Proceedings Volume 9777 is from: Logo
SPIE ADVANCED LITHOGRAPHY
21-25 February 2016
San Jose, California, United States
Front Matter: Volume 9777
Proc. SPIE 9777, Front Matter: Volume 9777, 977701 (22 June 2016); doi: 10.1117/12.2240686
Keynote Session
Proc. SPIE 9777, Lithography alternatives meet design style reality: How do they "line" up?, 977702 (22 March 2016); doi: 10.1117/12.2224685
Nanoimprint Lithography Production Readiness
Proc. SPIE 9777, Nanoimprint system development and status for high-volume semiconductor manufacturing, 977706 (22 March 2016); doi: 10.1117/12.2219001
Proc. SPIE 9777, Design for nanoimprint lithography: total layout refinement utilizing NIL process simulation, 977708 (22 March 2016); doi: 10.1117/12.2219052
Nanoimprint Modeling, Processing, and Materials
Proc. SPIE 9777, High throughput Jet and Flash Imprint Lithography for semiconductor memory applications, 97770A (22 March 2016); doi: 10.1117/12.2219161
Proc. SPIE 9777, NIL defect performance toward high volume mass production, 97770B (22 March 2016); doi: 10.1117/12.2218972
Proc. SPIE 9777, Defectivity and particle reduction for mask life extension, and imprint mask replication for high-volume semiconductor manufacturing, 97770C (22 March 2016); doi: 10.1117/12.2219036
Proc. SPIE 9777, Experiments towards establishing of design rules for R2R-UV-NIL with polymer working shims, 97770D (22 March 2016); doi: 10.1117/12.2218134
Proc. SPIE 9777, Defectivity prediction for droplet-dispensed UV nanoimprint lithography, enabled by fast simulation of resin flow at feature, droplet, and template scales, 97770E (22 March 2016); doi: 10.1117/12.2218757
DSA Line-Space Patterning
Proc. SPIE 9777, Pattern fidelity improvement of chemo-epitaxy DSA process for high-volume manufacturing, 97770F (22 March 2016); doi: 10.1117/12.2218595
Proc. SPIE 9777, DSA materials contributions to the defectivity performance of 14nm half-pitch LiNe flow at IMEC, 97770G (22 March 2016); doi: 10.1117/12.2219936
Proc. SPIE 9777, Sub-15nm patterning technology using directed self-assembly on nano-imprinting guide, 97770K (4 April 2016); doi: 10.1117/12.2219141
DSA Via Patterning
Proc. SPIE 9777, New placement estimator for contact hole printed with DSA, 97770M (22 March 2016); doi: 10.1117/12.2219015
Proc. SPIE 9777, Directed Self Assembly (DSA) compliant flow with immersion lithography: from material to design and patterning, 97770N (22 March 2016); doi: 10.1117/12.2219505
Proc. SPIE 9777, Investigation of coat-develop track system for placement error of contact hole shrink process, 97770O (1 April 2016); doi: 10.1117/12.2219925
Proc. SPIE 9777, Manufacturability of dense hole arrays with directed self-assembly using the CHIPS flow, 97770P (22 March 2016); doi: 10.1117/12.2219261
DSA Process and Integration: Joint Session with Conferences 9777 and 9779
Proc. SPIE 9777, DSA patterning options for FinFET formation at 7nm node, 97770R (22 March 2016); doi: 10.1117/12.2219670
Proc. SPIE 9777, Process highlights to enhance DSA contact patterning performances, 97770T (22 March 2016); doi: 10.1117/12.2219210
DSA Modeling and Design
Proc. SPIE 9777, Shape optimization for DSA, 97770Y (22 March 2016); doi: 10.1117/12.2218515
Proc. SPIE 9777, Modeling and parameter tuning for templated directed self-assembly, 97770Z (22 March 2016); doi: 10.1117/12.2219158
Proc. SPIE 9777, Virtual fabrication using directed self-assembly for process optimization in a 14nm DRAM, 977710 (22 March 2016); doi: 10.1117/12.2218935
Direct-Write E-Beam Lithography
Proc. SPIE 9777, Development of a MEMS electrostatic condenser lens array for nc-Si surface electron emitters of the Massive Parallel Electron Beam Direct-Write system, 977712 (22 March 2016); doi: 10.1117/12.2219338
Proc. SPIE 9777, Non-CAR resists and advanced materials for Massively Parallel E-Beam Direct Write process integration, 977713 (22 March 2016); doi: 10.1117/12.2218884
