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1 March 1974 Industry-User Forum: Use Of Off-Contact Printing In The Microelectronics Industry
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While I was with Signetics, we successfully developed a process to effectively expose and align the wafers in proximity. This involved all layers of the masks. The MOS process was a P-channel, silicon gate. This resulted in a production line capacity of about 12,000 3" wafer outs per month. It wasn't until after the development stage that we went into full production with proximity and 3" wafers; because of this capability we were able to reduce mask costs and significantly increase dice yield. Now a lot of these things are nebulous because it depends on the particular process and the particular situation that you have, but we're judging this from a production environment. This all was an outgrowth of evaluating several types of masks including emulsion masks, iron oxide masks, chrome masks, and silicon masks. For our particular application the iron-oxide masks with a particular substrate was the best.
© (1974) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
George Koutures, Bill Converse, Karl Johannsmier, David Kuty, Chris Ladas, W. R. Livesay, Peter Moller, and Leonard Perham "Industry-User Forum: Use Of Off-Contact Printing In The Microelectronics Industry", Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974);


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