A Process Evaluation Of Gaf Microline Photoresist - PR 102

Chris Ladas

doi:10.1117/12.954242

1 March 1974 A Process Evaluation Of Gaf Microline Photoresist - PR 102

Chris Ladas

Author Affiliations +

Proceedings Volume 0055, Technological Advances in Micro and Submicro Photofabrication Imagery; (1974) https://doi.org/10.1117/12.954242
Event: Acquisition and Analysis of Pictorial Data, 1974, San Diego, United States

Abstract

Increasing demands for minimizing defect density in wafer processing have resulted in a significant emphasis on non-contact printing of the photoresist using either a proximity or projection mode of align-ment. Correspondingly, the need for shrinking geometry sizes to increase packing density and improve device performance is very important in coping with the complexity of LSI devices.

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Chris Ladas "A Process Evaluation Of Gaf Microline Photoresist - PR 102", Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974); https://doi.org/10.1117/12.954242

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