Silicon Photonics has emerged as the leading technology platform for high-speed, high density, and low power optical interconnects addressing hyperscale datacenter, high-performance computing, mobile and enterprise applications. Advanced 3D integration using through silicon vías (TSVs) for low parasitic interconnection and power delivery, along with high throughput, submicron waveguide to optical fiber attachment and laser integration will be essential to enable higher data rate per lane interconnects in Tbps optical transceivers on the horizon. In this paper, we will review trends in photonics packaging architecture for scale up and scale out of optical interconnects, critical technology challenges and path to technology adoption for high volume productization.
|