Joint Session with Conferences 9050 and 9051
Proc. SPIE 9051, Investigation of interactions between metrology and lithography with a CD SEM simulator, 905109 (27 March 2014); doi: 10.1117/12.2048247
SEM Simulation and Emulation II: Joint Session with Conferences 9050 and 9051
Proc. SPIE 9051, Assessing SEM contour based OPC models quality using rigorous simulation, 90510A (27 March 2014); doi: 10.1117/12.2047826
Proc. SPIE 9051, SEM simulation for 2D and 3D inspection metrology and defect review, 90510B (2 April 2014); doi: 10.1117/12.2049337
New Materials and Processes
Proc. SPIE 9051, Chiral nanomaterial fabrication by means of on-edge lithography, 90510D (27 March 2014); doi: 10.1117/12.2046214
Proc. SPIE 9051, Positive tone cross-linked resists based on photoacid inhibition of cross linking, 90510E (27 March 2014); doi: 10.1117/12.2046619
Proc. SPIE 9051, Nanopatterning with tailored molecules, 90510G (27 March 2014); doi: 10.1117/12.2047109
Proc. SPIE 9051, Line width roughness reduction by rational design of photoacid generator for sub-millisecond laser post-exposure bake , 90510H (27 March 2014); doi: 10.1117/12.2046277
DSA Materials I
Proc. SPIE 9051, Process optimization of templated DSA flows, 90510I (27 March 2014); doi: 10.1117/12.2047266
Proc. SPIE 9051, An in-situ hard mask block copolymer approach for the fabrication of ordered, large scale, horizontally aligned, Si nanowire arrays on Si substrate, 90510J (27 March 2014); doi: 10.1117/12.2045754
Proc. SPIE 9051, Investigation of cross-linking poly(methyl methacrylate) as a guiding material in block copolymer directed self-assembly, 90510K (27 March 2014); doi: 10.1117/12.2048179
Proc. SPIE 9051, Novel surface treatment materials for aligning block-co-polymer in directed self-assembly processes, 90510L (27 March 2014); doi: 10.1117/12.2046271
Proc. SPIE 9051, Directed self-assembly process integration: Fin patterning approaches and challenges, 90510M (27 March 2014); doi: 10.1117/12.2047268
DSA Materials and Processes I: Joint Session with Conferences 9049 and 9051
Materials and Process Fundamentals
Proc. SPIE 9051, An in situ analysis of resist dissolution in alkali-based and organic solvent-based developers using high speed atomic force microscopy, 90510O (27 March 2014); doi: 10.1117/12.2045886
Proc. SPIE 9051, In-situ analysis of defect formation in coat develop track process, 90510P (27 March 2014); doi: 10.1117/12.2045876
Proc. SPIE 9051, Methods of controlling cross-linking in negative-tone resists, 90510Q (27 March 2014); doi: 10.1117/12.2046616
Proc. SPIE 9051, How to design a good photoresist solvent package using solubility parameters and high-throughput research, 90510R (27 March 2014); doi: 10.1117/12.2045974
Proc. SPIE 9051, ICE: Ionic contrast enhancement for organic solvent negative tone develop, 90510S (27 March 2014); doi: 10.1117/12.2046762
Proc. SPIE 9051, Introduction of an innovative water based photoresist stripping process using intelligent fluids, 90510T (27 March 2014); doi: 10.1117/12.2048068
Advanced Patterning Processes
Proc. SPIE 9051, Reduction of image placement error on photomask-making for multiple patterning, 90510U (27 March 2014); doi: 10.1117/12.2046777
Proc. SPIE 9051, Robust complementary technique with multiple-patterning for sub-10 nm node device, 90510V (27 March 2014); doi: 10.1117/12.2046236
Proc. SPIE 9051, Advanced develop processes for reducing defects related with e-beam resists, 90510W (27 March 2014); doi: 10.1117/12.2047368
Proc. SPIE 9051, Recent progress on multiple-patterning process, 90510X (27 March 2014); doi: 10.1117/12.2046135
Proc. SPIE 9051, Novel and cost-effective multiple patterning technology by means of invisible SiOxNy hardmask, 90510Y (27 March 2014); doi: 10.1117/12.2046107
DSA Materials II
Proc. SPIE 9051, Manufacturability considerations for DSA, 90510Z (27 March 2014); doi: 10.1117/12.2048396
