Engineering scalable in-plane semiconductor lasers for high volume manufacturing

Andrew Clark; Andrew Johnson; Matthew Geen; Mark Furlong; Rodney Pelzel

doi:10.1117/12.2668434

17 March 2023 Engineering scalable in-plane semiconductor lasers for high volume manufacturing

Andrew Clark, Andrew Johnson, Matthew Geen, Mark Furlong, Rodney Pelzel

Author Affiliations +

Proceedings Volume PC12440, Novel In-Plane Semiconductor Lasers XXII; PC1244008 (2023) https://doi.org/10.1117/12.2668434
Event: SPIE OPTO, 2023, San Francisco, California, United States

Abstract

Long wavelength quantum dot in plane lasers have been scaled to both high volume and the larger 200mm GaAs substrates. Scaling to 300mm on a silicon platform has also been achieved. All wafers are grown on production-ready MBE platforms. Other material systems such as InGaAs and dilute nitride have been similarly scaled often by going back to first principle of process design in conjunction with substrate engineering. The main drivers for this transition to high volume are the need to integrate compound semiconductors with silicon foundries for not only data communications but other applications like automotive sensing and health care.

Conference Presentation

Citation Download Citation

Andrew Clark, Andrew Johnson, Matthew Geen, Mark Furlong, and Rodney Pelzel "Engineering scalable in-plane semiconductor lasers for high volume manufacturing", Proc. SPIE PC12440, Novel In-Plane Semiconductor Lasers XXII, PC1244008 (17 March 2023); https://doi.org/10.1117/12.2668434

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