Front Matter Vol. 9423
Proc. SPIE 9423, Front Matter: Volume 9423, 942301 (21 April 2015); doi: 10.1117/12.2192291
Keynote Session
Proc. SPIE 9423, Graphoepitaxial and chemoepitaxial methods for creating line-space patterns at 33nm pitch: comparison to a HVM process, 942304 (19 March 2015); doi: 10.1117/12.2086693
DSA Process and Integration
Proc. SPIE 9423, Implementation of templated DSA for via layer patterning at the 7nm node, 942305 (19 March 2015); doi: 10.1117/12.2086090
Proc. SPIE 9423, Directed self-assembly (DSA) grapho-epitaxy template generation with immersion lithography, 942306 (19 March 2015); doi: 10.1117/12.2085850
Proc. SPIE 9423, Customization and design of directed self-assembly using hybrid prepatterns, 942307 (19 March 2015); doi: 10.1117/12.2086973
Proc. SPIE 9423, Understanding of PS-b-PMMA phase segregation under laser-induced millisecond thermal annealing, 942309 (19 March 2015); doi: 10.1117/12.2086057
UV-NIL for IC Manufacturing
Proc. SPIE 9423, Nanoimprint system development and status for high volume semiconductor manufacturing, 94230C (19 March 2015); doi: 10.1117/12.2087017
Proc. SPIE 9423, HVM readiness of nanoimprint lithography templates: defects, CD, and overlay, 94230D (19 March 2015); doi: 10.1117/12.2175483
Scanning Probe Lithography
Proc. SPIE 9423, Advanced electric-field scanning probe lithography on molecular resist using active cantilever, 94230E (17 March 2015); doi: 10.1117/12.2085846
Proc. SPIE 9423, Optimization of near-field scanning optical lithography, 94230F (19 March 2015); doi: 10.1117/12.2086073
Novel Lithography and Applications
Proc. SPIE 9423, Pattern transfer into silicon using sub-10 nm masks made by electron beam induced deposition, 94230I (19 March 2015); doi: 10.1117/12.2085763
Proc. SPIE 9423, Fabrication of functional electromechanical nanowire resonators by focused ion-beam (FIB) implantation, 94230K (19 March 2015); doi: 10.1117/12.2085818
Metrology and Inspection for Directed Self-Assembly: Joint Session with Conferences 9423 and 9424
Proc. SPIE 9423, Defect mitigation and root cause studies in IMEC's 14nm half-pitch chemo-epitaxy DSA flow, 94230M (19 March 2015); doi: 10.1117/12.2085889
DSA Materials and Processes I: Joint Session with Conferences 9425 and 9423
Proc. SPIE 9423, Impact of materials selection on graphoepitaxial directed self-assembly for line-space patterning, 94230N (27 March 2015); doi: 10.1117/12.2085807
Proc. SPIE 9423, Imprint directed self-assembly of cylinder-forming Si-containing block copolymer for 6nm half-pitch line patterning, 94230O (19 March 2015); doi: 10.1117/12.2085986
DSA Materials and Processes II: Joint Session with Conferences 9425 and 9423
Proc. SPIE 9423, Toward high-performance quality meeting IC device manufacturing requirements with AZ SMART DSA process, 94230R (19 March 2015); doi: 10.1117/12.2086160
Proc. SPIE 9423, Fin formation using graphoepitaxy DSA for FinFET device fabrication, 94230S (19 March 2015); doi: 10.1117/12.2086053
Nanoimprint Lithography: Non-IC Applications
Proc. SPIE 9423, Development of NIL processes for PV applications, 94230U (19 March 2015); doi: 10.1117/12.2085754
Proc. SPIE 9423, Shape change of cured 2D and 3D nanostructures from imprint lithography, 94230W (15 April 2015); doi: 10.1117/12.2186050
Multibeam Lithography
Proc. SPIE 9423, Thermal effect induced wafer deformation in high-energy e-beam lithography, 942310 (19 March 2015); doi: 10.1117/12.2085100
Proc. SPIE 9423, Comparison between e-beam direct write and immersion lithography for 20nm node, 942311 (19 March 2015); doi: 10.1117/12.2085500
Proc. SPIE 9423, Alternative stitching method for massively parallel e-beam lithography, 942312 (19 March 2015); doi: 10.1117/12.2085292
Proc. SPIE 9423, Development of ballistic hot electron emitter and its applications to parallel processing: active-matrix massive direct-write lithography in vacuum and thin films deposition in solutions, 942313 (19 March 2015); doi: 10.1117/12.2085782
DSA Line and via Patterning
Proc. SPIE 9423, Self-aligned line-space pattern customization with directed self-assembly graphoepitaxy at 24nm pitch, 942314 (19 March 2015); doi: 10.1117/12.2084845
Proc. SPIE 9423, Impact of BCP asymmetry on DSA patterning performance, 942315 (19 March 2015); doi: 10.1117/12.2085885
Proc. SPIE 9423, Directed self-assembly lithography using coordinated line epitaxy (COOL) process, 942316 (19 March 2015); doi: 10.1117/12.2085697
Proc. SPIE 9423, Template affinity role in CH shrink by DSA planarization, 942317 (19 March 2015); doi: 10.1117/12.2085819
Proc. SPIE 9423, Cross-sectional imaging of directed self-assembly block copolymers, 942318 (19 March 2015); doi: 10.1117/12.2087569