Proc. SPIE 9777, Complete data preparation flow for Massively Parallel E-Beam lithography on 28nm node full-field design, 977714 (22 March 2016); doi: 10.1117/12.2219178
Proc. SPIE 9777, Requirements of the e-beam shot quality for mask patterning of the sub-1X device, 977716 (22 March 2016); doi: 10.1117/12.2218340
Proc. SPIE 9777, Prediction of positioning error in EB lithography, 977717 (22 March 2016); doi: 10.1117/12.2218252
Novel Lithography and Alternative Patterning I
Proc. SPIE 9777, A paradigm shift in patterning foundation from frequency multiplication to edge-placement accuracy: a novel processing solution by selective etching and alternating-material self-aligned multiple patterning, 977718 (22 March 2016); doi: 10.1117/12.2218874
Proc. SPIE 9777, Contact hole patterning by electric-field assisted assembly of core-shell nanoparticles, 977719 (22 March 2016); doi: 10.1117/12.2219503
Novel Lithography and Alternative Patterning II
Proc. SPIE 9777, Enhanced patterning by tilted ion implantation, 97771B (22 March 2016); doi: 10.1117/12.2218793
Proc. SPIE 9777, Exploring the potential of Multiphoton Laser Ablation Lithography (MP-LAL) as a reliable technique for sub-50nm patterning, 97771C (22 March 2016); doi: 10.1117/12.2218864
Proc. SPIE 9777, Design and fabrication of electrostatic microcolumn in multiple electron-beam lithography, 97771D (22 March 2016); doi: 10.1117/12.2219218
Proc. SPIE 9777, Dots-on-the-fly electron beam lithography, 97771E (22 March 2016); doi: 10.1117/12.2219136
Poster Session: NIL
Proc. SPIE 9777, Nanoimprint lithography using disposable biomass template, 97771G (1 April 2016); doi: 10.1117/12.2217483
Proc. SPIE 9777, Nano-imprint lithography using poly (methyl methacrylate) (PMMA) and polystyrene (PS) polymers, 97771H (1 April 2016); doi: 10.1117/12.2218594
Proc. SPIE 9777, Improvement of sub-20nm pattern quality with dose modulation technique for NIL template production, 97771I (1 April 2016); doi: 10.1117/12.2218809
Poster Session: Alt-Litho
Proc. SPIE 9777, Resist roughness improvement by a chemical shrink process, 97771J (1 April 2016); doi: 10.1117/12.2218402
Proc. SPIE 9777, Nanoscale patterning in ambient conditions using liquid electromigration, 97771L (1 April 2016); doi: 10.1117/12.2219024
Proc. SPIE 9777, Deep-UV interference lithography combined with masked contact lithography for pixel wiregrid patterns, 97771N (1 April 2016); doi: 10.1117/12.2219484
Poster Session: DSA
Proc. SPIE 9777, Control of morphological defects at the boundary between the periodic and non-periodic patterns in directed self-assembly process, 97771O (1 April 2016); doi: 10.1117/12.2218234
Proc. SPIE 9777, Directed self-assembly of Si-containing and topcoat free block copolymer, 97771P (1 April 2016); doi: 10.1117/12.2218243
Proc. SPIE 9777, Numerical placement analysis in hole multiplication patterns for directed self-assembly, 97771Q (1 April 2016); doi: 10.1117/12.2218596
Proc. SPIE 9777, Grapho-epitaxial sub-10nm line and space patterning using lamellar-forming Si-containing block copolymer, 97771S (1 April 2016); doi: 10.1117/12.2218758
Proc. SPIE 9777, Sub-10nm lines and spaces patterning using grapho-epitaxial directed self-assembly of lamellar block copolymers, 97771T (1 April 2016); doi: 10.1117/12.2218787
Proc. SPIE 9777, Strategies to enable directed self-assembly contact hole shrink for tight pitches, 97771U (1 April 2016); doi: 10.1117/12.2219213
Proc. SPIE 9777, Chemoepitaxial guiding underlayers for density asymmetric and energetically asymmetric diblock copolymers, 97771V (1 April 2016); doi: 10.1117/12.2219255
Proc. SPIE 9777, A route for industry compatible directed self-assembly of high-chi PS-PDMS block copolymers, 97771W (1 April 2016); doi: 10.1117/12.2219312
Proc. SPIE 9777, Improved cost-effectiveness of the block co-polymer anneal process for DSA, 97771Z (1 April 2016); doi: 10.1117/12.2220043
Proc. SPIE 9777, Reversible nano-lithography for commercial approaches, 977723 (1 April 2016); doi: 10.1117/12.2205065
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