Proc. SPIE 9051, Formation of sub-7 nm feature size PS-b-P4VP block copolymer structures by solvent vapour process, 905110 (27 March 2014); doi: 10.1117/12.2046044
Proc. SPIE 9051, New materials for directed self-assembly for advanced patterning, 905111 (27 March 2014); doi: 10.1117/12.2046328
Underlayers and Spin-on Materials Processing
Proc. SPIE 9051, Extending lithography with advanced materials, 905114 (27 March 2014); doi: 10.1117/12.2047302
Proc. SPIE 9051, EUV lithography and etching performance enhancement by EUV sensitive Si hard mask (EUV Si-HM) for 1Xnm hp generation, 905116 (27 March 2014); doi: 10.1117/12.2046475
Proc. SPIE 9051, A chemical underlayer approach to mitigate shot noise in EUV contact hole patterning, 905117 (27 March 2014); doi: 10.1117/12.2046237
Proc. SPIE 9051, Anti-spacer double patterning, 905118 (27 March 2014); doi: 10.1117/12.2045617
EUV Materials
Proc. SPIE 9051, Optimization of fullerene-based negative tone chemically amplified fullerene resist for extreme ultraviolet lithography, 905119 (27 March 2014); doi: 10.1117/12.2046268
Proc. SPIE 9051, Patterning chemistry of HafSOx resist, 90511A (27 March 2014); doi: 10.1117/12.2046605
Proc. SPIE 9051, EUV resists based on tin-oxo clusters, 90511B (4 April 2014); doi: 10.1117/12.2046536
Proc. SPIE 9051, Inhomogeneity of PAGs in resist film studied by molecular-dynamics simulations for EUV lithography, 90511C (27 March 2014); doi: 10.1117/12.2045872
Poster Session: Advanced Patterning Processes
Proc. SPIE 9051, Innovative solutions on 193 immersion-based self-aligned multiple patterning, 90511E (27 March 2014); doi: 10.1117/12.2046220
Proc. SPIE 9051, Wet particle source identification and reduction using a new filter cleaning process, 90511F (27 March 2014); doi: 10.1117/12.2046560
Proc. SPIE 9051, Adsorption characteristics of lithography filters in various solvents using application-specific ratings, 90511G (27 March 2014); doi: 10.1117/12.2046588
Proc. SPIE 9051, Removal of highly crosslinked resists and hybrid polymers for single micro parts fabrication and nanoimprint stamp rework, 90511H (27 March 2014); doi: 10.1117/12.2046253
Proc. SPIE 9051, Characterization of chemically amplified resists for electron beam lithography, 90511J (27 March 2014); doi: 10.1117/12.2046240
Proc. SPIE 9051, Improved adhesion of novolac and epoxy based resists by cationic organic materials on critical substrates for high volume patterning applications, 90511K (27 March 2014); doi: 10.1117/12.2046258
Poster Session: Materials and Process Fundamentals
Proc. SPIE 9051, Spin on lithographic resist trim process optimization and process window evaluation, 90511L (27 March 2014); doi: 10.1117/12.2045908
Proc. SPIE 9051, Modeling acid transport in chemically amplified resist films, 90511M (27 March 2014); doi: 10.1117/12.2046473
Proc. SPIE 9051, Deprotonation mechanism of ionized poly(4-hydroxystyrene), 90511O (27 March 2014); doi: 10.1117/12.2045881
Proc. SPIE 9051, Numerical analysis for resist profile after thermal process in display manufacturing, 90511P (27 March 2014); doi: 10.1117/12.2046638
Proc. SPIE 9051, Photoresist analysis to investigate LWR generation mechanism, 90511Q (27 March 2014); doi: 10.1117/12.2045864
Proc. SPIE 9051, Decreasing curing temperature of spin-on dielectrics by using additives, 90511R (27 March 2014); doi: 10.1117/12.2046098
Proc. SPIE 9051, Study of acid diffusion behaves form PAG by using top coat method, 90511S (27 March 2014); doi: 10.1117/12.2043205
Proc. SPIE 9051, Fluidity dependence of deprotonation kinetics of chemically amplified resist, 90511T (27 March 2014); doi: 10.1117/12.2046057
Poster Session: New Materials and Processes
Proc. SPIE 9051, Inorganic resist materials based on zirconium phosphonate for atomic force microscope lithography, 90511U (27 March 2014); doi: 10.1117/12.2045641
Proc. SPIE 9051, Organic-inorganic hybrid resists for EUVL, 90511W (27 March 2014); doi: 10.1117/12.2041907