Electron-Beam Applications
Proc. SPIE 9423, Massively parallel E-beam inspection: enabling next-generation patterned defect inspection for wafer and mask manufacturing, 942319 (19 March 2015); doi: 10.1117/12.2175535
Proc. SPIE 9423, Fabrication of NIL templates and diffractive optical elements using the new Vistec SB4050 VSB e-beam writer, 94231A (19 March 2015); doi: 10.1117/12.2086610
Proc. SPIE 9423, Verification of E-Beam direct write integration into 28nm BEOL SRAM technology, 94231B (19 March 2015); doi: 10.1117/12.2087612
Proc. SPIE 9423, Ready for multi-beam exposure at 5kV on MAPPER tool: lithographic and process integration performances of advanced resists/stack, 94231C (19 March 2015); doi: 10.1117/12.2085915
Proc. SPIE 9423, Contour-based kernel modeling and verification for E-Beam lithography, 94231D (19 March 2015); doi: 10.1117/12.2085099
DSA Design for Manufacturability: Joint Session with Conferences 9423, 9426, and 9427
Proc. SPIE 9423, Verification of directed self-assembly (DSA) guide patterns through machine learning, 94231E (19 March 2015); doi: 10.1117/12.2085644
Proc. SPIE 9423, Experimental study of sub-DSA resolution assist features (SDRAF), 94231F (19 March 2015); doi: 10.1117/12.2085866
Proc. SPIE 9423, DSA-aware assist features, 94231G (19 March 2015); doi: 10.1117/12.2085954
DSA Modeling
Proc. SPIE 9423, Advantages and limitations of density functional theory in block copolymer directed self-assembly, 94231I (19 March 2015); doi: 10.1117/12.2085666
Proc. SPIE 9423, Effect of chemoepitaxial guiding underlayer design on the pattern quality and shape of aligned lamellae for fabrication of line-space patterns, 94231J (19 March 2015); doi: 10.1117/12.2085526
Proc. SPIE 9423, The effects of geometry and chemistry of nanopatterned substrates on the directed self-assembly of block-copolymer melts, 94231K (6 April 2015); doi: 10.1117/12.2085987
Proc. SPIE 9423, Effect of χN and underlayer composition on self-assembly of thins films of block copolymers with energy asymmetric blocks, 94231L (19 March 2015); doi: 10.1117/12.2086047
Poster Session: Nanoimprint Lithography
Proc. SPIE 9423, Negative e-beam resists using for nano-imprint lithography and silicone mold fabrication, 94231M (19 March 2015); doi: 10.1117/12.2075381
Proc. SPIE 9423, Advanced nano lithography via soft materials-derived and reversible nano-patterning methodology for molding of infrared nano lenses, 94231N (19 March 2015); doi: 10.1117/12.2080980
Poster Session: Electron-Beam Lithography and Applications
Proc. SPIE 9423, An instruction-based high-throughput lossless decompression algorithm for e-beam direct-write system, 94231P (19 March 2015); doi: 10.1117/12.2085278
Proc. SPIE 9423, "Fast" and "thick" e-beam resists exposed with multi-beam tool at 5 keV for implants and mature nodes: experimental and simulated model study, 94231Q (19 March 2015); doi: 10.1117/12.2085832
Poster Session: Novel Lithography and Applications
Proc. SPIE 9423, Electric-field assisted assembly of core-shell nanoparticle arrays for contact hole patterning, 94231U (19 March 2015); doi: 10.1117/12.2087547
Proc. SPIE 9423, Photo-induced large-scale circular surface-relief diffraction gratings on azo-glass, 94231V (19 March 2015); doi: 10.1117/12.2076368
Proc. SPIE 9423, Solid immersion optical lithography: tuning the prism/sample interface for improved ultra high-NA, high aspect ratio resist patterns over large exposure fields, 94231W (19 March 2015); doi: 10.1117/12.2175627
Posters: Directed Self-Assembly
Proc. SPIE 9423, Computational analysis of hole placement errors for directed self-assembly, 94231X (19 March 2015); doi: 10.1117/12.2085084
Proc. SPIE 9423, Coarse-grained molecular dynamics modeling of the kinetics of lamellar BCP defect annealing, 94231Y (19 March 2015); doi: 10.1117/12.2085518
Proc. SPIE 9423, Directed self-assembly of diblock copolymers in cylindrical confinement: effect of underfilling and air-polymer interactions on configurations, 94231Z (19 March 2015); doi: 10.1117/12.2085639
Proc. SPIE 9423, Tilting of lamellar domains on neutral random copolymer brushes, 942320 (19 March 2015); doi: 10.1117/12.2085676
Proc. SPIE 9423, Mapping self-assembled dots and line arrays by image analysis for quantification of defect density and alignment, 942322 (27 March 2015); doi: 10.1117/12.2085748
Proc. SPIE 9423, 193i lithography for contact doubling with grapho-epitaxy DSA: a simulation study, 942324 (27 March 2015); doi: 10.1117/12.2085822
Proc. SPIE 9423, Nanomechanical properties of solvent cast PS and PMMA polymer blends and block co-polymers, 942325 (27 March 2015); doi: 10.1117/12.2085829