30th European Mask and Lithography Conference
Editor(s): Uwe F. W. Behringer
24-25 June 2014
Dresden, Germany
Front Matter: Volume 9231
Proc. SPIE 9231, Front Matter: Volume 9231, 923101 (17 October 2014);
Plenary Session I
Plenary Session II
Proc. SPIE 9231, EUV lithography: progress, challenges, and outlook, 923103 (17 October 2014);
Proc. SPIE 9231, 28nm node process optimization: a lithography centric view, 923104 (17 October 2014);
Mask Writing Time Optimization
Proc. SPIE 9231, Reticles, write time, and the need for speed, 923106 (17 October 2014);
Proc. SPIE 9231, Writing time estimation of EB mask writer EBM-9000 for hp16nm/logic11nm node generation , 923107 (17 October 2014);
EUV Lithography
Proc. SPIE 9231, Imaging performance and challenges of 10nm and 7nm logic nodes with 0.33 NA EUV, 923108 (17 October 2014);
Proc. SPIE 9231, Scanner arc illumination and impact on EUV photomasks and scanner imaging , 923109 (17 October 2014);
EUV Mask Technology
Proc. SPIE 9231, High-throughput parallel SPM for metrology, defect, and mask inspection, 92310B (17 October 2014);
E-Beam Technologies
Proc. SPIE 9231, New LEEPL technology, 92310D (17 October 2014);
Proc. SPIE 9231, Multi-stencil character projection e-beam lithography: a fast and flexible way for high quality optical metamaterials, 92310E (17 October 2014);
Proc. SPIE 9231, Integration of e-beam direct write in BEOL processes of 28nm SRAM technology node using mix and match, 92310F (17 October 2014);
Templates Technologies
Proc. SPIE 9231, Replicating micro-optical structures using soft embossing technique, 92310H (17 October 2014);
Proc. SPIE 9231, Aerial image simulation for partial coherent system with programming development in MATLAB, 92310J (17 October 2014);
Proc. SPIE 9231, Photomask CD and LER characterization using Mueller matrix spectroscopic ellipsometry, 92310L (17 October 2014);
Proc. SPIE 9231, Determination of line profiles on photomasks using DUV, EUV, and x-ray scattering, 92310M (17 October 2014);
Wafer Processing
Proc. SPIE 9231, Overlay leaves litho: impact of non-litho processes on overlay and compensation, 92310O (17 October 2014);
Proc. SPIE 9231, Lithography with infrared illumination alignment for advanced BiCMOS backside processing, 92310P (17 October 2014);
DSA Technology and Alternative Lithography
Proc. SPIE 9231, Compact model experimental validation for grapho-epitaxy hole processes and its impact in mask making tolerances, 92310Q (17 October 2014);
Proc. SPIE 9231, Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy, 92310R (17 October 2014);
Proc. SPIE 9231, Impact of mask absorber and quartz over-etch on mask 3D induced best focus shifts, 92310S (17 October 2014);
Proc. SPIE 9231, Challenges and opportunities in applying grapho-epitaxy DSA lithography to metal cut and contact/via applications, 92310T (17 October 2014);
Processes and Special Technologies
Proc. SPIE 9231, Innovative and water based stripping approach for thick and bulk photoresists, 92310U (17 October 2014);
Proc. SPIE 9231, How holistic process control translates into high mix logic fab APC?, 92310V (17 October 2014);
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