Front Matter: Volume 9235
Proc. SPIE 9235, Front Matter: Volume 9235, 923501 (29 October 2014); doi: 10.1117/12.2081279
Simulation, OPC, and Mask Data Prep I
Proc. SPIE 9235, Layout compliance for triple patterning lithography: an iterative approach, 923504 (8 October 2014); doi: 10.1117/12.2066034
Proc. SPIE 9235, Double-patterning optimization in 20nm SRAM design, 923505 (16 September 2014); doi: 10.1117/12.2066262
Proc. SPIE 9235, Pattern-based pre-OPC operation to improve model-based OPC runtime, 923506 (8 October 2014); doi: 10.1117/12.2068998
Proc. SPIE 9235, Conducting OPC retargeting as guided by principles of classical dynamics, 923507 (8 October 2014); doi: 10.1117/12.2067814
Simulation, OPC, and Mask Data Prep II
Proc. SPIE 9235, Trends in mask data preparation, 923508 (8 October 2014); doi: 10.1117/12.2073368
Proc. SPIE 9235, Model-based virtual VSB mask writer verification for efficient mask error checking and optimization prior to MDP, 923509 (8 October 2014); doi: 10.1117/12.2069613
Proc. SPIE 9235, Mask model calibration for MPC applications utilizing shot dose assignment, 92350A (8 October 2014); doi: 10.1117/12.2069617
Proc. SPIE 9235, Automated hotspot analysis with aerial image CD metrology for advanced logic devices , 92350B (16 September 2014); doi: 10.1117/12.2065937
Proc. SPIE 9235, OPC-Lite for gridded designs at low k1, 92350C (16 September 2014); doi: 10.1117/12.2069353
Materials and Process I
Proc. SPIE 9235, Plasma technology for advanced quartz mask etching, 92350D (8 October 2014); doi: 10.1117/12.2073069
Proc. SPIE 9235, Increasing efficiency and effectiveness of processes related to airborne particles in reticle mask environments, 92350E (16 September 2014); doi: 10.1117/12.2066378
Proc. SPIE 9235, Performance of GFIS mask repair system for various mask materials, 92350F (21 October 2014); doi: 10.1117/12.2069435
Proc. SPIE 9235, Defects caused by blank masks and repair solution with nanomachining for 20nm node, 92350G (16 September 2014); doi: 10.1117/12.2066278
Metrology: Joint Session with Photomask and Scanning Microscopies
Proc. SPIE 9235, Intra-field CDU map correlation between SEMs and aerial image characterization, 92350I (16 September 2014); doi: 10.1117/12.2066173
EUV Mask I
Proc. SPIE 9235, Imaging impact of multilayer tuning in EUV masks, experimental validation, 92350J (15 October 2014); doi: 10.1117/12.2066222
Proc. SPIE 9235, A broader view on EUV-masks: adding complementary imaging modes to the SHARP microscope, 92350K (8 October 2014); doi: 10.1117/12.2065513
Proc. SPIE 9235, Phase-enhanced defect sensitivity for EUV mask inspection, 92350L (8 October 2014); doi: 10.1117/12.2069291
Proc. SPIE 9235, Capability of particle inspection on patterned EUV mask using model EBEYE M, 92350M (16 September 2014); doi: 10.1117/12.2069161
Proc. SPIE 9235, AIMS EUV first light imaging performance, 92350N (29 October 2014); doi: 10.1117/12.2068308
Materials and Process II
Proc. SPIE 9235, Negative tone development process for ArF immersion extension, 92350O (8 October 2014); doi: 10.1117/12.2072470
Proc. SPIE 9235, Characterization of a new polarity switching negative tone e-beam resist for 14nm and 10nm logic node mask fabrication and beyond, 92350P (17 October 2014); doi: 10.1117/12.2069031
Proc. SPIE 9235, Increasing reticle inspection efficiency and reducing wafer printchecks at 14nm using automated defect classification and simulation, 92350Q (20 October 2014); doi: 10.1117/12.2070256
Proc. SPIE 9235, Bringing mask repair to the next level, 92350R (17 October 2014); doi: 10.1117/12.2072474
Proc. SPIE 9235, Laser-written binary OMOG photomasks for high-volume non-critical 193-nm photolithographic layers, 92350S (8 October 2014); doi: 10.1117/12.2059622
Simulation, OPC, and Mask Data Prep III
Proc. SPIE 9235, MDP challenges from a software provider's perspective, 92350T (8 October 2014); doi: 10.1117/12.2070163
Proc. SPIE 9235, Effective corner rounding correction in the data preparation for electron beam lithography, 92350U (8 October 2014); doi: 10.1117/12.2066156
Proc. SPIE 9235, Photonic curvilinear data processing, 92350V (29 October 2014); doi: 10.1117/12.2069335
Mask Patterning
Proc. SPIE 9235, Mask data processing in the era of multibeam writers, 92350W (21 October 2014); doi: 10.1117/12.2072135
Proc. SPIE 9235, EBM-9000: EB mask writer for product mask fabrication of 16nm half-pitch generation and beyond, 92350X (17 October 2014); doi: 10.1117/12.2065551
Proc. SPIE 9235, Study of heating effect in multi-beam mask writing, 92350Y (16 September 2014); doi: 10.1117/12.2065930
Proc. SPIE 9235, Resist charging effect correction function qualification for photomasks production, 92350Z (8 October 2014); doi: 10.1117/12.2066126
EUV Mask II
Proc. SPIE 9235, EUV mask black border evolution, 923513 (8 October 2014); doi: 10.1117/12.2070047
Proc. SPIE 9235, The feasibility of EUV lithography for printing circuits with 4 nm feature size, 923514 (8 October 2014); doi: 10.1117/12.2069376
EUV Mask III
Proc. SPIE 9235, Capability of etched multilayer EUV mask fabrication, 923515 (16 September 2014); doi: 10.1117/12.2067892
Proc. SPIE 9235, Repairing native defects on EUV mask blanks, 923516 (8 October 2014); doi: 10.1117/12.2069787
Proc. SPIE 9235, Carbon removal from trenches on EUV reticles, 923517 (8 October 2014); doi: 10.1117/12.2066471
Proc. SPIE 9235, The study on EUV mask cleaning without Ru surface damage, 923518 (21 October 2014); doi: 10.1117/12.2070235
Poster Session: EUV Mask
Proc. SPIE 9235, Effect of amplitude roughness on EUV mask specifications, 92351A (8 October 2014); doi: 10.1117/12.2069073
Proc. SPIE 9235, Impact of B4C capping layer for EUV mask on the sensitivity of patterned mask inspection using projection electron microscope, 92351B (8 October 2014); doi: 10.1117/12.2065655
Proc. SPIE 9235, Recent results from EUVL patterned mask inspection using projection electron microscope system, 92351C (29 October 2014); doi: 10.1117/12.2066134
Proc. SPIE 9235, Determination of line profiles on nano-structured surfaces using EUV and x-ray scattering, 92351D (30 September 2014); doi: 10.1117/12.2066165
Proc. SPIE 9235, Particle reduction and control in EUV etching process, 92351E (17 October 2014); doi: 10.1117/12.2066297
Proc. SPIE 9235, A new mask exposure and analysis facility, 92351F (8 October 2014); doi: 10.1117/12.2083713
Poster Session: Business
Proc. SPIE 9235, A reusable framework for data-mining mask shop tools, 92351G (8 October 2014); doi: 10.1117/12.2065574
Poster Session: Inspection
Proc. SPIE 9235, Phase defect detection signal analysis: dependence of defect size variation, 92351H (8 October 2014); doi: 10.1117/12.2068370
Proc. SPIE 9235, Best-practice evaluation-methods for wafer-fab photomask-requalification inspection tools, 92351I (8 October 2014); doi: 10.1117/12.2068466
Proc. SPIE 9235, Automatic classification of blank substrate defects, 92351J (17 October 2014); doi: 10.1117/12.2069678
Proc. SPIE 9235, Study of high sensitivity DUV inspection for sub-20nm devices with complex OPCs, 92351K (8 October 2014); doi: 10.1117/12.2076308
Poster Session: Material and Process
Proc. SPIE 9235, Development and characterization of advanced phase-shift mask blanks for 14nm node and beyond, 92351L (8 October 2014); doi: 10.1117/12.2066112
Proc. SPIE 9235, New grade of 9-inch size mask blanks for 450mm wafer process, 92351M (8 October 2014); doi: 10.1117/12.2066075
Proc. SPIE 9235, The feasibility of the additional process for improving pattern collapse in develop process, 92351N (8 October 2014); doi: 10.1117/12.2066279
Poster Session: Metrology
Proc. SPIE 9235, Further beyond: registration and overlay control enhancements for optical masks, 92351P (29 October 2014); doi: 10.1117/12.2066145
Proc. SPIE 9235, A method of utilizing AIMS to quantify lithographic performance of high transmittance mask, 92351R (29 October 2014); doi: 10.1117/12.2066283
Proc. SPIE 9235, On the benefit of high resolution and low aberrations for in-die mask registration metrology, 92351S (17 October 2014); doi: 10.1117/12.2069925
Poster Session: Mask Data Preparation
Proc. SPIE 9235, Using rule-based shot dose assignment in model-based MPC applications, 92351T (17 October 2014); doi: 10.1117/12.2069677